Viswanadham Puligandla

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Lewisville, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
High density integrated circuit packaging with chip stacking and vi...
- Patent number 6,236,115
- Issue date May 22, 2001
- International Business Machines Corporation
- Michael Anthony Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density integrated circuit packaging with chip stacking and vi...
- Patent number 6,187,678
- Issue date Feb 13, 2001
- International Business Machines Corporation
- Michael Anthony Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density integrated circuit packaging with chip stacking and vi...
- Patent number 6,002,177
- Issue date Dec 14, 1999
- International Business Machines Corporation
- Michael Anthony Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct chip attachment (DCA) with electrically conductive adhesives
- Patent number 5,747,101
- Issue date May 5, 1998
- International Business Machines Corporation
- Richard B. Booth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct chip attachment (DCA) with electrically conductive adhesives
- Patent number 5,543,585
- Issue date Aug 6, 1996
- International Business Machines Corporation
- Richard B. Booth
- H01 - BASIC ELECTRIC ELEMENTS