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Vivek Kumar Rajan
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Portland, OR, US
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last 30 patents
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Patent Application
QUASI-MONOLITHIC INTEGRATED PACKAGING ARCHITECTURE WITH MID-DIE SER...
Publication number
20230197676
Publication date
Jun 22, 2023
Intel Corporation
Gerald S. Pasdast
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING ARCHITECTURE WITH INTEGRATED CIRCUIT DIES OVER INPUT/OUTP...
Publication number
20230197675
Publication date
Jun 22, 2023
Intel Corporation
Gerald S. Pasdast
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER DELIVERY THROUGH CAPACITOR-DIES IN A MULTI-LAYERED MICROELECT...
Publication number
20230163098
Publication date
May 25, 2023
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SELECTIVE ROUTING THROUGH INTRA-CONNECT BRIDGE DIES
Publication number
20220399277
Publication date
Dec 15, 2022
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS