Vinith BEJUGAM

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Chandler, AZ, US

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Patents Applicationslast 30 patents

Information Patent Application
SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES
- Publication number 20240112970
- Publication date Apr 4, 2024
- Intel Corporation
- Hanyu Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SIDED GLASS CARRIERS FOR MAKING PACKAGE SUBSTRATES
- Publication number 20240079259
- Publication date Mar 7, 2024
- Intel Corporation
- Jacob VEHONSKY
- B32 - LAYERED PRODUCTS
Information Patent Application
IC PACKAGE WITH MICRO LEDS
- Publication number 20240079530
- Publication date Mar 7, 2024
- Intel Corporation
- Jacob VEHONSKY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGN OPTIMIZATION FOR RASTER SCANNING
- Publication number 20230361002
- Publication date Nov 9, 2023
- Intel Corporation
- Vinith BEJUGAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR REMOVING LASER DEBOND RESIDUE FROM SUBSTRATE
- Publication number 20230294204
- Publication date Sep 21, 2023
- Intel Corporation
- Jeremy ECTON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR