Viraj Patwardhan

Person

Sunnyvale, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Packaged semiconductor devices including pre-molded lead-frame stru...
- Patent number 8,946,875
- Issue date Feb 3, 2015
- Intersil Americas LLC
- Nikhil Vishwanath Kelkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical sensors that reduce specular reflections
- Patent number 8,324,602
- Issue date Dec 4, 2012
- Intersil Americas Inc.
- Lynn K. Wiese
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical sensors that reduce specular reflections
- Patent number 8,232,541
- Issue date Jul 31, 2012
- Intersil Americas Inc.
- Lynn K. Wiese
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallurgy for copper plated wafers
- Patent number 7,838,991
- Issue date Nov 23, 2010
- National Semiconductor Corporation
- Shahram Mostafazadeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump formation in electronics packaging
- Patent number 7,674,702
- Issue date Mar 9, 2010
- National Semiconductor Corporation
- Viraj Patwardhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having a back surface protective coating
- Patent number 7,642,175
- Issue date Jan 5, 2010
- National Semiconductor Corporation
- Viraj A. Patwardhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High strength solder joint formation method for wafer level package...
- Patent number 7,629,246
- Issue date Dec 8, 2009
- National Semiconductor Corporation
- Viraj Patwardhan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit device package having a support coating for impr...
- Patent number 7,423,337
- Issue date Sep 9, 2008
- National Semiconductor Corporation
- Viraj A. Patwardhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for forming a pre-applied underfill adhesive layer for se...
- Patent number 7,413,927
- Issue date Aug 19, 2008
- National Semiconductor Corporation
- Viraj A. Patwardhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump formation in electronics packaging
- Patent number 7,375,431
- Issue date May 20, 2008
- National Semiconductor Corporation
- Viraj Patwardhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for forming a pre-applied underfill adhesive layer for se...
- Patent number 7,301,222
- Issue date Nov 27, 2007
- National Semiconductor Corporation
- Viraj A. Patwardhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for forming an underfill adhesive layer
- Patent number 7,253,078
- Issue date Aug 7, 2007
- National Semiconductor Corporation
- Luu T. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having a back surface protective coating
- Patent number 7,135,385
- Issue date Nov 14, 2006
- National Semiconductor Corporation
- Viraj A. Patwardhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum-free under bump metallization structure
- Patent number 7,095,116
- Issue date Aug 22, 2006
- National Semiconductor Corporation
- Nikhil V. Kelkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Marking wafers using pigmentation in a mounting tape
- Patent number 7,015,064
- Issue date Mar 21, 2006
- National Semiconductor Corporation
- Viraj A. Patwardhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Marking semiconductor devices through a mount tape
- Patent number 6,972,244
- Issue date Dec 6, 2005
- National Semiconductor Corporation
- Viraj A. Patwardhan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGED SEMICONDUCTOR DEVICES, AND RELATED METHODS AND SYSTEMS
- Publication number 20130187260
- Publication date Jul 25, 2013
- INTERSIL AMERICAS LLC
- Nikhil Vishwanath Kelkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLEAR LAYER ISOLATION
- Publication number 20120290255
- Publication date Nov 15, 2012
- Intersil Americas Inc.
- Nikhil Vishwanath Kelkar
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METALLURGY FOR COPPER PLATED WAFERS
- Publication number 20110024910
- Publication date Feb 3, 2011
- National Semiconductor Corporation
- Shahram MOSTAFAZADEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSORS THAT REDUCE SPECTRAL REFLECTIONS
- Publication number 20100258712
- Publication date Oct 14, 2010
- Intersil Americas Inc.
- Lynn K. Wiese
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSORS THAT REDUCE SPECTRAL REFLECTIONS
- Publication number 20100258710
- Publication date Oct 14, 2010
- Intersil Americas Inc.
- Lynn K. Wiese
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSORS AND METHODS FOR PROVIDING OPTICAL SENSORS
- Publication number 20100259766
- Publication date Oct 14, 2010
- Intersil Americas Inc.
- Lynn K. Wiese
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High strength solder joint formation method for wafer level package...
- Publication number 20090057897
- Publication date Mar 5, 2009
- National Semiconductor Corporation
- Viraj Patwardhan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Viraj Patwardhan

Person

Patents Grantslast 30 patents

Packaged semiconductor devices including pre-molded lead-frame stru...

Optical sensors that reduce specular reflections

Optical sensors that reduce specular reflections

Metallurgy for copper plated wafers

Solder bump formation in electronics packaging

Semiconductor devices having a back surface protective coating

High strength solder joint formation method for wafer level package...

Integrated circuit device package having a support coating for impr...

Apparatus for forming a pre-applied underfill adhesive layer for se...

Solder bump formation in electronics packaging

Apparatus for forming a pre-applied underfill adhesive layer for se...

Method and apparatus for forming an underfill adhesive layer

Semiconductor devices having a back surface protective coating

Aluminum-free under bump metallization structure

Marking wafers using pigmentation in a mounting tape

Marking semiconductor devices through a mount tape

Patents Applicationslast 30 patents

PACKAGED SEMICONDUCTOR DEVICES, AND RELATED METHODS AND SYSTEMS

CLEAR LAYER ISOLATION

METALLURGY FOR COPPER PLATED WAFERS

OPTICAL SENSORS THAT REDUCE SPECTRAL REFLECTIONS

OPTICAL SENSORS THAT REDUCE SPECTRAL REFLECTIONS

OPTICAL SENSORS AND METHODS FOR PROVIDING OPTICAL SENSORS

High strength solder joint formation method for wafer level package...