Vivek GUPTA

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device packaging warpage control
- Patent number 12,125,716
- Issue date Oct 22, 2024
- NXP USA, INC.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packaging warpage control
- Patent number 11,791,283
- Issue date Oct 17, 2023
- NXP USA, INC.
- Scott M. Hayes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packaging warpage control
- Patent number 11,728,285
- Issue date Aug 15, 2023
- NXP USA, INC.
- Vivek Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having integrated antenna and method therefor
- Patent number 11,705,410
- Issue date Jul 18, 2023
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packaging warpage control
- Patent number 11,404,288
- Issue date Aug 2, 2022
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-to-die inductive communication devices and methods
- Patent number 9,466,413
- Issue date Oct 11, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Fred T. Brauchler
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGING WARPAGE CONTROL
- Publication number 20250006511
- Publication date Jan 2, 2025
- NXP USA, Inc.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGING WARPAGE CONTROL
- Publication number 20230369248
- Publication date Nov 16, 2023
- NXP USA, Inc.
- Scott M. Hayes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGING WARPAGE CONTROL
- Publication number 20230066652
- Publication date Mar 2, 2023
- NXP USA, Inc.
- Vivek Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGING WARPAGE CONTROL
- Publication number 20220392777
- Publication date Dec 8, 2022
- NXP USA, Inc.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGING WARPAGE CONTROL
- Publication number 20220336371
- Publication date Oct 20, 2022
- NXP USA, Inc.
- Scott M. Hayes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING INTEGRATED ANTENNA AND METHOD THEREFOR
- Publication number 20220189890
- Publication date Jun 16, 2022
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-TO-DIE INDUCTIVE COMMUNICATION DEVICES AND METHODS
- Publication number 20150004902
- Publication date Jan 1, 2015
- John M. PIGOTT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-TO-DIE INDUCTIVE COMMUNICATION DEVICES AND METHODS
- Publication number 20150001948
- Publication date Jan 1, 2015
- Fred T. BRAUCHLER
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Vivek GUPTA

Person

Patents Grantslast 30 patents

Semiconductor device packaging warpage control

Semiconductor device packaging warpage control

Semiconductor device packaging warpage control

Semiconductor device having integrated antenna and method therefor

Semiconductor device packaging warpage control

Die-to-die inductive communication devices and methods

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE PACKAGING WARPAGE CONTROL

SEMICONDUCTOR DEVICE PACKAGING WARPAGE CONTROL

SEMICONDUCTOR DEVICE PACKAGING WARPAGE CONTROL

SEMICONDUCTOR DEVICE PACKAGING WARPAGE CONTROL

SEMICONDUCTOR DEVICE PACKAGING WARPAGE CONTROL

SEMICONDUCTOR DEVICE HAVING INTEGRATED ANTENNA AND METHOD THEREFOR

DIE-TO-DIE INDUCTIVE COMMUNICATION DEVICES AND METHODS

DIE-TO-DIE INDUCTIVE COMMUNICATION DEVICES AND METHODS