Vincent Paneccasio Jr.

Person

Madison, CT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Copper deposition in wafer level packaging of integrated circuits
- Patent number 11,697,884
- Issue date Jul 11, 2023
- MacDermid Enthone Inc.
- Thomas Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper electrodeposition in microelectronics
- Patent number RE49202
- Issue date Sep 6, 2022
- MacDermid Enthone Inc.
- Vincent Paneccasio
Information Patent Grant
Cobalt filling of interconnects in microelectronics
- Patent number 11,434,578
- Issue date Sep 6, 2022
- MacDermid Enthone Inc.
- John Commander
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Cobalt filling of interconnects
- Patent number 11,401,618
- Issue date Aug 2, 2022
- MacDermid Enthone Inc.
- John Commander
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Leveler compositions for use in copper deposition in manufacture of...
- Patent number 11,168,406
- Issue date Nov 9, 2021
- MacDermid Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper deposition in wafer level packaging of integrated circuits
- Patent number 11,124,888
- Issue date Sep 21, 2021
- MacDermid Enthone Inc.
- Thomas Richardson
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Cobalt filling of interconnects
- Patent number 11,035,048
- Issue date Jun 15, 2021
- MacDermid Enthone Inc.
- John Commander
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Cobalt filling of interconnects in microelectronics
- Patent number 10,995,417
- Issue date May 4, 2021
- MacDermid Enthone Inc.
- John Commander
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Process for filling vias in the microelectronics
- Patent number 10,541,140
- Issue date Jan 21, 2020
- MacDermid Enthone Inc.
- Thomas B. Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Leveler compositions for use in copper deposition in manufacture of...
- Patent number 10,519,557
- Issue date Dec 31, 2019
- MacDermid Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Levelers for copper deposition in microelectronics
- Patent number 10,294,574
- Issue date May 21, 2019
- MacDermid Enthone Inc.
- Kyle Whitten
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper filling of through silicon vias
- Patent number 10,221,496
- Issue date Mar 5, 2019
- MacDermid Enthone Inc.
- Thomas B. Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Process for filling vias in the microelectronics
- Patent number 10,103,029
- Issue date Oct 16, 2018
- MacDermid Enthone Inc.
- Thomas B. Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and composition for electrodeposition of copper in microelec...
- Patent number 9,613,858
- Issue date Apr 4, 2017
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper electrodeposition in microelectronics
- Patent number 9,493,884
- Issue date Nov 15, 2016
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Defect reduction in electrodeposited copper for semiconductor appli...
- Patent number 9,222,188
- Issue date Dec 29, 2015
- Enthone Inc.
- John Commander
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and composition for electrodeposition of copper in microelec...
- Patent number 8,771,495
- Issue date Jul 8, 2014
- Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper electrodeposition in microelectronics
- Patent number 8,608,933
- Issue date Dec 17, 2013
- Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and composition for electrodeposition of copper in microelec...
- Patent number 8,388,824
- Issue date Mar 5, 2013
- Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper electrodeposition in microelectronics
- Patent number 8,002,962
- Issue date Aug 23, 2011
- Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper deposition for filling features in manufacture of microelect...
- Patent number 7,968,455
- Issue date Jun 28, 2011
- Enthone Inc.
- Xuan Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Manufacture of electroless cobalt deposition compositions for micro...
- Patent number 7,704,306
- Issue date Apr 27, 2010
- Enthone Inc.
- Qingyun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Defectivity and process control of electroless deposition in microe...
- Patent number 7,615,491
- Issue date Nov 10, 2009
- Enthone Inc.
- Qingyun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Defectivity and process control of electroless deposition in microe...
- Patent number 7,611,987
- Issue date Nov 3, 2009
- Enthone Inc.
- Qingyun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Defectivity and process control of electroless deposition in microe...
- Patent number 7,611,988
- Issue date Nov 3, 2009
- Enthone Inc.
- Qingyun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Defectivity and process control of electroless deposition in microe...
- Patent number 7,410,899
- Issue date Aug 12, 2008
- Enthone, Inc.
- Qingyun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Defect reduction in electrodeposited copper for semiconductor appli...
- Patent number 7,316,772
- Issue date Jan 8, 2008
- Enthone Inc.
- John Commander
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper electrodeposition in microelectronics
- Patent number 7,303,992
- Issue date Dec 4, 2007
- Enthone Inc.
- Vincent Paneccasio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroplating chemistry for the CU filling of submicron features o...
- Patent number 6,776,893
- Issue date Aug 17, 2004
- Enthone Inc.
- Elena H. Too
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for applying a conductive paint coating and articles made th...
- Patent number 6,375,866
- Issue date Apr 23, 2002
- Enthone, Inc.
- Vincent Paneccasio
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
Copper Electrodeposition in Microelectronics
- Publication number 20240018678
- Publication date Jan 18, 2024
- MacDermid Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Composition and Method for Fabrication of Nickel Interconnects
- Publication number 20220064811
- Publication date Mar 3, 2022
- MacDermid Enthone Inc.
- Eric Yakobson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper Deposition in Wafer Level Packaging of Integrated Circuits
- Publication number 20210388519
- Publication date Dec 16, 2021
- MacDermid Enthone Inc.
- Thomas Richardson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cobalt Filling of Interconnects
- Publication number 20210332491
- Publication date Oct 28, 2021
- MacDermid Enthone Inc.
- John Commander
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Leveler Compositions for use in Copper Deposition in Manufacture of...
- Publication number 20210310141
- Publication date Oct 7, 2021
- MacDermid Enthone Inc.
- Vincent Paneccasio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cobalt Filling of Interconnects in Microelectronics
- Publication number 20210222314
- Publication date Jul 22, 2021
- MacDermid Enthone Inc.
- John Commander
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Leveler Compositions for use in Copper Deposition in Manufacture of...
- Publication number 20200063280
- Publication date Feb 27, 2020
- MacDermid Enthone Inc.
- Vincent Paneccasio
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Cobalt Filling of Interconnects in Microelectronics
- Publication number 20200040478
- Publication date Feb 6, 2020
- MacDermid Enthone Inc.
- John Commander
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper Electrodeposition in Microelectronics
- Publication number 20190390356
- Publication date Dec 26, 2019
- MacDermid Enthone Inc.
- Vincent Paneccasio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper Deposition in Wafer Level Packaging of Integrated Circuits
- Publication number 20190368064
- Publication date Dec 5, 2019
- MacDermid Enthone Inc.
- Thomas Richardson
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Cobalt Filling of Interconnects
- Publication number 20190010624
- Publication date Jan 10, 2019
- MacDermid Enthone Inc.
- John Commander
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER FILLING OF THROUGH SILICON VIAS
- Publication number 20190003068
- Publication date Jan 3, 2019
- Enthone Inc.
- Thomas B. Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Leveler Compositions for Use in Copper Deposition in Manufacture of...
- Publication number 20170233883
- Publication date Aug 17, 2017
- MacDermid Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper Electrodeposition in Microelectronics
- Publication number 20170029972
- Publication date Feb 2, 2017
- Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrodeposition of Copper
- Publication number 20160281251
- Publication date Sep 29, 2016
- Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Process for Filling Vias in the Microelectronics
- Publication number 20160254156
- Publication date Sep 1, 2016
- Enthone Inc.
- Thomas B. Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LEVELERS FOR COPPER DEPOSITION IN MICROELECTRONICS
- Publication number 20160076160
- Publication date Mar 17, 2016
- Enthone Inc.
- Kyle Whitten
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND COMPOSITION FOR ELECTRODEPOSITION OF COPPER IN MICROELEC...
- Publication number 20140322912
- Publication date Oct 30, 2014
- Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PROCESS FOR FILLING VIAS IN THE MICROELECTRONICS
- Publication number 20140120722
- Publication date May 1, 2014
- Enthone Inc.
- Thomas B. Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER ELECTRODEPOSITION IN MICROELECTRONICS
- Publication number 20140102909
- Publication date Apr 17, 2014
- Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND COMPOSITION FOR ELECTRODEPOSITION OF COPPER IN MICROELEC...
- Publication number 20130241060
- Publication date Sep 19, 2013
- Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER FILLING OF THROUGH SILICON VIAS
- Publication number 20130199935
- Publication date Aug 8, 2013
- Enthone Inc.
- Thomas B. Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COBALT CAPPING SURFACE PREPARATION IN MICROELECTRONICS MANUFACTURE
- Publication number 20080236619
- Publication date Oct 2, 2008
- Enthone Inc.
- Qingyun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEFECT REDUCTION IN ELECTRODEPOSITED COPPER FOR SEMICONDUCTOR APPLI...
- Publication number 20080121527
- Publication date May 29, 2008
- Enthone Inc.
- John Commander
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MANUFACTURE OF ELECTROLESS COBALT DEPOSITION COMPOSITIONS FOR MICRO...
- Publication number 20080090414
- Publication date Apr 17, 2008
- Enthone Inc.
- Qingyun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COPPER ELECTRODEPOSITION IN MICROELECTRONICS
- Publication number 20070289875
- Publication date Dec 20, 2007
- Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper electrodeposition in microelectronics
- Publication number 20070178697
- Publication date Aug 2, 2007
- Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Defectivity and process control of electroless deposition in microe...
- Publication number 20070066057
- Publication date Mar 22, 2007
- Enthone Inc.
- Qingyun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Defectivity and process control of electroless deposition in microe...
- Publication number 20070066059
- Publication date Mar 22, 2007
- Enthone Inc.
- Qingyun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Defectivity and process control of electroless deposition in microe...
- Publication number 20070062408
- Publication date Mar 22, 2007
- Enthone Inc.
- Qingyun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Vincent Paneccasio Jr.

Person

Patents Grantslast 30 patents

Copper deposition in wafer level packaging of integrated circuits

Copper electrodeposition in microelectronics

Cobalt filling of interconnects in microelectronics

Cobalt filling of interconnects

Leveler compositions for use in copper deposition in manufacture of...

Copper deposition in wafer level packaging of integrated circuits

Cobalt filling of interconnects

Cobalt filling of interconnects in microelectronics

Process for filling vias in the microelectronics

Leveler compositions for use in copper deposition in manufacture of...

Levelers for copper deposition in microelectronics

Copper filling of through silicon vias

Process for filling vias in the microelectronics

Method and composition for electrodeposition of copper in microelec...

Copper electrodeposition in microelectronics

Defect reduction in electrodeposited copper for semiconductor appli...

Method and composition for electrodeposition of copper in microelec...

Copper electrodeposition in microelectronics

Method and composition for electrodeposition of copper in microelec...

Copper electrodeposition in microelectronics

Copper deposition for filling features in manufacture of microelect...

Manufacture of electroless cobalt deposition compositions for micro...

Defectivity and process control of electroless deposition in microe...

Defectivity and process control of electroless deposition in microe...

Defectivity and process control of electroless deposition in microe...

Defectivity and process control of electroless deposition in microe...

Defect reduction in electrodeposited copper for semiconductor appli...

Copper electrodeposition in microelectronics

Electroplating chemistry for the CU filling of submicron features o...

Method for applying a conductive paint coating and articles made th...

Patents Applicationslast 30 patents

Copper Electrodeposition in Microelectronics

Composition and Method for Fabrication of Nickel Interconnects

Copper Deposition in Wafer Level Packaging of Integrated Circuits

Cobalt Filling of Interconnects

Leveler Compositions for use in Copper Deposition in Manufacture of...

Cobalt Filling of Interconnects in Microelectronics

Leveler Compositions for use in Copper Deposition in Manufacture of...

Cobalt Filling of Interconnects in Microelectronics

Copper Electrodeposition in Microelectronics

Copper Deposition in Wafer Level Packaging of Integrated Circuits

Cobalt Filling of Interconnects

COPPER FILLING OF THROUGH SILICON VIAS

Leveler Compositions for Use in Copper Deposition in Manufacture of...

Copper Electrodeposition in Microelectronics

Electrodeposition of Copper

Process for Filling Vias in the Microelectronics

LEVELERS FOR COPPER DEPOSITION IN MICROELECTRONICS

METHOD AND COMPOSITION FOR ELECTRODEPOSITION OF COPPER IN MICROELEC...

PROCESS FOR FILLING VIAS IN THE MICROELECTRONICS

COPPER ELECTRODEPOSITION IN MICROELECTRONICS

METHOD AND COMPOSITION FOR ELECTRODEPOSITION OF COPPER IN MICROELEC...

COPPER FILLING OF THROUGH SILICON VIAS

COBALT CAPPING SURFACE PREPARATION IN MICROELECTRONICS MANUFACTURE

DEFECT REDUCTION IN ELECTRODEPOSITED COPPER FOR SEMICONDUCTOR APPLI...

MANUFACTURE OF ELECTROLESS COBALT DEPOSITION COMPOSITIONS FOR MICRO...

COPPER ELECTRODEPOSITION IN MICROELECTRONICS

Copper electrodeposition in microelectronics

Defectivity and process control of electroless deposition in microe...

Defectivity and process control of electroless deposition in microe...

Defectivity and process control of electroless deposition in microe...