Vinay Chikarmane

Person

Portland, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Heterogeneous metal line compositions for advanced integrated circu...
- Patent number 11,955,534
- Issue date Apr 9, 2024
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous metal line compositions for advanced integrated circu...
- Patent number 11,581,419
- Issue date Feb 14, 2023
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous metal line compositions for advanced integrated circu...
- Patent number 10,854,731
- Issue date Dec 1, 2020
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous metal line compositions for advanced integrated circu...
- Patent number 10,777,655
- Issue date Sep 15, 2020
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stressed barrier plug slot contact structure for transistor perform...
- Patent number 8,278,718
- Issue date Oct 2, 2012
- Intel Corporation
- Kevin J. Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stressed barrier plug slot contact structure for transistor perform...
- Patent number 8,120,119
- Issue date Feb 21, 2012
- Intel Corporation
- Kevin J. Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stressed barrier plug slot contact structure for transistor perform...
- Patent number 7,968,952
- Issue date Jun 28, 2011
- Intel Corporation
- Kevin J. Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier formation and structure to use in semiconductor devices
- Patent number 7,768,126
- Issue date Aug 3, 2010
- Intel Corporation
- Kevin Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device using the self alig...
- Patent number 7,741,219
- Issue date Jun 22, 2010
- Intel Corporation
- Vinay B. Chikarmane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tuned tensile stress low resistivity slot contact structure for n-t...
- Patent number 7,719,062
- Issue date May 18, 2010
- Intel Corporation
- Kevin J. Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing corrosion in copper damascene processes
- Patent number 7,582,558
- Issue date Sep 1, 2009
- Intel Corporation
- Vinay B. Chikarmane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier process/structure for transistor trench contact applications
- Patent number 7,525,197
- Issue date Apr 28, 2009
- Intel Corporation
- Vinay Chikarmane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modified electroplating solution components in a low-acid electroly...
- Patent number 7,371,311
- Issue date May 13, 2008
- Intel Corporation
- Daniel J Zierath
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus and method of surface treatment for electrolytic and elec...
- Patent number 7,070,687
- Issue date Jul 4, 2006
- Intel Corporation
- Vinay B. Chikarmane
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Seed layer treatment
- Patent number 7,001,641
- Issue date Feb 21, 2006
- Intel Corporation
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature aluminum alloy plug technology
- Patent number 5,804,251
- Issue date Sep 8, 1998
- Intel Corporation
- Jick M. Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...
- Publication number 20240047556
- Publication date Feb 8, 2024
- Intel Corporation
- Andrew W. YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...
- Publication number 20230101723
- Publication date Mar 30, 2023
- Intel Corporation
- Andrew W. YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...
- Publication number 20210066475
- Publication date Mar 4, 2021
- Intel Corporation
- Andrew W. YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...
- Publication number 20200044049
- Publication date Feb 6, 2020
- Intel Corporation
- Andrew W. YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...
- Publication number 20190164897
- Publication date May 30, 2019
- Intel Corporation
- Andrew W. YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESSED BARRIER PLUG SLOT CONTACT STRUCTURE FOR TRANSISTOR PERFORM...
- Publication number 20120068273
- Publication date Mar 22, 2012
- Kevin J. Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESSED BARRIER PLUG SLOT CONTACT STRUCTURE FOR TRANSISTOR PERFORM...
- Publication number 20110133259
- Publication date Jun 9, 2011
- Kevin J. Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Barrier process/structure for transistor trench contact applications
- Publication number 20090170309
- Publication date Jul 2, 2009
- Vinay Chikarmane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a semiconductor device using the self align...
- Publication number 20090004857
- Publication date Jan 1, 2009
- Vinay B. Chikarmane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tuned tensile stress low resistivity slot contact structure for n-t...
- Publication number 20080157224
- Publication date Jul 3, 2008
- Kevin J. Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stressed barrier plug slot contact structure for transistor perform...
- Publication number 20080157208
- Publication date Jul 3, 2008
- Kevin J. Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Barrier formation and structure to use in semiconductor devices
- Publication number 20080079165
- Publication date Apr 3, 2008
- Kevin Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through contact layer opening silicide and barrier layer formation
- Publication number 20080076246
- Publication date Mar 27, 2008
- Brennan L. Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Barrier process/structure for transistor trench contact applications
- Publication number 20080026556
- Publication date Jan 31, 2008
- Vinay Chikarmane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reducing corrosion in copper damascene processes
- Publication number 20080014746
- Publication date Jan 17, 2008
- Vinay B. Chikarmane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for reducing protrusions and within die thickness variation...
- Publication number 20060091018
- Publication date May 4, 2006
- Yang Cao
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for improving electroplating in sub-0.1um interconnects by a...
- Publication number 20060006071
- Publication date Jan 12, 2006
- Guangli Che
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Substantially void free interconnect formation
- Publication number 20050285269
- Publication date Dec 29, 2005
- Yang Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Modified electroplating solution components in a low-acid electroly...
- Publication number 20050274619
- Publication date Dec 15, 2005
- Daniel J. Zierath
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Seed layer treatment
- Publication number 20050112856
- Publication date May 26, 2005
- Valery M. Dubin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Modified electroplating solution components in a low-acid electroly...
- Publication number 20050077181
- Publication date Apr 14, 2005
- Daniel J. Zierath
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for improving electroplating in sub-0.1um interconnects by a...
- Publication number 20040245107
- Publication date Dec 9, 2004
- Guangli Che
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Methods for reducing protrusions and within die thickness variation...
- Publication number 20040188265
- Publication date Sep 30, 2004
- Yang Cao
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Seed layer treatment
- Publication number 20040058139
- Publication date Mar 25, 2004
- Valery M. Dubin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Apparatus and method of surface treatment for electrolytic and elec...
- Publication number 20030034251
- Publication date Feb 20, 2003
- Vinay B. Chikarmane
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Vinay Chikarmane

Person

Patents Grantslast 30 patents

Heterogeneous metal line compositions for advanced integrated circu...

Heterogeneous metal line compositions for advanced integrated circu...

Heterogeneous metal line compositions for advanced integrated circu...

Heterogeneous metal line compositions for advanced integrated circu...

Stressed barrier plug slot contact structure for transistor perform...

Stressed barrier plug slot contact structure for transistor perform...

Stressed barrier plug slot contact structure for transistor perform...

Barrier formation and structure to use in semiconductor devices

Method for manufacturing a semiconductor device using the self alig...

Tuned tensile stress low resistivity slot contact structure for n-t...

Reducing corrosion in copper damascene processes

Barrier process/structure for transistor trench contact applications

Modified electroplating solution components in a low-acid electroly...

Apparatus and method of surface treatment for electrolytic and elec...

Seed layer treatment

Low temperature aluminum alloy plug technology

Patents Applicationslast 30 patents

HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...

HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...

HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...

HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...

HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...

STRESSED BARRIER PLUG SLOT CONTACT STRUCTURE FOR TRANSISTOR PERFORM...

STRESSED BARRIER PLUG SLOT CONTACT STRUCTURE FOR TRANSISTOR PERFORM...

Barrier process/structure for transistor trench contact applications

Method of manufacturing a semiconductor device using the self align...

Tuned tensile stress low resistivity slot contact structure for n-t...

Stressed barrier plug slot contact structure for transistor perform...

Barrier formation and structure to use in semiconductor devices

Through contact layer opening silicide and barrier layer formation

Barrier process/structure for transistor trench contact applications

Reducing corrosion in copper damascene processes

Methods for reducing protrusions and within die thickness variation...

Method for improving electroplating in sub-0.1um interconnects by a...

Substantially void free interconnect formation

Modified electroplating solution components in a low-acid electroly...

Seed layer treatment

Modified electroplating solution components in a low-acid electroly...

Method for improving electroplating in sub-0.1um interconnects by a...

Methods for reducing protrusions and within die thickness variation...

Seed layer treatment

Apparatus and method of surface treatment for electrolytic and elec...