Vijaykumar Krithivasan

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Mechanical architecture for a multi-chip module
- Patent number 11,973,004
- Issue date Apr 30, 2024
- Tesla, Inc.
- Robert Yinan Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resonant process monitor
- Patent number 11,551,905
- Issue date Jan 10, 2023
- Intel Corporation
- Yaoling Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged device having imbedded array of components
- Patent number 11,122,678
- Issue date Sep 14, 2021
- Tesla, Inc.
- Vijaykumar Krithivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two zone flow cooling plate design with concentric or spiral channe...
- Patent number 10,697,061
- Issue date Jun 30, 2020
- Applied Materials, Inc.
- Kartik Shah
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Socket loading element and associated techniques and configurations
- Patent number 9,848,510
- Issue date Dec 19, 2017
- Intel Corporation
- Vijaykumar Krithivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques and configurations associated with a package load assembly
- Patent number 9,615,483
- Issue date Apr 4, 2017
- Intel Corporation
- Gaurav Chawla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly that includes a plurality of electronic packages
- Patent number 9,603,276
- Issue date Mar 21, 2017
- Intel Corporation
- David J. Llapitan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-array bottom-side connector using spring bias
- Patent number 9,490,560
- Issue date Nov 8, 2016
- Intel Corporation
- Gaurav Chawla
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Lateral slide pick and place cover for reduced bent pins in LGA soc...
- Patent number 9,385,444
- Issue date Jul 5, 2016
- Intel Corporation
- Vijaykumar Krithivasan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connector assembly and method
- Patent number 9,385,457
- Issue date Jul 5, 2016
- Intel Corporation
- Gaurav Chawla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assemblies with scalable clip-type connectors
- Patent number 9,325,087
- Issue date Apr 26, 2016
- Intel Corporation
- Gaurav Chawla
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Integrated circuit connectors
- Patent number 9,265,170
- Issue date Feb 16, 2016
- Intel Corporation
- Rajasekaran Swaminathan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip socket including a circular contact pattern
- Patent number 8,961,193
- Issue date Feb 24, 2015
- Intel Corporation
- Gaurav Chawla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector assembly and method
- Patent number 8,905,794
- Issue date Dec 9, 2014
- Intel Corporation
- Gaurav Chawla
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-STAGE ARRAY BASED VERTICALLY INTEGRATED POWER DELIVERY
- Publication number 20240370070
- Publication date Nov 7, 2024
- Tesla, Inc.
- Jin Zhao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC ASSEMBLIES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20240312863
- Publication date Sep 19, 2024
- Tesla, Inc.
- Yong guo Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER ALIGNMENT STRUCTURE
- Publication number 20240234333
- Publication date Jul 11, 2024
- Tesla, Inc.
- Yong guo Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLED SYSTEM-ON-WAFER WITH MEANS FOR REDUCING THE EFFECTS OF ELECT...
- Publication number 20240145432
- Publication date May 2, 2024
- Tesla, Inc.
- Mengzhi Pang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER ALIGNMENT STRUCTURE
- Publication number 20240136303
- Publication date Apr 25, 2024
- Tesla, Inc.
- Yong guo Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VOLTAGE REGULATING MODULE DESIGN FOR THE USE OF UNDERFILL
- Publication number 20240061482
- Publication date Feb 22, 2024
- Tesla, Inc.
- Vijaykumar Krithivasan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MECHANICAL ARCHITECTURE FOR A MULTI-CHIP MODULE
- Publication number 20210351104
- Publication date Nov 11, 2021
- Tesla, Inc.
- Robert Yinan Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED DEVICE HAVING EMBEDDED ARRAY OF COMPONENTS
- Publication number 20200221568
- Publication date Jul 9, 2020
- Tesla, Inc.
- Jin Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESONANT PROCESS MONITOR
- Publication number 20190287758
- Publication date Sep 19, 2019
- Yaoling PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO ZONE FLOW COOLING PLATE DESIGN WITH CONCENTRIC OR SPIRAL CHANNE...
- Publication number 20180142352
- Publication date May 24, 2018
- Applied Materials, Inc.
- Kartik SHAH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SOCKET THAT ENGAGES A PLURALITY OF ELECTRONIC PACKAGES
- Publication number 20160190716
- Publication date Jun 30, 2016
- Kuang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY THAT INCLUDES A PLURALITY OF ELECTRONIC PACKAGES
- Publication number 20160190717
- Publication date Jun 30, 2016
- David J. Llapitan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOCKET LOADING ELEMENT AND ASSOCIATED TECHNIQUES AND CONFIGURATIONS
- Publication number 20160183375
- Publication date Jun 23, 2016
- Intel Corporation
- Vijaykumar Krithivasan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-ARRAY BOTTOM-SIDE CONNECTOR USING SPRING BIAS
- Publication number 20160181714
- Publication date Jun 23, 2016
- Intel Corporation
- GAURAV CHAWLA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TECHNIQUES AND CONFIGURATIONS ASSOCIATED WITH A PACKAGE LOAD ASSEMBLY
- Publication number 20160079150
- Publication date Mar 17, 2016
- Intel Corporation
- Gaurav Chawla
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC ASSEMBLIES WITH SCALABLE CLIP-TYPE CONNECTORS
- Publication number 20150280337
- Publication date Oct 1, 2015
- Gaurav Chawla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR ASSEMBLY AND METHOD
- Publication number 20150249298
- Publication date Sep 3, 2015
- Intel Corporation
- Gaurav Chawla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LATERAL SLIDE PICK AND PLACE COVER FOR REDUCED BENT PINS IN LGA SOC...
- Publication number 20150171527
- Publication date Jun 18, 2015
- Vijaykumar Krithivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SOCKET INCLUDING A CIRCULAR CONTACT PATTERN
- Publication number 20150162719
- Publication date Jun 11, 2015
- Intel Corporation
- Gaurav Chawla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CONNECTORS
- Publication number 20150118870
- Publication date Apr 30, 2015
- Rajasekaran Swaminathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SOCKET INCLUDING A CIRCULAR CONTACT PATTERN
- Publication number 20140162474
- Publication date Jun 12, 2014
- Gaurav Chawla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR ASSEMBLY AND METHOD
- Publication number 20140162475
- Publication date Jun 12, 2014
- Gaurav Chawla
- H01 - BASIC ELECTRIC ELEMENTS

Vijaykumar Krithivasan

Person

Patents Grantslast 30 patents

Mechanical architecture for a multi-chip module

Resonant process monitor

Packaged device having imbedded array of components

Two zone flow cooling plate design with concentric or spiral channe...

Socket loading element and associated techniques and configurations

Techniques and configurations associated with a package load assembly

Electronic assembly that includes a plurality of electronic packages

Multi-array bottom-side connector using spring bias

Lateral slide pick and place cover for reduced bent pins in LGA soc...

Connector assembly and method

Electronic assemblies with scalable clip-type connectors

Integrated circuit connectors

Chip socket including a circular contact pattern

Connector assembly and method

Patents Applicationslast 30 patents

MULTI-STAGE ARRAY BASED VERTICALLY INTEGRATED POWER DELIVERY

ELECTRONIC ASSEMBLIES AND METHODS OF MANUFACTURING THE SAME

WAFER ALIGNMENT STRUCTURE

COOLED SYSTEM-ON-WAFER WITH MEANS FOR REDUCING THE EFFECTS OF ELECT...

WAFER ALIGNMENT STRUCTURE

VOLTAGE REGULATING MODULE DESIGN FOR THE USE OF UNDERFILL

MECHANICAL ARCHITECTURE FOR A MULTI-CHIP MODULE

PACKAGED DEVICE HAVING EMBEDDED ARRAY OF COMPONENTS

RESONANT PROCESS MONITOR

TWO ZONE FLOW COOLING PLATE DESIGN WITH CONCENTRIC OR SPIRAL CHANNE...

SOCKET THAT ENGAGES A PLURALITY OF ELECTRONIC PACKAGES

ELECTRONIC ASSEMBLY THAT INCLUDES A PLURALITY OF ELECTRONIC PACKAGES

SOCKET LOADING ELEMENT AND ASSOCIATED TECHNIQUES AND CONFIGURATIONS

MULTI-ARRAY BOTTOM-SIDE CONNECTOR USING SPRING BIAS

TECHNIQUES AND CONFIGURATIONS ASSOCIATED WITH A PACKAGE LOAD ASSEMBLY

ELECTRONIC ASSEMBLIES WITH SCALABLE CLIP-TYPE CONNECTORS

CONNECTOR ASSEMBLY AND METHOD

LATERAL SLIDE PICK AND PLACE COVER FOR REDUCED BENT PINS IN LGA SOC...

CHIP SOCKET INCLUDING A CIRCULAR CONTACT PATTERN

INTEGRATED CIRCUIT CONNECTORS

CHIP SOCKET INCLUDING A CIRCULAR CONTACT PATTERN

CONNECTOR ASSEMBLY AND METHOD