Virgil Cotoco Ararao

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Atlanta, GA, US

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package heat spreader
- Patent number 8,207,598
- Issue date Jun 26, 2012
- ST Assembly Test Services Ltd.
- Virgil Cotoco Ararao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array-molded package heat spreader and fabrication method therefor
- Patent number 7,863,730
- Issue date Jan 4, 2011
- ST Assembly Test Services Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit die with pedestal
- Patent number 7,786,593
- Issue date Aug 31, 2010
- ST Assembly Test Services Ltd.
- Virgil Cotoco Ararao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for stacked die packaging
- Patent number 7,381,593
- Issue date Jun 3, 2008
- ST Assembly Test Services Ltd.
- Virgil Cotoco Ararao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit die with pedestal
- Patent number 7,242,101
- Issue date Jul 10, 2007
- ST Assembly Test Services Ltd.
- Virgil Cotoco Ararao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 6,960,493
- Issue date Nov 1, 2005
- ST Assembly Test Services, Ltd.
- Virgil C. Ararao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE HEAT SPREADER
- Publication number 20090273062
- Publication date Nov 5, 2009
- Virgil Cotoco Ararao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIE WITH PEDESTAL
- Publication number 20070228538
- Publication date Oct 4, 2007
- Virgil Cotoco Ararao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for stacked die packaging
- Publication number 20060027902
- Publication date Feb 9, 2006
- Virgil Cotoco Ararao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit die with pedestal
- Publication number 20060012022
- Publication date Jan 19, 2006
- ST ASSEMBLY TEST SERVICES LTD.
- Virgil Cotoco Ararao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Array-molded package heat spreader and fabrication method therefor
- Publication number 20050046015
- Publication date Mar 3, 2005
- ST ASSEMBLY TEST SERVICES LTD.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS