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Vivek Singh
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Pittsburgh, PA, US
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last 30 patents
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Patent Grant
Thermal interface material, an integrated circuit formed therewith,...
Patent number
12,027,442
Issue date
Jul 2, 2024
ARIECA INC.
Jeffrey Gelorme
H01 - BASIC ELECTRIC ELEMENTS
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last 30 patents
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Patent Application
A METHOD, APPARATUS, AND ASSEMBLY FOR THERMALLY CONNECTING LAYERS W...
Publication number
20240213115
Publication date
Jun 27, 2024
Arieca Inc.
Navid Kazem
H01 - BASIC ELECTRIC ELEMENTS