Vivek Madan Sura

Person

Hopewell Junction, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Copper-based paste containing copper aluminate for microstructural...
- Patent number 6,358,439
- Issue date Mar 19, 2002
- International Business Machines Corporation
- Farid Youssif Aoude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper-based paste containing copper aluminate for microstructural...
- Patent number 6,124,041
- Issue date Sep 26, 2000
- International Business Machines Corporation
- Farid Youssif Aoude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper-based paste containing copper aluminate for microstructural...
- Patent number 5,925,443
- Issue date Jul 20, 1999
- International Business Machines Corporation
- Farid Youssif Aoude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Large ceramic article and method of manufacturing
- Patent number 5,541,005
- Issue date Jul 30, 1996
- International Business Machines Corporation
- Raschid J. Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
I/O pad adhesion layer for a ceramic substrate
- Patent number 5,532,031
- Issue date Jul 2, 1996
- International Business Machines Corporation
- Shaji Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Large ceramic articles and method of manufacturing
- Patent number 5,439,636
- Issue date Aug 8, 1995
- International Business Machines Corporation
- Raschid J. Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Toughened glass ceramic substrates for semiconductor devices subjec...
- Patent number 5,304,517
- Issue date Apr 19, 1994
- International Business Machines Corporation
- Jon A. Casey
- C03 - GLASS MINERAL OR SLAG WOOL

Vivek Madan Sura

Person

Patents Grantslast 30 patents

Copper-based paste containing copper aluminate for microstructural...

Copper-based paste containing copper aluminate for microstructural...

Copper-based paste containing copper aluminate for microstructural...

Large ceramic article and method of manufacturing

I/O pad adhesion layer for a ceramic substrate

Large ceramic articles and method of manufacturing

Toughened glass ceramic substrates for semiconductor devices subjec...