Vinodhkumar RAGHUNATHAN

Follow

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Embedded structures for package-on-package architecture
- Patent number 9,748,177
- Issue date Aug 29, 2017
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of providing dielectric to conductor adhesion in package st...
- Patent number 9,633,837
- Issue date Apr 25, 2017
- Intel Corporation
- Vinodhkumar Raghunathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded architecture using resin coated copper
- Patent number 9,451,696
- Issue date Sep 20, 2016
- Intel Corporation
- Dilan Seneviratne
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded structures for package-on-package architecture
- Patent number 9,368,401
- Issue date Jun 14, 2016
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of providing dielectric to conductor adhesion in package st...
- Patent number 9,136,221
- Issue date Sep 15, 2015
- Intel Corporation
- Vinodhkumar Raghunathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded structures for package-on-package architecture
- Patent number 8,866,287
- Issue date Oct 21, 2014
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED STRUCTURES FOR PACKAGE-ON-PACKAGE ARCHITECTURE
- Publication number 20160284644
- Publication date Sep 29, 2016
- Intel Corporation
- Weng Hong TEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF PROVIDING DIELECTRIC TO CONDUCTOR ADHESION IN PACKAGE ST...
- Publication number 20150357185
- Publication date Dec 10, 2015
- Intel Corporation
- Vinodhkumar Raghunathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED STRUCTURES FOR PACKAGE-ON-PACKAGE ARCHITECTURE
- Publication number 20150014861
- Publication date Jan 15, 2015
- Intel Corporation
- Weng Hong TEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED STRUCTURES FOR PACKAGE-ON-PACKAGE ARCHITECTURE
- Publication number 20140093999
- Publication date Apr 3, 2014
- Weng Hong TEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED ARCHITECTURE USING RESIN COATED COPPER
- Publication number 20140090879
- Publication date Apr 3, 2014
- Dilan SENEVIRATNE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF PROVIDING DIELECTRIC TO CONDUCTOR ADHESION IN PACKAGE ST...
- Publication number 20140091469
- Publication date Apr 3, 2014
- Vinodhkumar Raghunathan
- H01 - BASIC ELECTRIC ELEMENTS