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Virgil C. Ararao
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Singapore, SG
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Patents Grants
last 30 patents
Information
Patent Grant
Fabrication method for semiconductor package heat spreaders
Patent number
7,575,956
Issue date
Aug 18, 2009
ST Assembly Test Services Ltd.
Virgil Cotoco Ararao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heat spreader for thermally enhanced semiconductor package
Patent number
7,327,025
Issue date
Feb 5, 2008
ST Assembly Test Services Ltd.
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Strip-fabricated flip chip in package and flip chip in system heat...
Patent number
7,153,725
Issue date
Dec 26, 2006
ST Assembly Test Services Ltd.
Tie Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heat spreader anchoring and grounding method and thermally enhanced...
Patent number
6,875,634
Issue date
Apr 5, 2005
ST Assembly Test Services PTE LTD
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mold cap anchoring method for molded flex BGA packages
Patent number
6,825,067
Issue date
Nov 30, 2004
ST Assembly Test Services PTE LTD
Virgil C. Ararao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heat spreaders, heat spreader packages, and fabrication methods for...
Patent number
6,775,140
Issue date
Aug 10, 2004
ST Assembly Test Services Ltd.
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heat spreader anchoring & grounding method & therma...
Patent number
6,737,298
Issue date
May 18, 2004
ST Assembly Test Services Ltd.
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Heat spreader for thermally enhanced semiconductor package
Publication number
20050242428
Publication date
Nov 3, 2005
ST ASSEMBLY TEST SERVICES LTD.
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated circuit package with keep-out zone overlapping undercut...
Publication number
20050194698
Publication date
Sep 8, 2005
ST ASSEMBLY TEST SERVICE LTD.
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Strip-fabricated flip chip in package and flip chip in system heat...
Publication number
20050161780
Publication date
Jul 28, 2005
ST ASSEMBLY TEST SERVICES LTD.
Tie Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor package heat spreaders and fabrication methods therefor
Publication number
20050112796
Publication date
May 26, 2005
Virgil Cotoco Ararao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device package
Publication number
20050006668
Publication date
Jan 13, 2005
ST ASSEMBLY TEST SERVICES LTD.
Virgil C. Ararao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Heat spreader anchoring and grounding method and thermally enhanced...
Publication number
20040180525
Publication date
Sep 16, 2004
ST ASSEMBLY TEST SERVICES LTD.
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Mold cap anchoring method for molded flex BGA packages
Publication number
20040108601
Publication date
Jun 10, 2004
ST ASSEMBLY TEST SERVICES PTE LTD
Virgil C. Ararao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Heat spreaders, heat spreader packages, and fabrication methods for...
Publication number
20040075987
Publication date
Apr 22, 2004
ST ASSEMBLY TEST SERVICES LTD.
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Heat spreader anchoring & grounding method & thermally enhanced PBG...
Publication number
20030138994
Publication date
Jul 24, 2003
ST ASSEMBLY TEST SERVICES PTE LTD
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS