Vinith BEJUGAM

Person

Chandler, AZ, US

People

Patents Applicationslast 30 patents

Information Patent Application
ULTRATHIN LAMINATED GLASS AND GLASS STIFFENERS FOR CORELESS PACKAGES
- Publication number 20240217216
- Publication date Jul 4, 2024
- Intel Corporation
- Kristof DARMAWIKARTA
- B32 - LAYERED PRODUCTS
Information Patent Application
DIRECT ELECTROPLATING ON MODIFIED POLYMER-GRAPHENE COMPOSITES
- Publication number 20240213328
- Publication date Jun 27, 2024
- Intel Corporation
- Vinith BEJUGAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE GLASS CORE PATTERNING FOR CTV IMPROVEMENT AND LAYER COUNT...
- Publication number 20240215163
- Publication date Jun 27, 2024
- Intel Corporation
- Onur OZKAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS COATING TO MINIMIZE ROUGHNESS INSIDE THROUGH GLASS VIAS
- Publication number 20240188225
- Publication date Jun 6, 2024
- Intel Corporation
- Vinith BEJUGAM
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SHAPE MEMORY POLYMER (SMP) GLASS CORE PACKAGE FOR MODULATING WARPAGE
- Publication number 20240178157
- Publication date May 30, 2024
- Intel Corporation
- Vinith BEJUGAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES
- Publication number 20240112970
- Publication date Apr 4, 2024
- Intel Corporation
- Hanyu Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SIDED GLASS CARRIERS FOR MAKING PACKAGE SUBSTRATES
- Publication number 20240079259
- Publication date Mar 7, 2024
- Intel Corporation
- Jacob VEHONSKY
- B32 - LAYERED PRODUCTS
Information Patent Application
IC PACKAGE WITH MICRO LEDS
- Publication number 20240079530
- Publication date Mar 7, 2024
- Intel Corporation
- Jacob VEHONSKY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGN OPTIMIZATION FOR RASTER SCANNING
- Publication number 20230361002
- Publication date Nov 9, 2023
- Intel Corporation
- Vinith BEJUGAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR REMOVING LASER DEBOND RESIDUE FROM SUBSTRATE
- Publication number 20230294204
- Publication date Sep 21, 2023
- Intel Corporation
- Jeremy ECTON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Vinith BEJUGAM

Person

Patents Applicationslast 30 patents

ULTRATHIN LAMINATED GLASS AND GLASS STIFFENERS FOR CORELESS PACKAGES

DIRECT ELECTROPLATING ON MODIFIED POLYMER-GRAPHENE COMPOSITES

SUBSTRATE GLASS CORE PATTERNING FOR CTV IMPROVEMENT AND LAYER COUNT...

GLASS COATING TO MINIMIZE ROUGHNESS INSIDE THROUGH GLASS VIAS

SHAPE MEMORY POLYMER (SMP) GLASS CORE PACKAGE FOR MODULATING WARPAGE

SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES

DUAL SIDED GLASS CARRIERS FOR MAKING PACKAGE SUBSTRATES

IC PACKAGE WITH MICRO LEDS

DESIGN OPTIMIZATION FOR RASTER SCANNING

METHOD AND APPARATUS FOR REMOVING LASER DEBOND RESIDUE FROM SUBSTRATE