VIKASH BANTHIA

Person

Mountain View, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Blocker plate for use in a substrate process chamber
- Patent number 11,421,322
- Issue date Aug 23, 2022
- Applied Materials, Inc.
- Xiaoxiong Yuan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process kit for a substrate support
- Patent number 11,387,134
- Issue date Jul 12, 2022
- Applied Materials, Inc.
- Muhannad Mustafa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a metal gapfill
- Patent number 11,355,391
- Issue date Jun 7, 2022
- Applied Materials, Inc.
- Xi Cen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of reducing or eliminating defects in tungsten film
- Patent number 10,879,081
- Issue date Dec 29, 2020
- Applied Materials, Inc.
- Guoqiang Jian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process integration approach of selective tungsten via fill
- Patent number 10,727,119
- Issue date Jul 28, 2020
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process kit design for in-chamber heater and wafer rotating mechanism
- Patent number 10,704,147
- Issue date Jul 7, 2020
- Applied Materials, Inc.
- Muhammad M. Rasheed
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for depositing semiconductor films
- Patent number 10,535,527
- Issue date Jan 14, 2020
- Applied Materials, Inc.
- Yi Xu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Blocker plate for use in a substrate process chamber
- Patent number 10,508,339
- Issue date Dec 17, 2019
- Applied Materials, Inc.
- Xiaoxiong Yuan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
In-situ pre-clean for selectivity improvement for selective deposition
- Patent number 10,395,916
- Issue date Aug 27, 2019
- Applied Materials, Inc.
- Kai Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process integration approach of selective tungsten via fill
- Patent number 10,256,144
- Issue date Apr 9, 2019
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and methods
- Patent number 10,256,076
- Issue date Apr 9, 2019
- Applied Materials, Inc.
- Shi Wei Toh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for forming low-resistance contacts through integrated proc...
- Patent number 9,947,578
- Issue date Apr 17, 2018
- Applied Materials, Inc.
- Yu Lei
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for etching via atomic layer deposition (ALD) cycles
- Patent number 9,595,466
- Issue date Mar 14, 2017
- Applied Materials, Inc.
- Xinyu Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of thin film process
- Patent number 7,939,422
- Issue date May 10, 2011
- Applied Materials, Inc.
- Nitin K. Ingle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-step anneal of thin films for film densification and improved...
- Patent number 7,642,171
- Issue date Jan 5, 2010
- Applied Materials, Inc.
- Nitin K. Ingle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gap-fill depositions in the formation of silicon containing dielect...
- Patent number 7,456,116
- Issue date Nov 25, 2008
- Applied Materials, Inc.
- Nitin K. Ingle
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Gap-fill depositions introducing hydroxyl-containing precursors in...
- Patent number 7,335,609
- Issue date Feb 26, 2008
- Applied Materials, Inc.
- Nitin K. Ingle
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Gas flow control in a wafer processing system having multiple chamb...
- Patent number 6,843,882
- Issue date Jan 18, 2005
- Applied Materials, Inc.
- Karthik Janakiraman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
PROCESS KIT FOR A SUBSTRATE SUPPORT
- Publication number 20220344134
- Publication date Oct 27, 2022
- Applied Materials, Inc.
- MUHANNAD MUSTAFA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A METAL GAPFILL
- Publication number 20200303250
- Publication date Sep 24, 2020
- Applied Materials, Inc.
- Xi CEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BLOCKER PLATE FOR USE IN A SUBSTRATE PROCESS CHAMBER
- Publication number 20190382895
- Publication date Dec 19, 2019
- Applied Materials, Inc.
- XIAOXIONG YUAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
In-Situ Pre-Clean For Selectivity Improvement For Selective Deposition
- Publication number 20190385838
- Publication date Dec 19, 2019
- Applied Materials, Inc.
- Kai Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS KIT FOR A SUBSTRATE SUPPORT
- Publication number 20190229007
- Publication date Jul 25, 2019
- Applied Materials, Inc.
- MUHANNAD MUSTAFA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF REDUCING OR ELIMINATING DEFECTS IN TUNGSTEN FILM
- Publication number 20190157102
- Publication date May 23, 2019
- Applied Materials, Inc.
- GUOQIANG JIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS INTEGRATION APPROACH OF SELECTIVE TUNGSTEN VIA FILL
- Publication number 20190157145
- Publication date May 23, 2019
- Applied Materials, Inc.
- He REN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods And Apparatus For Depositing Tungsten Nucleation Layers
- Publication number 20190017165
- Publication date Jan 17, 2019
- Applied Materials, Inc.
- Kai Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR DEPOSITING SEMICONDUCTOR FILMS
- Publication number 20190019684
- Publication date Jan 17, 2019
- Applied Materials, Inc.
- Yi Xu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BLOCKER PLATE FOR USE IN A SUBSTRATE PROCESS CHAMBER
- Publication number 20180347043
- Publication date Dec 6, 2018
- Applied Materials, Inc.
- XIAOXIONG YUAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROCESS INTEGRATION APPROACH OF SELECTIVE TUNGSTEN VIA FILL
- Publication number 20180315650
- Publication date Nov 1, 2018
- Applied Materials, Inc.
- He REN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS KIT DESIGN FOR IN-CHAMBER HEATER AND WAFER ROTATING MECHANISM
- Publication number 20180155838
- Publication date Jun 7, 2018
- Muhammad M. RASHEED
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Methods To Selectively Deposit Corrosion-Free Metal Contacts
- Publication number 20180145034
- Publication date May 24, 2018
- Applied Materials, Inc.
- Yi Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electromigration Improvement Using Tungsten For Selective Cobalt De...
- Publication number 20180144973
- Publication date May 24, 2018
- Applied Materials, Inc.
- Weifeng Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
In-Situ Pre-Clean For Selectivity Improvement For Selective Deposition
- Publication number 20180076020
- Publication date Mar 15, 2018
- Applied Materials, Inc.
- Kai Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING LOW-RESISTANCE CONTACTS THROUGH INTEGRATED PROC...
- Publication number 20170148670
- Publication date May 25, 2017
- Applied Materials, Inc.
- YU LEI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND METHODS
- Publication number 20170117118
- Publication date Apr 27, 2017
- Applied Materials, Inc.
- Shi Wei TOH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS OF ETCHBACK PROFILE TUNING
- Publication number 20160300731
- Publication date Oct 13, 2016
- Applied Materials, Inc.
- KAI WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR ETCHING VIA ATOMIC LAYER DEPOSITION (ALD) CYCLES
- Publication number 20160276214
- Publication date Sep 22, 2016
- Applied Materials, Inc.
- Xinyu FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF THIN FILM PROCESS
- Publication number 20110151676
- Publication date Jun 23, 2011
- Applied Materials, Inc.
- Nitin K. Ingle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF THIN FILM PROCESS
- Publication number 20080182382
- Publication date Jul 31, 2008
- Applied Materials, Inc.
- Nitin K. Ingle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAP-FILL DEPOSITIONS INTRODUCING HYDROXYL-CONTAINING PRECURSORS IN...
- Publication number 20080115726
- Publication date May 22, 2008
- Applied Materials, Inc.
- Nitin K. Ingle
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MULTI-STEP ANNEAL OF THIN FILMS FOR FILM DENSIFICATION AND IMPROVED...
- Publication number 20070212847
- Publication date Sep 13, 2007
- Applied Materials, Inc.
- Nitin K. Ingle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-STEP ANNEAL OF THIN FILMS FOR FILM DENSIFICATION AND IMPROVED...
- Publication number 20070000897
- Publication date Jan 4, 2007
- Applied Materials, Inc.
- Nitin K. Ingle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gap-fill depositions introducing hydroxyl-containing precursors in...
- Publication number 20060046427
- Publication date Mar 2, 2006
- APPLIED MATERIALS, INC., A Delaware corporation
- Nitin K. Ingle
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Multi-step anneal of thin films for film densification and improved...
- Publication number 20060030165
- Publication date Feb 9, 2006
- Applied Materials, Inc. a Delaware Corporation
- Nitin K. Ingle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gap-fill depositions in the formation of silicon containing dielect...
- Publication number 20050142895
- Publication date Jun 30, 2005
- Applied Materials, Inc.
- Nitin K. Ingle
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Gas flow control in a wafer processing system having multiple chamb...
- Publication number 20040007176
- Publication date Jan 15, 2004
- Applied Materials, Inc.
- Karthik Janakiraman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Detection of contaminants on semiconductor wafers
- Publication number 20020006677
- Publication date Jan 17, 2002
- John Egermeier
- H01 - BASIC ELECTRIC ELEMENTS

VIKASH BANTHIA

Person

Patents Grantslast 30 patents

Blocker plate for use in a substrate process chamber

Process kit for a substrate support

Method for forming a metal gapfill

Methods of reducing or eliminating defects in tungsten film

Process integration approach of selective tungsten via fill

Process kit design for in-chamber heater and wafer rotating mechanism

Methods for depositing semiconductor films

Blocker plate for use in a substrate process chamber

In-situ pre-clean for selectivity improvement for selective deposition

Process integration approach of selective tungsten via fill

Substrate processing apparatus and methods

Methods for forming low-resistance contacts through integrated proc...

Methods for etching via atomic layer deposition (ALD) cycles

Methods of thin film process

Multi-step anneal of thin films for film densification and improved...

Gap-fill depositions in the formation of silicon containing dielect...

Gap-fill depositions introducing hydroxyl-containing precursors in...

Gas flow control in a wafer processing system having multiple chamb...

Patents Applicationslast 30 patents

PROCESS KIT FOR A SUBSTRATE SUPPORT

METHOD FOR FORMING A METAL GAPFILL

BLOCKER PLATE FOR USE IN A SUBSTRATE PROCESS CHAMBER

In-Situ Pre-Clean For Selectivity Improvement For Selective Deposition

PROCESS KIT FOR A SUBSTRATE SUPPORT

METHODS OF REDUCING OR ELIMINATING DEFECTS IN TUNGSTEN FILM

PROCESS INTEGRATION APPROACH OF SELECTIVE TUNGSTEN VIA FILL

Methods And Apparatus For Depositing Tungsten Nucleation Layers

METHODS FOR DEPOSITING SEMICONDUCTOR FILMS

BLOCKER PLATE FOR USE IN A SUBSTRATE PROCESS CHAMBER

PROCESS INTEGRATION APPROACH OF SELECTIVE TUNGSTEN VIA FILL

PROCESS KIT DESIGN FOR IN-CHAMBER HEATER AND WAFER ROTATING MECHANISM

Methods To Selectively Deposit Corrosion-Free Metal Contacts

Electromigration Improvement Using Tungsten For Selective Cobalt De...

In-Situ Pre-Clean For Selectivity Improvement For Selective Deposition

METHODS FOR FORMING LOW-RESISTANCE CONTACTS THROUGH INTEGRATED PROC...

SUBSTRATE PROCESSING APPARATUS AND METHODS

METHODS OF ETCHBACK PROFILE TUNING

METHODS FOR ETCHING VIA ATOMIC LAYER DEPOSITION (ALD) CYCLES

METHODS OF THIN FILM PROCESS

METHODS OF THIN FILM PROCESS

GAP-FILL DEPOSITIONS INTRODUCING HYDROXYL-CONTAINING PRECURSORS IN...

MULTI-STEP ANNEAL OF THIN FILMS FOR FILM DENSIFICATION AND IMPROVED...

MULTI-STEP ANNEAL OF THIN FILMS FOR FILM DENSIFICATION AND IMPROVED...

Gap-fill depositions introducing hydroxyl-containing precursors in...

Multi-step anneal of thin films for film densification and improved...

Gap-fill depositions in the formation of silicon containing dielect...

Gas flow control in a wafer processing system having multiple chamb...

Detection of contaminants on semiconductor wafers