Vinayak K. Shamanna

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Memory arrays comprising strings of memory cells and methods used i...
- Patent number 12,089,403
- Issue date Sep 10, 2024
- M. Jared Barclay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated structures including material containing silicon, nitrog...
- Patent number 11,937,429
- Issue date Mar 19, 2024
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies, and methods of forming integrated assemblies
- Patent number 11,744,076
- Issue date Aug 29, 2023
- Micron Technology, Inc.
- Vinayak Shamanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 11,600,630
- Issue date Mar 7, 2023
- Micron Technology, Inc.
- Jordan D. Greenlee
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated assemblies, and methods of forming integrated assemblies
- Patent number 11,380,705
- Issue date Jul 5, 2022
- Micron Technology, Inc.
- Vinayak Shamanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods used in forming a memory array comprising strings of memory...
- Patent number 11,271,002
- Issue date Mar 8, 2022
- Micron Technology, Inc.
- M. Jared Barclay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated structures including material containing silicon, nitrog...
- Patent number 11,239,252
- Issue date Feb 1, 2022
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming an array of elevationally-extending strings of m...
- Patent number 10,727,242
- Issue date Jul 28, 2020
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated structures including material containing silicon, nitrog...
- Patent number 10,720,446
- Issue date Jul 21, 2020
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming an array of elevationally-extending strings of m...
- Patent number 10,263,007
- Issue date Apr 16, 2019
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated structures including material containing silicon, nitrog...
- Patent number 10,157,933
- Issue date Dec 18, 2018
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming an array of elevationally-extending strings of m...
- Patent number 10,014,309
- Issue date Jul 3, 2018
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming air gaps in memory arrays and memory arrays with air gaps t...
- Patent number 9,397,210
- Issue date Jul 19, 2016
- Micron Technology, Inc.
- James Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of etch process post wordline definition to improve data retent...
- Patent number 9,082,714
- Issue date Jul 14, 2015
- Intel Corporation
- Randy J. Koval
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming air gaps in memory arrays and memory arrays with air gaps t...
- Patent number 8,569,130
- Issue date Oct 29, 2013
- Micron Technology, Inc.
- James Mathew
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20230164991
- Publication date May 25, 2023
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuitry Comprising A Memory Array Comprising Strings O...
- Publication number 20230039517
- Publication date Feb 9, 2023
- Micron Technology, Inc.
- Alyssa N. Scarbrough
- G11 - INFORMATION STORAGE
Information Patent Application
Integrated Assemblies, and Methods of Forming Integrated Assemblies
- Publication number 20220293631
- Publication date Sep 15, 2022
- Micron Technology, Inc.
- Vinayak Shamanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...
- Publication number 20220157844
- Publication date May 19, 2022
- Micron Technology, Inc.
- M. Jared Barclay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Structures Including Material Containing Silicon, Nitrog...
- Publication number 20220115401
- Publication date Apr 14, 2022
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20220045075
- Publication date Feb 10, 2022
- Micron Technology, Inc.
- Jordan D. Greenlee
- G11 - INFORMATION STORAGE
Information Patent Application
Integrated Assemblies, and Methods of Forming Integrated Assemblies
- Publication number 20210249433
- Publication date Aug 12, 2021
- Micron Technology, Inc.
- Vinayak Shamanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...
- Publication number 20200328222
- Publication date Oct 15, 2020
- Micron Technology, Inc.
- M. Jared Barclay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Structures Including Material Containing Silicon, Nitrog...
- Publication number 20200321352
- Publication date Oct 8, 2020
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods Of Forming An Array Of Elevationally-Extending Strings Of M...
- Publication number 20190229127
- Publication date Jul 25, 2019
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Structures Including Material Containing Silicon, Nitrog...
- Publication number 20190043890
- Publication date Feb 7, 2019
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods Of Forming An Array Of Elevationally-Extending Strings Of M...
- Publication number 20180286879
- Publication date Oct 4, 2018
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods Of Forming An Array Of Elevationally-Extending Strings Of M...
- Publication number 20180047739
- Publication date Feb 15, 2018
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Structures Including Material Containing Silicon, Nitrog...
- Publication number 20170301685
- Publication date Oct 19, 2017
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING AIR GAPS IN MEMORY ARRAYS AND MEMORY ARRAYS WITH AIR GAPS T...
- Publication number 20140027832
- Publication date Jan 30, 2014
- Micron Technology, Inc.
- James Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
USE OF ETCH PROCESS POST WORDLINE DEFINITION TO IMPROVE DATA RETENT...
- Publication number 20130264628
- Publication date Oct 10, 2013
- Randy J. Koval
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING AIR GAPS IN MEMORY ARRAYS AND MEMORY ARRAYS WITH AIR GAPS T...
- Publication number 20130026600
- Publication date Jan 31, 2013
- Micron Technology, Inc.
- James Matthew
- H01 - BASIC ELECTRIC ELEMENTS

Vinayak K. Shamanna

Person

Patents Grantslast 30 patents

Memory arrays comprising strings of memory cells and methods used i...

Integrated structures including material containing silicon, nitrog...

Integrated assemblies, and methods of forming integrated assemblies

Integrated assemblies and methods of forming integrated assemblies

Integrated assemblies, and methods of forming integrated assemblies

Methods used in forming a memory array comprising strings of memory...

Integrated structures including material containing silicon, nitrog...

Methods of forming an array of elevationally-extending strings of m...

Integrated structures including material containing silicon, nitrog...

Methods of forming an array of elevationally-extending strings of m...

Integrated structures including material containing silicon, nitrog...

Methods of forming an array of elevationally-extending strings of m...

Forming air gaps in memory arrays and memory arrays with air gaps t...

Use of etch process post wordline definition to improve data retent...

Forming air gaps in memory arrays and memory arrays with air gaps t...

Patents Applicationslast 30 patents

Integrated Assemblies and Methods of Forming Integrated Assemblies

Integrated Circuitry Comprising A Memory Array Comprising Strings O...

Integrated Assemblies, and Methods of Forming Integrated Assemblies

Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...

Integrated Structures Including Material Containing Silicon, Nitrog...

Integrated Assemblies and Methods of Forming Integrated Assemblies

Integrated Assemblies, and Methods of Forming Integrated Assemblies

Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...

Integrated Structures Including Material Containing Silicon, Nitrog...

Methods Of Forming An Array Of Elevationally-Extending Strings Of M...

Integrated Structures Including Material Containing Silicon, Nitrog...

Methods Of Forming An Array Of Elevationally-Extending Strings Of M...

Methods Of Forming An Array Of Elevationally-Extending Strings Of M...

Integrated Structures Including Material Containing Silicon, Nitrog...

FORMING AIR GAPS IN MEMORY ARRAYS AND MEMORY ARRAYS WITH AIR GAPS T...

USE OF ETCH PROCESS POST WORDLINE DEFINITION TO IMPROVE DATA RETENT...

FORMING AIR GAPS IN MEMORY ARRAYS AND MEMORY ARRAYS WITH AIR GAPS T...