Vijay Sarihan

Person

Paradise Valley, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Package with low stress region for an electronic component
- Patent number 9,818,712
- Issue date Nov 14, 2017
- NXP USA, INC.
- Paige M. Holm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder pad for semiconductor device package
- Patent number 9,548,280
- Issue date Jan 17, 2017
- NXP USA, INC.
- Vijay Sarihan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for shielding MEMS structures during front side wafer dicing
- Patent number 9,458,012
- Issue date Oct 4, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Alan J. Magnus
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical systems (MEMS) devices with control circuits...
- Patent number 9,359,192
- Issue date Jun 7, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Philip H. Bowles
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package for high power integrated circuits and method for forming
- Patent number 8,148,206
- Issue date Apr 3, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Vijay Sarihan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a packaged semiconductor device having a ground...
- Patent number 8,080,444
- Issue date Dec 20, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Vijay Sarihan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radiation shielded module and method of shielding microelectronic d...
- Patent number 7,145,084
- Issue date Dec 5, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Vijay Sarihan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Under bump metallurgy structural design for high reliability bumped...
- Patent number 6,930,032
- Issue date Aug 16, 2005
- Freescale Semiconductor, Inc.
- Vijay Sarihan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor power device with shear stress compensation
- Patent number 6,888,246
- Issue date May 3, 2005
- FREESCALE SEMICONDUCTOR, INC.
- Lei L. Mercado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor power device and method of formation
- Patent number 6,646,347
- Issue date Nov 11, 2003
- Motorola, Inc.
- Lei L. Mercado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for an electronic component and a method of making it
- Patent number 6,309,908
- Issue date Oct 30, 2001
- Motorola, Inc.
- Vijay Sarihan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for stress relief in solder bump formation on...
- Patent number 6,077,726
- Issue date Jun 20, 2000
- Motorola, Inc.
- Addi Burjorji Mistry
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE WITH LOW STRESS REGION FOR AN ELECTRONIC COMPONENT
- Publication number 20160204089
- Publication date Jul 14, 2016
- FREESCALE SEMICONDUCTOR, INC.
- PAIGE M. HOLM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Pad for Semiconductor Device Package
- Publication number 20150287685
- Publication date Oct 8, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Vijay Sarihan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SHIELDING MEMS STRUCTURES DURING FRONT SIDE WAFER DICING
- Publication number 20150232332
- Publication date Aug 20, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Alan J. Magnus
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING A GROUND...
- Publication number 20110171782
- Publication date Jul 14, 2011
- Vijay Sarihan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic assembly and method for forming the same
- Publication number 20070200253
- Publication date Aug 30, 2007
- Bishnu P. Gogoi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor power device and method of formation
- Publication number 20030232493
- Publication date Dec 18, 2003
- Lei L. Mercado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Under bump metallurgy structural design for high reliability bumped...
- Publication number 20030214036
- Publication date Nov 20, 2003
- MOTOROLA INC.
- Vijay Sarihan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER DEVICE AND METHOD OF FORMATION
- Publication number 20030102563
- Publication date Jun 5, 2003
- Lei L. Mercado
- H01 - BASIC ELECTRIC ELEMENTS

Vijay Sarihan

Person

Patents Grantslast 30 patents

Package with low stress region for an electronic component

Solder pad for semiconductor device package

Method for shielding MEMS structures during front side wafer dicing

Microelectromechanical systems (MEMS) devices with control circuits...

Package for high power integrated circuits and method for forming

Method for forming a packaged semiconductor device having a ground...

Radiation shielded module and method of shielding microelectronic d...

Under bump metallurgy structural design for high reliability bumped...

Semiconductor power device with shear stress compensation

Semiconductor power device and method of formation

Package for an electronic component and a method of making it

Method and apparatus for stress relief in solder bump formation on...

Patents Applicationslast 30 patents

PACKAGE WITH LOW STRESS REGION FOR AN ELECTRONIC COMPONENT

Solder Pad for Semiconductor Device Package

METHOD FOR SHIELDING MEMS STRUCTURES DURING FRONT SIDE WAFER DICING

METHOD FOR FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING A GROUND...

Electronic assembly and method for forming the same

Semiconductor power device and method of formation

Under bump metallurgy structural design for high reliability bumped...

SEMICONDUCTOR POWER DEVICE AND METHOD OF FORMATION