Vinh D. Nguyen

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Bethlehem, PA, US

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Patents Grantslast 30 patents

Information Patent Grant
Thermal interface material containment
- Patent number 12,218,031
- Issue date Feb 4, 2025
- Infinera Corporation
- John W. Osenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic integrated circuit (PIC) chips
- Patent number 7,519,246
- Issue date Apr 14, 2009
- Infinera Corporation
- David F. Welch
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Submount for a photonic integrated circuit (PIC) chip
- Patent number 7,062,114
- Issue date Jun 13, 2006
- Infinera Corporation
- Jonas Webjorn
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
THERMAL INTERFACE MATERIAL CONTAINMENT
- Publication number 20220216127
- Publication date Jul 7, 2022
- Infinera Corp.
- John W. Osenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photonic Integrated Circuit (PIC) Chips
- Publication number 20080031626
- Publication date Feb 7, 2008
- Infinera Corporation
- David F. Welch
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Submount for a photonic integrated circuit (PIC) chip
- Publication number 20050025409
- Publication date Feb 3, 2005
- Infinera Corporation
- David F. Welch
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Transmitter photonic integrated circuit ( TxPIC) chips
- Publication number 20040067006
- Publication date Apr 8, 2004
- David F. Welch
- H04 - ELECTRIC COMMUNICATION TECHNIQUE