Vijayakumar Ramachandrarao

Person

Portland, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Removal chemistry for selectively etching metal hard mask
- Patent number 8,080,475
- Issue date Dec 20, 2011
- Intel Corporation
- Vijayakumar SubramanyaRao RamachandraRao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cleaning residues from semiconductor structures
- Patent number 8,017,568
- Issue date Sep 13, 2011
- Intel Corporation
- Shan C. Clark
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Methods for the formation of interconnects separated by air gaps
- Patent number 7,977,228
- Issue date Jul 12, 2011
- Intel Corporation
- Vijayakumar S. Ramachandrarao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sealants for metal interconnect protection in microelectronic devic...
- Patent number 7,605,073
- Issue date Oct 20, 2009
- Intel Corporation
- Adrien R. Lavoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum incorporation in porous dielectric for improved mechanical...
- Patent number 7,422,020
- Issue date Sep 9, 2008
- Intel Corporation
- Vijayakumar Ramachandrarao
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Enhancing photoresist performance using electric fields
- Patent number 7,374,867
- Issue date May 20, 2008
- Intel Corporation
- Robert Bristol
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Sealing porous dielectric material using plasma-induced surface pol...
- Patent number 7,335,586
- Issue date Feb 26, 2008
- Intel Corporation
- Vijayakumar S. RamachandraRao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via etch process
- Patent number 7,303,648
- Issue date Dec 4, 2007
- Intel Corporation
- Hyun-Mog Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for wafer stacking using copper structures of substantially...
- Patent number 7,268,015
- Issue date Sep 11, 2007
- Intel Corporation
- Vijayakumar S. RamachandraRao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming thin hard mask over air gap or porous dielectric
- Patent number 7,238,604
- Issue date Jul 3, 2007
- Intel Corporation
- Grant M. Kloster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filling small dimension vias using supercritical carbon dioxide
- Patent number 7,233,068
- Issue date Jun 19, 2007
- Intel Corporation
- Vijayakumar S. Ramachandrarao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of patterning a porous dielectric material
- Patent number 7,220,668
- Issue date May 22, 2007
- Intel Corporation
- Hyun-Mog Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition of diffusion barrier
- Patent number 7,214,605
- Issue date May 8, 2007
- Intel Corporation
- Shriram Ramanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Replenishment of surface carbon and surface passivation of low-k po...
- Patent number 7,179,757
- Issue date Feb 20, 2007
- Intel Corporation
- Vijayakumar S. RamachandraRao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Supercritical carbon dioxide-based cleaning of metal lines
- Patent number 7,101,443
- Issue date Sep 5, 2006
- Intel Corporation
- Vijayakumar S. Ramachandrarao
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Supercritical carbon dioxide to reduce line edge roughness
- Patent number 7,049,053
- Issue date May 23, 2006
- Intel Corporation
- Vijayakumar Ramachandrarao
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Wafer stacking using interconnect structures of substantially unifo...
- Patent number 7,038,324
- Issue date May 2, 2006
- Intel Corporation
- Vijayakumar S. RamachandraRao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Highly polar cleans for removal of residues from semiconductor stru...
- Patent number 7,022,655
- Issue date Apr 4, 2006
- Intel Corporation
- Justin K. Brask
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Controlled use of photochemically susceptible chemistries for etchi...
- Patent number 7,018,938
- Issue date Mar 28, 2006
- Intel Corporation
- Subramanyam A. Iyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Replenishment of surface carbon and surface passivation of low-k po...
- Patent number 7,005,390
- Issue date Feb 28, 2006
- Intel Corporation
- Vijayakumar S. RamachandraRao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesion of carbon doped oxides by silanization
- Patent number 6,974,762
- Issue date Dec 13, 2005
- Intel Corporation
- David H. Gracias
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Filling small dimension vias using supercritical carbon dioxide
- Patent number 6,812,132
- Issue date Nov 2, 2004
- Intel Corporation
- Vijayakumar S. Ramachandrarao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Highly polar cleans for removal of residues from semiconductor stru...
- Patent number 6,624,127
- Issue date Sep 23, 2003
- Intel Corporation
- Justin K. Brask
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Method for controlling etch bias of carbon doped oxide films
- Patent number 6,620,741
- Issue date Sep 16, 2003
- Intel Corporation
- David H. Gracias
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
REMOVAL CHEMISTRY FOR SELECTIVELY ETCHING METAL HARD MASK
- Publication number 20100190347
- Publication date Jul 29, 2010
- Vijayakumar SubramanyaRao RamachandraRao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming ultra low dielectric constant porous dielectric films and s...
- Publication number 20090324928
- Publication date Dec 31, 2009
- Vijayakumar Ramachandrarao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTORESIST AND ANTIREFLECTIVE LAYER REMOVAL SOLUTION AND METHOD T...
- Publication number 20090241988
- Publication date Oct 1, 2009
- Intel Corporation
- Vijayakumar S. RAMACHANDRARAO
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
AIRGAP INTERCONNECT SYSTEM
- Publication number 20090001594
- Publication date Jan 1, 2009
- Hui Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Enhancing photoresist performance using electric fields
- Publication number 20080220380
- Publication date Sep 11, 2008
- Robert Bristol
- B82 - NANO-TECHNOLOGY
Information Patent Application
Methods for the formation of interconnects separated by air gaps
- Publication number 20080003794
- Publication date Jan 3, 2008
- Vijayakumar S. Ramachandrarao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Aluminum incorporation in porous dielectric for improved mechanical...
- Publication number 20080000875
- Publication date Jan 3, 2008
- Vijayakumar Ramachandrarao
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
Sealants for metal interconnect protection in microelectronic devic...
- Publication number 20070269956
- Publication date Nov 22, 2007
- Adrien R. Lavoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective removal of sacrificial light absorbing material over poro...
- Publication number 20070155161
- Publication date Jul 5, 2007
- Vijayakumar S. Ramachandrarao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of patterning a porous dielectric material
- Publication number 20060292856
- Publication date Dec 28, 2006
- Hyun-Mog Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sealing porous dielectric material using plasma-induced surface pol...
- Publication number 20060281329
- Publication date Dec 14, 2006
- Vijayakumar S. RamachandraRao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for wafer stacking using copper structures of substantially...
- Publication number 20060138618
- Publication date Jun 29, 2006
- Vijayakumar S. RamachandraRao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Controlled use of photochemically susceptible chemistries for etchi...
- Publication number 20060108067
- Publication date May 25, 2006
- Subramanyam A. Iyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for removing a residue from a substrate using supercritical...
- Publication number 20060102204
- Publication date May 18, 2006
- TOKYO ELECTRON LIMITED
- Gunilla Jacobson
- B08 - CLEANING
Information Patent Application
Via etch process
- Publication number 20050274690
- Publication date Dec 15, 2005
- Hyun-Mog Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer stacking using copper structures of substantially uniform height
- Publication number 20050221581
- Publication date Oct 6, 2005
- Vijayakumar S. RamachandraRao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Deposition of diffusion barrier
- Publication number 20050079685
- Publication date Apr 14, 2005
- Shriram Ramanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Enhancing photoresist performance using electric fields
- Publication number 20050074706
- Publication date Apr 7, 2005
- Robert Bristol
- B82 - NANO-TECHNOLOGY
Information Patent Application
Filling small dimension vias using supercritical carbon dioxide
- Publication number 20050054201
- Publication date Mar 10, 2005
- Vijayakumar S. Ramachandrarao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Replenishment of surface carbon and surface passivation of low-k po...
- Publication number 20050017365
- Publication date Jan 27, 2005
- Vijayakumar S. RamachandraRao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Post-deposition modification of interlayer dielectrics
- Publication number 20040266184
- Publication date Dec 30, 2004
- Vijayakumar S. RamachandraRao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Using bidentate chelators to clean semiconductor wafers
- Publication number 20040261816
- Publication date Dec 30, 2004
- Justin K. Brask
- B08 - CLEANING
Information Patent Application
Supercritical carbon dioxide to reduce line edge roughness
- Publication number 20040253550
- Publication date Dec 16, 2004
- Vijayakumar Ramachandrarao
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Forming thin hard mask over air gap or porous dielectric
- Publication number 20040214427
- Publication date Oct 28, 2004
- Grant M. Kloster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILLING SMALL DIMENSION VIAS USING SUPERCRITICAL CARBON DIOXIDE
- Publication number 20040185656
- Publication date Sep 23, 2004
- Vijayakumar S. Ramachandrarao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cleaning residues from semiconductor structures
- Publication number 20040171502
- Publication date Sep 2, 2004
- Shan C. Clark
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
Supercritical carbon dioxide-based cleaning of metal lines
- Publication number 20040147419
- Publication date Jul 29, 2004
- Vijayakumar S. Ramachandrarao
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
Etching and cleaning of semiconductors using supercritical carbon d...
- Publication number 20040134885
- Publication date Jul 15, 2004
- Subramanyam A. Iyer
- B08 - CLEANING
Information Patent Application
Highly polar cleans for removal of residues from semiconductor stru...
- Publication number 20040097388
- Publication date May 20, 2004
- Justin K. Brask
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
Controlled use of photochemically susceptible chemistries for etchi...
- Publication number 20040097076
- Publication date May 20, 2004
- Subramanyam A. Iyer
- H01 - BASIC ELECTRIC ELEMENTS

Vijayakumar Ramachandrarao

Person

Patents Grantslast 30 patents

Removal chemistry for selectively etching metal hard mask

Cleaning residues from semiconductor structures

Methods for the formation of interconnects separated by air gaps

Sealants for metal interconnect protection in microelectronic devic...

Aluminum incorporation in porous dielectric for improved mechanical...

Enhancing photoresist performance using electric fields

Sealing porous dielectric material using plasma-induced surface pol...

Via etch process

Method for wafer stacking using copper structures of substantially...

Forming thin hard mask over air gap or porous dielectric

Filling small dimension vias using supercritical carbon dioxide

Method of patterning a porous dielectric material

Deposition of diffusion barrier

Replenishment of surface carbon and surface passivation of low-k po...

Supercritical carbon dioxide-based cleaning of metal lines

Supercritical carbon dioxide to reduce line edge roughness

Wafer stacking using interconnect structures of substantially unifo...

Highly polar cleans for removal of residues from semiconductor stru...

Controlled use of photochemically susceptible chemistries for etchi...

Replenishment of surface carbon and surface passivation of low-k po...

Adhesion of carbon doped oxides by silanization

Filling small dimension vias using supercritical carbon dioxide

Highly polar cleans for removal of residues from semiconductor stru...

Method for controlling etch bias of carbon doped oxide films

Patents Applicationslast 30 patents

REMOVAL CHEMISTRY FOR SELECTIVELY ETCHING METAL HARD MASK

Forming ultra low dielectric constant porous dielectric films and s...

PHOTORESIST AND ANTIREFLECTIVE LAYER REMOVAL SOLUTION AND METHOD T...

AIRGAP INTERCONNECT SYSTEM

Enhancing photoresist performance using electric fields

Methods for the formation of interconnects separated by air gaps

Aluminum incorporation in porous dielectric for improved mechanical...

Sealants for metal interconnect protection in microelectronic devic...

Selective removal of sacrificial light absorbing material over poro...

Method of patterning a porous dielectric material

Sealing porous dielectric material using plasma-induced surface pol...

Method for wafer stacking using copper structures of substantially...

Controlled use of photochemically susceptible chemistries for etchi...

Method for removing a residue from a substrate using supercritical...

Via etch process

Wafer stacking using copper structures of substantially uniform height

Deposition of diffusion barrier

Enhancing photoresist performance using electric fields

Filling small dimension vias using supercritical carbon dioxide

Replenishment of surface carbon and surface passivation of low-k po...

Post-deposition modification of interlayer dielectrics

Using bidentate chelators to clean semiconductor wafers

Supercritical carbon dioxide to reduce line edge roughness

Forming thin hard mask over air gap or porous dielectric

FILLING SMALL DIMENSION VIAS USING SUPERCRITICAL CARBON DIOXIDE

Cleaning residues from semiconductor structures

Supercritical carbon dioxide-based cleaning of metal lines

Etching and cleaning of semiconductors using supercritical carbon d...

Highly polar cleans for removal of residues from semiconductor stru...

Controlled use of photochemically susceptible chemistries for etchi...