Vincent M. K. Chan

Person

Richmond Hill, CA

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package strip with stiffener
- Patent number 8,847,383
- Issue date Sep 30, 2014
- ATI Technologies ULC
- Neil R. McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip semiconductor assembly with variable volume solder bumps
- Patent number 8,637,391
- Issue date Jan 28, 2014
- ATI Technologies ULC
- Vincent K. Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip bump connection apparatus and method
- Patent number 8,378,471
- Issue date Feb 19, 2013
- ATI Technologies ULC
- Roden R. Topacio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated package circuit with stiffener
- Patent number 8,120,170
- Issue date Feb 21, 2012
- ATI Technologies ULC
- Neil R. McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for making semiconductor packages
- Patent number 7,985,621
- Issue date Jul 26, 2011
- ATI Technologies ULC
- Vincent K. Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stacking apparatus and method
- Patent number 7,969,020
- Issue date Jun 28, 2011
- Advanced Micro Devices, Inc.
- Vincent Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stacking apparatus and method
- Patent number 7,799,608
- Issue date Sep 21, 2010
- Advanced Micro Devices, Inc.
- Vincent Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip bump connection apparatus and method
- Patent number 7,670,939
- Issue date Mar 2, 2010
- ATI Technologies ULC
- Roden R. Topacio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-die module
- Patent number 7,215,022
- Issue date May 8, 2007
- ATI Technologies Inc.
- Vincent Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-die module and method thereof
- Patent number 6,929,976
- Issue date Aug 16, 2005
- ATI Technologies, Inc.
- Vincent Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package for the transfer of heat generated by th...
- Patent number 6,849,940
- Issue date Feb 1, 2005
- ATI Technologies, Inc.
- Vincent K. Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball collapse control apparatus and method thereof
- Patent number 6,798,667
- Issue date Sep 28, 2004
- ATI Technologies, Inc.
- Vincent K. Chan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CLOCK RECOVERY FOR MEDIA STREAM IN BURSTY NETWORK CHANNEL
- Publication number 20150030088
- Publication date Jan 29, 2015
- VIXS SYSTEMS INC.
- Vincent M. K. Chan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
INTEGRATED PACKAGE CIRCUIT WITH STIFFENER
- Publication number 20120127689
- Publication date May 24, 2012
- ATI Technologies ULC
- Neil R. McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STACKING APPARATUS AND METHOD
- Publication number 20100320599
- Publication date Dec 23, 2010
- Vincent Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP BUMP CONNECTION APPARATUS AND METHOD
- Publication number 20100140798
- Publication date Jun 10, 2010
- Roden R. Topacio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Chip Bump Connection Apparatus and Method
- Publication number 20090278264
- Publication date Nov 12, 2009
- Roden R. Topacio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP CHIP SEMICONDUCTOR ASSEMBLY WITH VARIABLE VOLUME SOLDER BUMPS
- Publication number 20090218689
- Publication date Sep 3, 2009
- ATI Technologies ULC
- Vincent K. CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Stacking Apparatus and Method
- Publication number 20090032971
- Publication date Feb 5, 2009
- Vincent Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SUBSTRATE WITH PLATED THROUGH HOLE STRUCTURE AND METHOD
- Publication number 20080245555
- Publication date Oct 9, 2008
- ATI Technologies ULC
- Yue Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flip-Chip Grid Ball Array Strip and Package
- Publication number 20080197477
- Publication date Aug 21, 2008
- ATI Technologies Inc.
- Neil R. McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANCHOR STRUCTURE FOR AN INTEGRATED CIRCUIT
- Publication number 20080169555
- Publication date Jul 17, 2008
- ATI Technologies ULC
- Roden R. Topacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip-Chip Semiconductor Package with Encapsulant Retaining Structur...
- Publication number 20080099910
- Publication date May 1, 2008
- ATI Technologies Inc.
- Neil McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR MAKING SEMICONDUCTOR PACKAGES
- Publication number 20080057625
- Publication date Mar 6, 2008
- ATI Technologies Inc.
- Vincent K. Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip-Chip Ball Grid Array Strip and Package
- Publication number 20080054490
- Publication date Mar 6, 2008
- ATI Technologies Inc.
- Neil R. McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP SEMICONDUCTOR ASSEMBLY WITH VARIABLE VOLUME SOLDER BUMPS
- Publication number 20080048321
- Publication date Feb 28, 2008
- ATI Technologies Inc.
- Vincent K. Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for a stacked die configuration
- Publication number 20060051912
- Publication date Mar 9, 2006
- ATI Technologies Inc.
- Vincent K. Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit package and method for making same that employs...
- Publication number 20040241906
- Publication date Dec 2, 2004
- Vincent Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-die module and method thereof
- Publication number 20040106230
- Publication date Jun 3, 2004
- Vincent Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder ball collapse control apparatus and method thereof
- Publication number 20040037060
- Publication date Feb 26, 2004
- ATI Technologies, Inc.
- Vincent K. Chan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Direct interconnect multi-chip module, method for making the same a...
- Publication number 20030089998
- Publication date May 15, 2003
- Vincent K. Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-die module and method thereof
- Publication number 20020195704
- Publication date Dec 26, 2002
- Vincent Chan
- H01 - BASIC ELECTRIC ELEMENTS

Vincent M. K. Chan

Person

Patents Grantslast 30 patents

Integrated circuit package strip with stiffener

Flip chip semiconductor assembly with variable volume solder bumps

Semiconductor chip bump connection apparatus and method

Integrated package circuit with stiffener

Method and apparatus for making semiconductor packages

Die stacking apparatus and method

Die stacking apparatus and method

Semiconductor chip bump connection apparatus and method

Multi-die module

Multi-die module and method thereof

Integrated circuit package for the transfer of heat generated by th...

Solder ball collapse control apparatus and method thereof

Patents Applicationslast 30 patents

CLOCK RECOVERY FOR MEDIA STREAM IN BURSTY NETWORK CHANNEL

INTEGRATED PACKAGE CIRCUIT WITH STIFFENER

DIE STACKING APPARATUS AND METHOD

SEMICONDUCTOR CHIP BUMP CONNECTION APPARATUS AND METHOD

Semiconductor Chip Bump Connection Apparatus and Method

FLIP CHIP SEMICONDUCTOR ASSEMBLY WITH VARIABLE VOLUME SOLDER BUMPS

Die Stacking Apparatus and Method

CIRCUIT SUBSTRATE WITH PLATED THROUGH HOLE STRUCTURE AND METHOD

Flip-Chip Grid Ball Array Strip and Package

ANCHOR STRUCTURE FOR AN INTEGRATED CIRCUIT

Flip-Chip Semiconductor Package with Encapsulant Retaining Structur...

METHOD AND APPARATUS FOR MAKING SEMICONDUCTOR PACKAGES

Flip-Chip Ball Grid Array Strip and Package

FLIP CHIP SEMICONDUCTOR ASSEMBLY WITH VARIABLE VOLUME SOLDER BUMPS

Method and apparatus for a stacked die configuration

Integrated circuit package and method for making same that employs...

Multi-die module and method thereof

Solder ball collapse control apparatus and method thereof

Direct interconnect multi-chip module, method for making the same a...

Multi-die module and method thereof