Vikas Gupta

Person

Dallas, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for creating a wettable surface for improved reliability in...
- Patent number 12,255,077
- Issue date Mar 18, 2025
- Texas Instruments Incorporated
- Sadia Naseem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for creating a wettable surface for improved reliability in...
- Patent number 11,791,168
- Issue date Oct 17, 2023
- Texas Instruments Incorporated
- Sadia Naseem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless device with waveguiding structures between radiating struc...
- Patent number 11,735,806
- Issue date Aug 22, 2023
- Texas Instruments Incorporated
- Vikas Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic device with integral antenna
- Patent number 11,677,152
- Issue date Jun 13, 2023
- Texas Instruments Incorporated
- Vikas Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device for sensing impedance changes in a medium
- Patent number 11,598,742
- Issue date Mar 7, 2023
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device with a reflow wall
- Patent number 11,437,333
- Issue date Sep 6, 2022
- Texas Instruments Incorporated
- Vikas Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate design for efficient coupling between a package and a die...
- Patent number 11,128,023
- Issue date Sep 21, 2021
- Texas Instruments Incorporated
- Hassan Omar Ali
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Packaged semiconductor device with a particle roughened surface
- Patent number 11,062,982
- Issue date Jul 13, 2021
- Texas Instruments Incorporated
- Vikas Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level derived flip chip package
- Patent number 11,018,111
- Issue date May 25, 2021
- Texas Instruments Incorporated
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for creating a wettable surface for improved reliability in...
- Patent number 10,916,448
- Issue date Feb 9, 2021
- Texas Instruments Incorporated
- Sadia Naseem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna in package device having substrate stack
- Patent number 10,910,705
- Issue date Feb 2, 2021
- Texas Instruments Incorporated
- Vikas Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device for sensing impedance changes in a medium
- Patent number 10,883,953
- Issue date Jan 5, 2021
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for a semiconductor device having bi-material...
- Patent number 10,784,188
- Issue date Sep 22, 2020
- Texas Instruments Incorporated
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
2-step die attach for reduced pedestal size of laminate component p...
- Patent number 10,559,524
- Issue date Feb 11, 2020
- Texas Instruments Incorporated
- Sadia Naseem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device with a particle roughened surface
- Patent number 10,475,729
- Issue date Nov 12, 2019
- Texas Instruments Incorporated
- Vikas Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for semiconductor device having bi-material d...
- Patent number 10,366,944
- Issue date Jul 30, 2019
- Texas Instruments Incorporated
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device with a particle roughened surface
- Patent number 10,186,478
- Issue date Jan 22, 2019
- Texas Instruments Incorporated
- Vikas Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for a semiconductor device having bi-material...
- Patent number 10,083,896
- Issue date Sep 25, 2018
- Texas Instruments Incorporated
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged IC with solderable sidewalls
- Patent number 9,780,060
- Issue date Oct 3, 2017
- Texas Instruments Incorporated
- Yong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of making a stacked semiconductor package having a clip
- Patent number 8,883,567
- Issue date Nov 11, 2014
- Texas Instruments Incorporated
- Michael Todd Wyant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for thermal control of semiconductor chip assembly and un...
- Patent number 8,378,503
- Issue date Feb 19, 2013
- Texas Instruments Incorporated
- Vikas Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material design for enhanced thermal performance...
- Patent number 8,304,897
- Issue date Nov 6, 2012
- Texas Instruments Incorporated
- Siva Prakash Gurrum
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stud bumps as local heat sinks during transient power operations
- Patent number 8,129,224
- Issue date Mar 6, 2012
- Texas Instruments Incorporated
- Siva P Gurrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal method to control underfill flow in semiconductor devices
- Patent number 8,110,438
- Issue date Feb 7, 2012
- Texas Instruments Incorporated
- Vikas Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat extraction from packaged semiconductor chips, scalable with ch...
- Patent number 7,989,949
- Issue date Aug 2, 2011
- Texas Instruments Incorporated
- Vikas Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material design for enhanced thermal performance...
- Patent number 7,956,456
- Issue date Jun 7, 2011
- Texas Instruments Incorporated
- Siva Prakash Gurrum
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Array-processed stacked semiconductor packages
- Patent number 7,892,889
- Issue date Feb 22, 2011
- Texas Instruments Incorporated
- Gregory E Howard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stud bumps as local heat sinks during transient power operations
- Patent number 7,838,988
- Issue date Nov 23, 2010
- Texas Instruments Incorporated
- Siva Prakash Gurrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat extraction from packaged semiconductor chips, scalable with ch...
- Patent number 7,572,679
- Issue date Aug 11, 2009
- Texas Instruments Incorporated
- Vikas Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic discharge device and method
- Patent number 7,456,477
- Issue date Nov 25, 2008
- Texas Instruments Incorporated
- E. Ajith Amerasekera
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20240112978
- Publication date Apr 4, 2024
- Advanced Semiconductor Engineering, Inc.
- Vikas GUPTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CREATING A WETTABLE SURFACE FOR IMPROVED RELIABILITY IN...
- Publication number 20240047226
- Publication date Feb 8, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sadia Naseem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS DEVICE WITH WAVEGUIDING STRUCTURES BETWEEN RADIATING STRUC...
- Publication number 20230395969
- Publication date Dec 7, 2023
- TEXAS INSTRUMENTS INCORPORATED
- VIKAS GUPTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED ELECTRONIC DEVICE WITH INTEGRAL ANTENNA
- Publication number 20220285844
- Publication date Sep 8, 2022
- TEXAS INSTRUMENTS INCORPORATED
- VIKAS GUPTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CREATING A WETTABLE SURFACE FOR IMPROVED RELIABILITY IN...
- Publication number 20210166951
- Publication date Jun 3, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Sadia Naseem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE FOR SENSING IMPEDANCE CHANGES IN A MEDIUM
- Publication number 20210116407
- Publication date Apr 22, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA IN PACKAGE DEVICE HAVING SUBSTRATE STACK
- Publication number 20200403299
- Publication date Dec 24, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Vikas Gupta
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
WAFER LEVEL DERIVED FLIP CHIP PACKAGE
- Publication number 20200381390
- Publication date Dec 3, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Design for Efficient Coupling Between a Package and a Die...
- Publication number 20200321677
- Publication date Oct 8, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Hassan Omar Ali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS COMMUNICATION DEVICE WITH ANTENNA ON PACKAGE
- Publication number 20200212536
- Publication date Jul 2, 2020
- TEXAS INSTRUMENTS INCORPORATED
- VIKAS GUPTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE CONNECTIONS WITH SINTERED NANOPARTICLES
- Publication number 20200185322
- Publication date Jun 11, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE FOR SENSING IMPEDANCE CHANGES IN A MEDIUM
- Publication number 20200116663
- Publication date Apr 16, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Enis Tuncer
- G01 - MEASURING TESTING
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE WITH A PARTICLE ROUGHENED SURFACE
- Publication number 20200083149
- Publication date Mar 12, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Vikas Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CREATING A WETTABLE SURFACE FOR IMPROVED RELIABILITY IN...
- Publication number 20200013634
- Publication date Jan 9, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Sadia Naseem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS DEVICE WITH WAVEGUIDING STRUCTURES BETWEEN RADIATING STRUC...
- Publication number 20190348746
- Publication date Nov 14, 2019
- TEXAS INSTRUMENTS INCORPORATED
- VIKAS GUPTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus for a Semiconductor Device Having Bi-Material...
- Publication number 20190304881
- Publication date Oct 3, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE WITH A PARTICLE ROUGHENED SURFACE
- Publication number 20190157195
- Publication date May 23, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Vikas Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR CAPACITIVE ISOLATION DEVICES
- Publication number 20190019776
- Publication date Jan 17, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus for Semiconductor Device Having Bi-Material D...
- Publication number 20180277463
- Publication date Sep 27, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR A SEMICONDUCTOR DEVICE HAVING BI-MATERIAL...
- Publication number 20180277461
- Publication date Sep 27, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE WITH A PARTICLE ROUGHENED SURFACE
- Publication number 20180190577
- Publication date Jul 5, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Vikas Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE WITH A REFLOW WALL
- Publication number 20180190608
- Publication date Jul 5, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Vikas Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged IC With Solderable Sidewalls
- Publication number 20170365575
- Publication date Dec 21, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Yong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged IC with Solderable Sidewalls
- Publication number 20170162530
- Publication date Jun 8, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Yong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Semiconductor Package
- Publication number 20130256852
- Publication date Oct 3, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Michael Todd Wyant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Method to Control Underfill Flow in Semiconductor Devices
- Publication number 20120097095
- Publication date Apr 26, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Vikas Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Interface Material Design for Enhanced Thermal Performance...
- Publication number 20110204506
- Publication date Aug 25, 2011
- TEXAS INSTRUMENTS INCORPORATED
- Siva Prakash Gurrum
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Stud Bumps as Local Heat Sinks During Transient Power Operations
- Publication number 20110027943
- Publication date Feb 3, 2011
- TEXAS INSTRUMENTS INCORPORATED
- Siva Prakash GURRUM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STUD BUMPS AS LOCAL HEAT SINKS DURING TRANSIENT POWER OPERATIONS
- Publication number 20100301470
- Publication date Dec 2, 2010
- TEXAS INSTRUMENTS INCORPORATED
- Siva P. Gurrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electromigration-Resistant Flip-Chip Solder Joints
- Publication number 20100219528
- Publication date Sep 2, 2010
- TEXAS INSTRUMENTS INCORPORATED
- Jie-Hua ZHAO
- H01 - BASIC ELECTRIC ELEMENTS

Vikas Gupta

Person

Patents Grantslast 30 patents

Method for creating a wettable surface for improved reliability in...

Method for creating a wettable surface for improved reliability in...

Wireless device with waveguiding structures between radiating struc...

Packaged electronic device with integral antenna

Semiconductor device for sensing impedance changes in a medium

Packaged semiconductor device with a reflow wall

Substrate design for efficient coupling between a package and a die...

Packaged semiconductor device with a particle roughened surface

Wafer level derived flip chip package

Method for creating a wettable surface for improved reliability in...

Antenna in package device having substrate stack

Semiconductor device for sensing impedance changes in a medium

Methods and apparatus for a semiconductor device having bi-material...

2-step die attach for reduced pedestal size of laminate component p...

Packaged semiconductor device with a particle roughened surface

Methods and apparatus for semiconductor device having bi-material d...

Packaged semiconductor device with a particle roughened surface

Methods and apparatus for a semiconductor device having bi-material...

Packaged IC with solderable sidewalls

Process of making a stacked semiconductor package having a clip

Apparatus for thermal control of semiconductor chip assembly and un...

Thermal interface material design for enhanced thermal performance...

Stud bumps as local heat sinks during transient power operations

Thermal method to control underfill flow in semiconductor devices

Heat extraction from packaged semiconductor chips, scalable with ch...

Thermal interface material design for enhanced thermal performance...

Array-processed stacked semiconductor packages

Stud bumps as local heat sinks during transient power operations

Heat extraction from packaged semiconductor chips, scalable with ch...

Electrostatic discharge device and method

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE

METHOD FOR CREATING A WETTABLE SURFACE FOR IMPROVED RELIABILITY IN...

WIRELESS DEVICE WITH WAVEGUIDING STRUCTURES BETWEEN RADIATING STRUC...

PACKAGED ELECTRONIC DEVICE WITH INTEGRAL ANTENNA

METHOD FOR CREATING A WETTABLE SURFACE FOR IMPROVED RELIABILITY IN...

SEMICONDUCTOR DEVICE FOR SENSING IMPEDANCE CHANGES IN A MEDIUM

ANTENNA IN PACKAGE DEVICE HAVING SUBSTRATE STACK

WAFER LEVEL DERIVED FLIP CHIP PACKAGE

Substrate Design for Efficient Coupling Between a Package and a Die...

WIRELESS COMMUNICATION DEVICE WITH ANTENNA ON PACKAGE

SEMICONDUCTOR DEVICE CONNECTIONS WITH SINTERED NANOPARTICLES

SEMICONDUCTOR DEVICE FOR SENSING IMPEDANCE CHANGES IN A MEDIUM

PACKAGED SEMICONDUCTOR DEVICE WITH A PARTICLE ROUGHENED SURFACE

METHOD FOR CREATING A WETTABLE SURFACE FOR IMPROVED RELIABILITY IN...

WIRELESS DEVICE WITH WAVEGUIDING STRUCTURES BETWEEN RADIATING STRUC...

Methods and Apparatus for a Semiconductor Device Having Bi-Material...

PACKAGED SEMICONDUCTOR DEVICE WITH A PARTICLE ROUGHENED SURFACE

STRUCTURES AND METHODS FOR CAPACITIVE ISOLATION DEVICES

Methods and Apparatus for Semiconductor Device Having Bi-Material D...

METHODS AND APPARATUS FOR A SEMICONDUCTOR DEVICE HAVING BI-MATERIAL...

PACKAGED SEMICONDUCTOR DEVICE WITH A PARTICLE ROUGHENED SURFACE

PACKAGED SEMICONDUCTOR DEVICE WITH A REFLOW WALL

Packaged IC With Solderable Sidewalls

Packaged IC with Solderable Sidewalls

Stacked Semiconductor Package

Thermal Method to Control Underfill Flow in Semiconductor Devices

Thermal Interface Material Design for Enhanced Thermal Performance...

Stud Bumps as Local Heat Sinks During Transient Power Operations

STUD BUMPS AS LOCAL HEAT SINKS DURING TRANSIENT POWER OPERATIONS

Electromigration-Resistant Flip-Chip Solder Joints