Vijay K. Nair

Person

Mesa, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Die with embedded communication cavity
- Patent number 11,978,948
- Issue date May 7, 2024
- Intel Corporation
- Vijay K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enclosure for an electronic component
- Patent number 11,488,880
- Issue date Nov 1, 2022
- Intel Corporation
- Vijay K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF front end module including hybrid filter and active circuits in...
- Patent number 11,456,721
- Issue date Sep 27, 2022
- Intel Corporation
- Feras Eid
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Microelectronic devices with high frequency communication modules h...
- Patent number 11,387,200
- Issue date Jul 12, 2022
- Intel Corporation
- Georgios C. Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices designed with efficient partitioning of hig...
- Patent number 11,367,708
- Issue date Jun 21, 2022
- Intel Corporation
- Vijay K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices designed with compound semiconductor device...
- Patent number 11,335,651
- Issue date May 17, 2022
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid filters and packages therefor
- Patent number 11,283,427
- Issue date Mar 22, 2022
- Intel Corporation
- Telesphor Kamgaing
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Die with embedded communication cavity
- Patent number 11,239,186
- Issue date Feb 1, 2022
- Intel Corporation
- Digvijay Raorane
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Hybrid filter architecture with integrated passives, acoustic wave...
- Patent number 11,206,008
- Issue date Dec 21, 2021
- Intel Corporation
- Georgios C. Dogiamis
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
High frequency waveguide structure
- Patent number 11,195,806
- Issue date Dec 7, 2021
- Intel Corporation
- Vijay K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with electromagnetic interference shielding u...
- Patent number 11,189,573
- Issue date Nov 30, 2021
- Intel Corporation
- Vijay K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die with embedded communication cavity
- Patent number 11,128,029
- Issue date Sep 21, 2021
- Intel Corporation
- Vijay K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate dielectric waveguides in semiconductor packages
- Patent number 11,037,892
- Issue date Jun 15, 2021
- Intel Corporation
- Vijay K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Piezoelectric package-integrated film bulk acoustic resonator devices
- Patent number 10,903,818
- Issue date Jan 26, 2021
- Intel Corporation
- Vijay K. Nair
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Piezoelectric package-integrated contour mode filter devices
- Patent number 10,897,238
- Issue date Jan 19, 2021
- Intel Corporation
- Feras Eid
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Microelectronic devices designed with integrated antennas on a subs...
- Patent number 10,887,439
- Issue date Jan 5, 2021
- Intel Corporation
- Telesphor Kamgaing
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Single layer low cost wafer level packaging for SFF SiP
- Patent number 10,867,961
- Issue date Dec 15, 2020
- Intel Corporation
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices with high frequency communication modules h...
- Patent number 10,629,551
- Issue date Apr 21, 2020
- Intel Corporation
- Georgios C. Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Piezoelectric package-integrated delay lines
- Patent number 10,594,294
- Issue date Mar 17, 2020
- Intel Corporation
- Adel A. Elsherbini
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Microelectronic devices designed with high frequency communication...
- Patent number 10,573,608
- Issue date Feb 25, 2020
- Intel Corporation
- Georgios C. Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices designed with efficient partitioning of hig...
- Patent number 10,546,835
- Issue date Jan 28, 2020
- Intel Corporation
- Vijay K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer package
- Patent number 10,535,634
- Issue date Jan 14, 2020
- Intel Corporation
- Vijay K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional small form factor system in package architecture
- Patent number 10,483,250
- Issue date Nov 19, 2019
- Intel Corporation
- Vijay K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems, methods, and apparatuses for implementing an organic stiff...
- Patent number 10,475,750
- Issue date Nov 12, 2019
- Intel Corporation
- Vijay K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices designed with high frequency communication...
- Patent number 10,439,671
- Issue date Oct 8, 2019
- Intel Corporation
- Telesphor Kamgaing
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Piezoelectric package-integrated crystal devices
- Patent number 10,432,167
- Issue date Oct 1, 2019
- Intel Corporation
- Adel A. Elsherbini
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Microelectronic devices designed with high frequency communication...
- Patent number 10,410,983
- Issue date Sep 10, 2019
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tunable radio frequency systems using piezoelectric package-integra...
- Patent number 10,291,283
- Issue date May 14, 2019
- Intel Corporation
- Telesphor Kamgaing
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method of embedding WLCSP components in E-WLB and E-PLB
- Patent number 10,147,710
- Issue date Dec 4, 2018
- Intel Corporation
- Vijay K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic nanocomposite materials and passive components formed ther...
- Patent number 10,122,089
- Issue date Nov 6, 2018
- Intel Corporation
- Vijay K. Nair
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC DEVICES DESIGNED WITH COMPOUND SEMICONDUCTOR DEVICE...
- Publication number 20220246554
- Publication date Aug 4, 2022
- Intel Corporation
- Telesphor KAMGAING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE WITH EMBEDDED COMMUNICATION CAVITY
- Publication number 20210391638
- Publication date Dec 16, 2021
- Intel Corporation
- Vijay K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES DESIGNED WITH INTEGRATED ANTENNAS ON A SUBS...
- Publication number 20200412858
- Publication date Dec 31, 2020
- Intel Corporation
- Georgios Dogiamis
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HYBRID FILTERS AND PACKAGES THEREFOR
- Publication number 20200287520
- Publication date Sep 10, 2020
- Intel Corporation
- Telesphor KAMGAING
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
HYBRID FILTER ARCHITECTURE WITH INTEGRATED PASSIVES, ACOUSTIC WAVE...
- Publication number 20200259478
- Publication date Aug 13, 2020
- Intel Corporation
- Georgios C. DOGIAMIS
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
MICROELECTRONIC DEVICES DESIGNED WITH INTEGRATED ANTENNA ON A SUBST...
- Publication number 20200236205
- Publication date Jul 23, 2020
- Intel Corporation
- Telesphor Kamgaing
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
RF FRONT END MODULE INCLUDING HYBRID FILTER AND ACTIVE CIRCUITS IN...
- Publication number 20200235716
- Publication date Jul 23, 2020
- Intel Corporation
- Feras EID
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
MICROELECTRONIC DEVICES WITH HIGH FREQUENCY COMMUNICATION MODULES H...
- Publication number 20200227366
- Publication date Jul 16, 2020
- Intel Corporation
- Georgios C. DOGIAMIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES DESIGNED WITH EFFICIENT PARTITIONING OF HIG...
- Publication number 20200219830
- Publication date Jul 9, 2020
- Intel Corporation
- Vijay K. NAIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT END SYSTEM HAVING AN ACOUSTIC WAVE RESONATOR (AWR) ON AN INTE...
- Publication number 20200219861
- Publication date Jul 9, 2020
- Intel Corporation
- Telesphor KAMGAING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARCHITECTURES AND METHODS OF FABRICATING 3D STACKED PACKAGES
- Publication number 20200126921
- Publication date Apr 23, 2020
- Intel Corporation
- Vijay K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCLOSURE FOR AN ELECTRONIC COMPONENT
- Publication number 20200098655
- Publication date Mar 26, 2020
- Intel Corporation
- Vijay K. NAIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC INTERFERENCE SHIELDING FOR SEMICONDUCTOR PACKAGES U...
- Publication number 20200075501
- Publication date Mar 5, 2020
- Intel Corporation
- Digvijay A. RAORANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE WITH EMBEDDED COMMUNICATION CAVITY
- Publication number 20200021007
- Publication date Jan 16, 2020
- Intel IP Corporation
- Vijay K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH FREQUENCY WAVEGUIDE STRUCTURE
- Publication number 20190267337
- Publication date Aug 29, 2019
- Intel Corporation
- Vijay K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE WITH EMBEDDED COMMUNICATION CAVITY
- Publication number 20190267336
- Publication date Aug 29, 2019
- Intel Corporation
- Digvijay Ashokkumar Raorane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS, METHODS, AND APPARATUSES FOR IMPLEMENTING AN ORGANIC STIFF...
- Publication number 20190051615
- Publication date Feb 14, 2019
- Intel Corporation
- Vijay K. NAIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING U...
- Publication number 20190019764
- Publication date Jan 17, 2019
- Intel Corporation
- Vijay K. NAIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES DESIGNED WITH EFFICIENT PARTITIONING OF HIG...
- Publication number 20180350772
- Publication date Dec 6, 2018
- Intel Corporation
- Vijay K. NAIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES WITH HIGH FREQUENCY COMMUNICATION MODULES H...
- Publication number 20180342472
- Publication date Nov 29, 2018
- Intel Corporation
- Georgios C. DOGIAMIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES DESIGNED WITH HIGH FREQUENCY COMMUNICATION...
- Publication number 20180331051
- Publication date Nov 15, 2018
- Intel Corporation
- Georgios C. DOGIAMIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES DESIGNED WITH INTEGRATED ANTENNAS ON A SUBS...
- Publication number 20180332151
- Publication date Nov 15, 2018
- Intel Corporation
- Telesphor KAMGAING
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MICROELECTRONIC DEVICES DESIGNED WITH HIGH FREQUENCY COMMUNICATION...
- Publication number 20180323159
- Publication date Nov 8, 2018
- Intel Corporation
- Telesphor KAMGAING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES DESIGNED WITH HIGH FREQUENCY COMMUNICATION...
- Publication number 20180316383
- Publication date Nov 1, 2018
- Intel Corporation
- Telesphor KAMGAING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES WITH EMBEDDED SUBSTRATE CAVITIES FOR DEVICE...
- Publication number 20180310399
- Publication date Oct 25, 2018
- Intel Corporation
- Vijay K. NAIR
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SINGLE LAYER LOW COST WAFER LEVEL PACKAGING FOR SFF SIP
- Publication number 20180301435
- Publication date Oct 18, 2018
- Intel Corporation
- Chuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SMALL FORM FACTOR SYSTEM IN PACKAGE ARCHITECTURE
- Publication number 20180286840
- Publication date Oct 4, 2018
- Intel Corporation
- Vijay K. NAIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF EMBEDDING WLCSP COMPONENTS IN E-WLB AND E-PLB
- Publication number 20180269190
- Publication date Sep 20, 2018
- Intel Corporation
- Vijay K. NAIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES DESIGNED WITH COMPOUND SEMICONDUCTOR DEVICE...
- Publication number 20180240762
- Publication date Aug 23, 2018
- Intel Corporation
- Telesphor KAMGAING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNABLE RADIO FREQUENCY SYSTEMS USING PIEZOELECTRIC PACKAGE-INTEGRA...
- Publication number 20170288724
- Publication date Oct 5, 2017
- Intel Corporation
- Telesphor KAMGAING
- H01 - BASIC ELECTRIC ELEMENTS

Vijay K. Nair

Person

Patents Grantslast 30 patents

Die with embedded communication cavity

Enclosure for an electronic component

RF front end module including hybrid filter and active circuits in...

Microelectronic devices with high frequency communication modules h...

Microelectronic devices designed with efficient partitioning of hig...

Microelectronic devices designed with compound semiconductor device...

Hybrid filters and packages therefor

Die with embedded communication cavity

Hybrid filter architecture with integrated passives, acoustic wave...

High frequency waveguide structure

Semiconductor package with electromagnetic interference shielding u...

Die with embedded communication cavity

Substrate dielectric waveguides in semiconductor packages

Piezoelectric package-integrated film bulk acoustic resonator devices

Piezoelectric package-integrated contour mode filter devices

Microelectronic devices designed with integrated antennas on a subs...

Single layer low cost wafer level packaging for SFF SiP

Microelectronic devices with high frequency communication modules h...

Piezoelectric package-integrated delay lines

Microelectronic devices designed with high frequency communication...

Microelectronic devices designed with efficient partitioning of hig...

Multi-layer package

Three-dimensional small form factor system in package architecture

Systems, methods, and apparatuses for implementing an organic stiff...

Microelectronic devices designed with high frequency communication...

Piezoelectric package-integrated crystal devices

Microelectronic devices designed with high frequency communication...

Tunable radio frequency systems using piezoelectric package-integra...

Method of embedding WLCSP components in E-WLB and E-PLB

Magnetic nanocomposite materials and passive components formed ther...

Patents Applicationslast 30 patents

MICROELECTRONIC DEVICES DESIGNED WITH COMPOUND SEMICONDUCTOR DEVICE...

DIE WITH EMBEDDED COMMUNICATION CAVITY

MICROELECTRONIC DEVICES DESIGNED WITH INTEGRATED ANTENNAS ON A SUBS...

HYBRID FILTERS AND PACKAGES THEREFOR

HYBRID FILTER ARCHITECTURE WITH INTEGRATED PASSIVES, ACOUSTIC WAVE...

MICROELECTRONIC DEVICES DESIGNED WITH INTEGRATED ANTENNA ON A SUBST...

RF FRONT END MODULE INCLUDING HYBRID FILTER AND ACTIVE CIRCUITS IN...

MICROELECTRONIC DEVICES WITH HIGH FREQUENCY COMMUNICATION MODULES H...

MICROELECTRONIC DEVICES DESIGNED WITH EFFICIENT PARTITIONING OF HIG...

FRONT END SYSTEM HAVING AN ACOUSTIC WAVE RESONATOR (AWR) ON AN INTE...

ARCHITECTURES AND METHODS OF FABRICATING 3D STACKED PACKAGES

ENCLOSURE FOR AN ELECTRONIC COMPONENT

ELECTROMAGNETIC INTERFERENCE SHIELDING FOR SEMICONDUCTOR PACKAGES U...

DIE WITH EMBEDDED COMMUNICATION CAVITY

HIGH FREQUENCY WAVEGUIDE STRUCTURE

DIE WITH EMBEDDED COMMUNICATION CAVITY

SYSTEMS, METHODS, AND APPARATUSES FOR IMPLEMENTING AN ORGANIC STIFF...

SEMICONDUCTOR PACKAGE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING U...

MICROELECTRONIC DEVICES DESIGNED WITH EFFICIENT PARTITIONING OF HIG...

MICROELECTRONIC DEVICES WITH HIGH FREQUENCY COMMUNICATION MODULES H...

MICROELECTRONIC DEVICES DESIGNED WITH HIGH FREQUENCY COMMUNICATION...

MICROELECTRONIC DEVICES DESIGNED WITH INTEGRATED ANTENNAS ON A SUBS...

MICROELECTRONIC DEVICES DESIGNED WITH HIGH FREQUENCY COMMUNICATION...

MICROELECTRONIC DEVICES DESIGNED WITH HIGH FREQUENCY COMMUNICATION...

MICROELECTRONIC DEVICES WITH EMBEDDED SUBSTRATE CAVITIES FOR DEVICE...

SINGLE LAYER LOW COST WAFER LEVEL PACKAGING FOR SFF SIP

THREE-DIMENSIONAL SMALL FORM FACTOR SYSTEM IN PACKAGE ARCHITECTURE

METHOD OF EMBEDDING WLCSP COMPONENTS IN E-WLB AND E-PLB

MICROELECTRONIC DEVICES DESIGNED WITH COMPOUND SEMICONDUCTOR DEVICE...

TUNABLE RADIO FREQUENCY SYSTEMS USING PIEZOELECTRIC PACKAGE-INTEGRA...