Vinu Yamunan

Person

Dallas, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Adhesion by plasma conditioning of semiconductor chip
- Patent number 7,445,960
- Issue date Nov 4, 2008
- Texas Instruments Incorporated
- Marvin W. Cowens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing system and apparatus for balanced product flow with a...
- Patent number 7,323,362
- Issue date Jan 29, 2008
- Texas Instruments Incorporated
- Charles A. Odegard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesion by plasma conditioning of semiconductor chip
- Patent number 7,319,275
- Issue date Jan 15, 2008
- Texas Instruments Incorporated
- Marvin W. Cowens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesion by plasma conditioning of semiconductor chip surfaces
- Patent number 7,276,401
- Issue date Oct 2, 2007
- Texas Instruments Incorporated
- Marvin W. Cowens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesion by plasma conditioning of semiconductor chip surfaces
- Patent number 7,271,494
- Issue date Sep 18, 2007
- Texas Instruments Incorporated
- Marvin W. Cowens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing system and apparatus for balanced product flow with a...
- Patent number 6,977,429
- Issue date Dec 20, 2005
- Texas Instruments Incorporated
- Charles A. Odegard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-level leadframe for no-lead packages
- Patent number 6,917,098
- Issue date Jul 12, 2005
- Texas Instruments Incorporated
- Vinu Yamunan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesion by plasma conditioning of semiconductor chip surfaces
- Patent number 6,869,831
- Issue date Mar 22, 2005
- Texas Instruments Incorporated
- Marvin W. Cowens
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Adhesion by plasma conditioning of semiconductor chip
- Publication number 20080050860
- Publication date Feb 28, 2008
- Marvin W. Cowens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesion by plasma conditioning of semiconductor chip surfaces
- Publication number 20070128881
- Publication date Jun 7, 2007
- Marvin W. Cowens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip assembly reinforcement
- Publication number 20060051889
- Publication date Mar 9, 2006
- Vinu Yamunan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing system and apparatus for balanced product flow with a...
- Publication number 20060027907
- Publication date Feb 9, 2006
- Charles A. Odegard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesion by plasma conditioning of semiconductor chip surfaces
- Publication number 20050212149
- Publication date Sep 29, 2005
- Marvin W. Cowens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesion by plasma conditioning of semiconductor chip
- Publication number 20050161834
- Publication date Jul 28, 2005
- Marvin W. Cowens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-LEVEL LEADFRAME FOR NO-LEAD PACKAGES
- Publication number 20050151238
- Publication date Jul 14, 2005
- Vinu Yamunan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing system and apparatus for balanced product flow with a...
- Publication number 20050124090
- Publication date Jun 9, 2005
- Charles A. Odegard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesion by plasma conditioning of semiconductor chip surfaces
- Publication number 20030052414
- Publication date Mar 20, 2003
- Marvin W. Cowens
- H01 - BASIC ELECTRIC ELEMENTS

Vinu Yamunan

Person

Patents Grantslast 30 patents

Adhesion by plasma conditioning of semiconductor chip

Manufacturing system and apparatus for balanced product flow with a...

Adhesion by plasma conditioning of semiconductor chip

Adhesion by plasma conditioning of semiconductor chip surfaces

Adhesion by plasma conditioning of semiconductor chip surfaces

Manufacturing system and apparatus for balanced product flow with a...

Three-level leadframe for no-lead packages

Adhesion by plasma conditioning of semiconductor chip surfaces

Patents Applicationslast 30 patents

Adhesion by plasma conditioning of semiconductor chip

Adhesion by plasma conditioning of semiconductor chip surfaces

Chip assembly reinforcement

Manufacturing system and apparatus for balanced product flow with a...

Adhesion by plasma conditioning of semiconductor chip surfaces

Adhesion by plasma conditioning of semiconductor chip

THREE-LEVEL LEADFRAME FOR NO-LEAD PACKAGES

Manufacturing system and apparatus for balanced product flow with a...

Adhesion by plasma conditioning of semiconductor chip surfaces