Membership
Tour
Register
Log in
Vincent Paneccasio, JR.
Follow
Person
Madison, CT, US
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Surface preparation process for damascene copper deposition
Patent number
7,998,859
Issue date
Aug 16, 2011
Enthone Inc.
Qingyun Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Copper electrodeposition in microelectronics
Patent number
7,815,786
Issue date
Oct 19, 2010
Enthone Inc.
Vincent Paneccasio, Jr.
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Copper metallization of through silicon via
Patent number
7,670,950
Issue date
Mar 2, 2010
Enthone Inc.
Thomas B. Richardson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Cobalt and nickel electroless plating in microelectronic devices
Patent number
7,332,193
Issue date
Feb 19, 2008
Enthone, Inc.
Charles Valverde
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Patents Applications
last 30 patents
Information
Patent Application
COPPER ELECTRODEPOSITION IN MICROELECTRONICS
Publication number
20120043218
Publication date
Feb 23, 2012
Enthone Inc.
Vincent Paneccasio, JR.
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
COPPER DEPOSITION FOR FILLING FEATURES IN MANUFACTURE OF MICROELECT...
Publication number
20100285660
Publication date
Nov 11, 2010
Enthone Inc.
Xuan Lin
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
ELECTRODEPOSITION OF COPPER IN MICROELECTRONICS WITH DIPYRIDYL-BASE...
Publication number
20100126872
Publication date
May 27, 2010
ENTHONE, INC.
Vincent Paneccasio, JR.
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
SURFACE PREPARATION PROCESS FOR DAMASCENE COPPER DEPOSITION
Publication number
20100075496
Publication date
Mar 25, 2010
Enthone Inc.
Qingyun Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COPPER METALLIZATION OF THROUGH SILICON VIA
Publication number
20090035940
Publication date
Feb 5, 2009
Enthone Inc.
Thomas B. Richardson
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR