Vincent Chen

Person

Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of a semiconductor device
- Patent number 12,046,480
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shou Zen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Loudspeaker vibrating membrane with hard property and elastic soft...
- Patent number 11,716,582
- Issue date Aug 1, 2023
- Vincent Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Loudspeaker having damper with woven wire and method for manufactur...
- Patent number 11,317,229
- Issue date Apr 26, 2022
- Vincent Chen
- D06 - TREATMENT OF TEXTILES OR THE LIKE LAUNDERING FLEXIBLE MATERIALS NOT OTH...
Information Patent Grant
Loudspeaker having damper with wire fixed by sewing thread
- Patent number 11,317,230
- Issue date Apr 26, 2022
- Vincent Chen
- D03 - WEAVING
Information Patent Grant
Semiconductor device
- Patent number 11,211,339
- Issue date Dec 28, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices and packaging methods
- Patent number 11,211,358
- Issue date Dec 28, 2021
- Taiwwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Chun Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,004,811
- Issue date May 11, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Vincent Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 10,763,229
- Issue date Sep 1, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Vincent Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,727,082
- Issue date Jul 28, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shou Zen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices and packaging methods
- Patent number 10,510,714
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Chun Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,510,681
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package devices integrated with inductor
- Patent number 10,510,660
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wei-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 10,475,755
- Issue date Nov 12, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Vincent Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package structure, antenna system and associated method
- Patent number 10,128,203
- Issue date Nov 13, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wei-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor structure
- Patent number 10,115,685
- Issue date Oct 30, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Vincent Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
InFO coil on metal plate with slot
- Patent number 10,074,472
- Issue date Sep 11, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices and packaging methods
- Patent number 10,050,013
- Issue date Aug 14, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Chun Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package devices integrated with inductor
- Patent number 10,043,745
- Issue date Aug 7, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wei-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,043,761
- Issue date Aug 7, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 9,953,936
- Issue date Apr 24, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Vincent Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for transistor voltage control
- Patent number 9,866,018
- Issue date Jan 9, 2018
- Dell Products, L.P.
- Wickman (Feng-Yu) Wu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device having a guard ring
- Patent number 9,659,879
- Issue date May 23, 2017
- Taiwan Semiconductor Manufacturing Company
- Ching-Feng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 9,601,439
- Issue date Mar 21, 2017
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tzu-Chun Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Security management device, communication system, and access contro...
- Patent number 8,195,816
- Issue date Jun 5, 2012
- Trend Micro Incorporated
- Yuji Yamasaki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Assembly structure of electronic card
- Patent number 7,075,792
- Issue date Jul 11, 2006
- Longwell Company
- Tien-Chih Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for CMP removal rate compensation
- Patent number 7,071,106
- Issue date Jul 4, 2006
- Taiwan Semiconductor Manufacturing Company
- Yen Chuang
- B24 - GRINDING POLISHING
Information Patent Grant
Assembly structure of electronic card
- Patent number 6,853,550
- Issue date Feb 8, 2005
- Longwell Company
- Tien-Chih Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wind turbine
- Patent number 4,208,168
- Issue date Jun 17, 1980
- Jimmy M. Chen
- F03 - MACHINES OR ENGINES FOR LIQUIDS WIND, SPRING WEIGHT AND MISCELLANEOUS M...

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE
- Publication number 20240379382
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- SHOU ZEN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOUDSPEAKER VIBRATING MEMBRANE WITH HARD PROPERTY AND ELASTIC SOFT...
- Publication number 20230239640
- Publication date Jul 27, 2023
- Vincent Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD FOR MANUFACTURING LOUDSPEAKER HAVING WIRE DAMPER WITH LOCALL...
- Publication number 20230164505
- Publication date May 25, 2023
- Vincent Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
LOUDSPEAKER HAVING WIRE DAMPER WITH LOCALLY ADJUSTABLE ELASTICITY A...
- Publication number 20220174441
- Publication date Jun 2, 2022
- Vincent Chen
- D03 - WEAVING
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20200388584
- Publication date Dec 10, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- VINCENT CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE
- Publication number 20200357659
- Publication date Nov 12, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- SHOU ZEN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Semiconductor Devices and Packaging Methods
- Publication number 20200118971
- Publication date Apr 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Chun Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200111753
- Publication date Apr 9, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUEI-TANG WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20200075516
- Publication date Mar 5, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- VINCENT CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20190067222
- Publication date Feb 28, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- VINCENT CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Semiconductor Devices and Packaging Methods
- Publication number 20180350771
- Publication date Dec 6, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Chun Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICES INTEGRATED WITH INDUCTOR
- Publication number 20180350740
- Publication date Dec 6, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- WEI-TING CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180350752
- Publication date Dec 6, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUEI-TANG WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR STRUCTURE
- Publication number 20180226368
- Publication date Aug 9, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- VINCENT CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICES INTEGRATED WITH INDUCTOR
- Publication number 20170287832
- Publication date Oct 5, 2017
- Taiwan Semiconductor Manufacturing company Ltd.
- WEI-TING CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGE STRUCTURE, ANTENNA SYSTEM AND ASSOCIATED METHOD
- Publication number 20170221838
- Publication date Aug 3, 2017
- Taiwan Semiconductor Manufacturing company Ltd.
- WEI-TING CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Semiconductor Devices and Packaging Methods
- Publication number 20170186726
- Publication date Jun 29, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Chun Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
InFO Coil on Metal Plate with Slot
- Publication number 20170171979
- Publication date Jun 15, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A GUARD RING
- Publication number 20170125356
- Publication date May 4, 2017
- Taiwan Semiconductor Manufacturing company Ltd.
- CHING-FENG YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20170126047
- Publication date May 4, 2017
- Taiwan Semiconductor Manufacturing company Ltd.
- VINCENT CHEN
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
System and Method for Transistor Voltage Control
- Publication number 20170117706
- Publication date Apr 27, 2017
- DELL PRODUCTS, L.P.
- Wickman (Feng-Yu) Wu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20170110412
- Publication date Apr 20, 2017
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUEI-TANG WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20170062353
- Publication date Mar 2, 2017
- Taiwan Semiconductor Manufacturing company Ltd.
- TZU-CHUN TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20170062360
- Publication date Mar 2, 2017
- Taiwan Semiconductor Manufacturing company Ltd.
- SHOU ZEN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DAMPER STRUCTURE FOR SPEAKER SYSTEM
- Publication number 20140073213
- Publication date Mar 13, 2014
- Vincent Chen
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Security Management Device, Communication System, and Access Contro...
- Publication number 20090089426
- Publication date Apr 2, 2009
- Trend Micro Incorporated
- Yuji Yamasaki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Method for CMP removal rate compensation
- Publication number 20050124165
- Publication date Jun 9, 2005
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen Chuang
- B24 - GRINDING POLISHING
Information Patent Application
Assembly structure of electronic card
- Publication number 20040114314
- Publication date Jun 17, 2004
- Tien-Chih Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Assembly structure of electronic card
- Publication number 20030231472
- Publication date Dec 18, 2003
- Tien-Chih Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Vincent Chen

Person

Patents Grantslast 30 patents

Manufacturing method of a semiconductor device

Loudspeaker vibrating membrane with hard property and elastic soft...

Loudspeaker having damper with woven wire and method for manufactur...

Loudspeaker having damper with wire fixed by sewing thread

Semiconductor device

Packaged semiconductor devices and packaging methods

Semiconductor structure

Semiconductor structure

Semiconductor device and manufacturing method thereof

Packaged semiconductor devices and packaging methods

Semiconductor device

Semiconductor package devices integrated with inductor

Semiconductor structure

Fan-out package structure, antenna system and associated method

Method of manufacturing a semiconductor structure

InFO coil on metal plate with slot

Packaged semiconductor devices and packaging methods

Semiconductor package devices integrated with inductor

Semiconductor device and manufacturing method thereof

Semiconductor structure and manufacturing method thereof

System and method for transistor voltage control

Semiconductor device having a guard ring

Semiconductor structure and manufacturing method thereof

Security management device, communication system, and access contro...

Assembly structure of electronic card

Method for CMP removal rate compensation

Assembly structure of electronic card

Wind turbine

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE

LOUDSPEAKER VIBRATING MEMBRANE WITH HARD PROPERTY AND ELASTIC SOFT...

METHOD FOR MANUFACTURING LOUDSPEAKER HAVING WIRE DAMPER WITH LOCALL...

LOUDSPEAKER HAVING WIRE DAMPER WITH LOCALLY ADJUSTABLE ELASTICITY A...

SEMICONDUCTOR STRUCTURE

MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE

Packaged Semiconductor Devices and Packaging Methods

SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR STRUCTURE

Packaged Semiconductor Devices and Packaging Methods

SEMICONDUCTOR PACKAGE DEVICES INTEGRATED WITH INDUCTOR

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING A SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR PACKAGE DEVICES INTEGRATED WITH INDUCTOR

FAN-OUT PACKAGE STRUCTURE, ANTENNA SYSTEM AND ASSOCIATED METHOD

Packaged Semiconductor Devices and Packaging Methods

InFO Coil on Metal Plate with Slot

SEMICONDUCTOR DEVICE HAVING A GUARD RING

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

System and Method for Transistor Voltage Control

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

DAMPER STRUCTURE FOR SPEAKER SYSTEM

Security Management Device, Communication System, and Access Contro...

Method for CMP removal rate compensation

Assembly structure of electronic card

Assembly structure of electronic card