Vivek CHIDAMBARAM

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Method for low temperature bonding of wafers
- Patent number 10,134,607
- Issue date Nov 20, 2018
- Agency for Science, Technology and Research
- Vivek Chidambaram
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chemical sensor package for highly pressured environment
- Patent number 9,841,399
- Issue date Dec 12, 2017
- Agency for Science, Technology and Research
- Daniel Rhee Min Woo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical sensor package for highly pressured environment
- Patent number 9,431,315
- Issue date Aug 30, 2016
- Agency for Science, Technology and Research
- Daniel Rhee Min Woo
- G01 - MEASURING TESTING
Information Patent Grant
Layer arrangement and a wafer level package comprising the layer ar...
- Patent number 9,240,362
- Issue date Jan 19, 2016
- Agency for Science, Technology and Research
- Vivek Chidambaram
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE TRENCH FOR IMPROVED HYBRID BONDING
- Publication number 20240006358
- Publication date Jan 4, 2024
- Intel Corporation
- Zhihua Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL RING FOR AL-Ge BONDING
- Publication number 20190031502
- Publication date Jan 31, 2019
- Agency for Science, Technology and Research
- Vivek CHIDAMBARAM
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
A Method For Low Temperature Bonding Of Wafers
- Publication number 20170178929
- Publication date Jun 22, 2017
- Agency for Science, Technology and Research
- Vivek CHIDAMBARAM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHEMICAL SENSOR PACKAGE FOR HIGHLY PRESSURED ENVIRONMENT
- Publication number 20170003247
- Publication date Jan 5, 2017
- Agency for Science, Technology and Research
- Daniel Rhee Min Woo
- G01 - MEASURING TESTING
Information Patent Application
CHEMICAL SENSOR PACKAGE FOR HIGHLY PRESSURED ENVIRONMENT
- Publication number 20150206816
- Publication date Jul 23, 2015
- Agency for Science, Technology and Research
- Daniel Rhee Min Woo
- G01 - MEASURING TESTING
Information Patent Application
LAYER ARRANGEMENT AND A WAFER LEVEL PACKAGE COMPRISING THE LAYER AR...
- Publication number 20150130039
- Publication date May 14, 2015
- Agency for Science, Technology and Research
- Vivek Chidambaram
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Vivek CHIDAMBARAM

Person

Patents Grantslast 30 patents

Method for low temperature bonding of wafers

Chemical sensor package for highly pressured environment

Chemical sensor package for highly pressured environment

Layer arrangement and a wafer level package comprising the layer ar...

Patents Applicationslast 30 patents

SUBSTRATE TRENCH FOR IMPROVED HYBRID BONDING

SEAL RING FOR AL-Ge BONDING

A Method For Low Temperature Bonding Of Wafers

CHEMICAL SENSOR PACKAGE FOR HIGHLY PRESSURED ENVIRONMENT

CHEMICAL SENSOR PACKAGE FOR HIGHLY PRESSURED ENVIRONMENT

LAYER ARRANGEMENT AND A WAFER LEVEL PACKAGE COMPRISING THE LAYER AR...