Vincent A. Pillai

Person

Irvine, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Phase mask laser fabrication of fine pattern electronic interconnec...
- Patent number 5,840,622
- Issue date Nov 24, 1998
- Raytheon Company
- Robert S. Miles
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Phase mask laser fabrication of fine pattern electronic interconnec...
- Patent number 5,827,775
- Issue date Oct 27, 1998
- Raytheon Comapny
- Robert S. Miles
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Methods of forming two-sided HDMI interconnect structures
- Patent number 5,691,245
- Issue date Nov 25, 1997
- HE Holdings, Inc.
- Gabriel G. Bakhit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating metallized substrates using an organic etch b...
- Patent number 5,474,956
- Issue date Dec 12, 1995
- Hughes Aircraft Company
- Philip A. Trask
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrical interconnection substrate with both wire bond and solder...
- Patent number 5,445,311
- Issue date Aug 29, 1995
- Hughes Aircraft Company
- Philip A. Trask
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical interconnection substrate with both wire bond and solder...
- Patent number 5,311,404
- Issue date May 10, 1994
- Hughes Aircraft Company
- Philip A. Trask
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming an electrical via structure
- Patent number 5,034,091
- Issue date Jul 23, 1991
- Hughes Aircraft Company
- Philip A. Trask
- H01 - BASIC ELECTRIC ELEMENTS

Vincent A. Pillai

Person

Patents Grantslast 30 patents

Phase mask laser fabrication of fine pattern electronic interconnec...

Phase mask laser fabrication of fine pattern electronic interconnec...

Methods of forming two-sided HDMI interconnect structures

Method of fabricating metallized substrates using an organic etch b...

Electrical interconnection substrate with both wire bond and solder...

Electrical interconnection substrate with both wire bond and solder...

Method of forming an electrical via structure