Voi V. Nguyen

Person

Oviedo, FL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Sealing retainer to be coupled between chassis and electronic modul...
- Patent number 12,066,257
- Issue date Aug 20, 2024
- Eagle Technology, LLC
- Voi Nguyen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electronic assembly having retainer with liquid coupling body engag...
- Patent number 12,063,760
- Issue date Aug 13, 2024
- Eagle Technology, LLC
- Voi Nguyen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and cooling device with fan blade and related method
- Patent number 12,031,553
- Issue date Jul 9, 2024
- L3HARRIS TECHNOLOGIES, INC.
- Charles Weirick
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electronic assembly having sealing retainer coupling an electronic...
- Patent number 11,895,806
- Issue date Feb 6, 2024
- Eagle Technology, LLC
- Voi Nguyen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making an interconnect device for electronic circuits
- Patent number 11,881,671
- Issue date Jan 23, 2024
- Eagle Technology, LLC
- Clarke O. Fowler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having flexible, heat conductive layer and associ...
- Patent number 11,665,856
- Issue date May 30, 2023
- Eagle Technology, LLC
- Jason Thompson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having heat transfer clamp and associated methods
- Patent number 11,503,701
- Issue date Nov 15, 2022
- Eagle Technology, LLC
- Jason Thompson
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Electronic device with cooling fluid manifold and multi-function co...
- Patent number 11,363,738
- Issue date Jun 14, 2022
- Eagle Technology, LLC
- Jason Thompson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect device
- Patent number 10,939,546
- Issue date Mar 2, 2021
- Eagle Technology, LLC
- Clarke O. Fowler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat exchanger system for circuit card assemblies
- Patent number 7,180,737
- Issue date Feb 20, 2007
- Harris Corporation
- Walter H. Straub, Jr.
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC ASSEMBLY HAVING RETAINER WITH LIQUID COUPLING BODY ENGAG...
- Publication number 20240098943
- Publication date Mar 21, 2024
- Eagle Technology, LLC
- Voi NGUYEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC ASSEMBLY HAVING BOTH CHASSIS AND MODULE DUAL-FLOW CONNEC...
- Publication number 20240098874
- Publication date Mar 21, 2024
- Eagle Technology, LLC
- Voi NGUYEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC ASSEMBLY HAVING SEALING RETAINER COUPLING AN ELECTRONIC...
- Publication number 20230363103
- Publication date Nov 9, 2023
- Eagle Technology, LLC
- VOI NGUYEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEALING RETAINER TO BE COUPLED BETWEEN CHASSIS AND ELECTRONIC MODUL...
- Publication number 20230349649
- Publication date Nov 2, 2023
- Eagle Technology, LLC
- VOI NGUYEN
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
ELECTRONIC ASSEMBLY HAVING SEALING RETAINER COUPLING AN ELECTRONIC...
- Publication number 20230354559
- Publication date Nov 2, 2023
- Eagle Technology, LLC
- VOI NGUYEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND COOLING DEVICE WITH FAN BLADE AND RELATED METHOD
- Publication number 20230254965
- Publication date Aug 10, 2023
- L3HARRIS TECHNOLOGIES, INC.
- CHARLES WEIRICK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE HAVING FLEXIBLE, HEAT CONDUCTIVE LAYER AND ASSOCI...
- Publication number 20230128239
- Publication date Apr 27, 2023
- Eagle Technology, LLC
- Jason Thompson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE WITH COOLING FLUID MANIFOLD AND MULTI-FUNCTION CO...
- Publication number 20210410330
- Publication date Dec 30, 2021
- Eagle Technology, LLC
- Jason Thompson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT DEVICE
- Publication number 20210195733
- Publication date Jun 24, 2021
- Eagle Technology, LLC
- Clarke O. Fowler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECT DEVICE
- Publication number 20200245455
- Publication date Jul 30, 2020
- Eagle Technology, LLC
- Clarke O. Fowler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat exchanger system for circuit card assemblies
- Publication number 20060133033
- Publication date Jun 22, 2006
- HARRIS CORPORATION
- Walter H. Straub
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Voi V. Nguyen

Person

Patents Grantslast 30 patents

Sealing retainer to be coupled between chassis and electronic modul...

Electronic assembly having retainer with liquid coupling body engag...

Electronic device and cooling device with fan blade and related method

Electronic assembly having sealing retainer coupling an electronic...

Method for making an interconnect device for electronic circuits

Electronic device having flexible, heat conductive layer and associ...

Electronic device having heat transfer clamp and associated methods

Electronic device with cooling fluid manifold and multi-function co...

Interconnect device

Heat exchanger system for circuit card assemblies

Patents Applicationslast 30 patents

ELECTRONIC ASSEMBLY HAVING RETAINER WITH LIQUID COUPLING BODY ENGAG...

ELECTRONIC ASSEMBLY HAVING BOTH CHASSIS AND MODULE DUAL-FLOW CONNEC...

ELECTRONIC ASSEMBLY HAVING SEALING RETAINER COUPLING AN ELECTRONIC...

SEALING RETAINER TO BE COUPLED BETWEEN CHASSIS AND ELECTRONIC MODUL...

ELECTRONIC ASSEMBLY HAVING SEALING RETAINER COUPLING AN ELECTRONIC...

ELECTRONIC DEVICE AND COOLING DEVICE WITH FAN BLADE AND RELATED METHOD

ELECTRONIC DEVICE HAVING FLEXIBLE, HEAT CONDUCTIVE LAYER AND ASSOCI...

ELECTRONIC DEVICE WITH COOLING FLUID MANIFOLD AND MULTI-FUNCTION CO...

INTERCONNECT DEVICE

INTERCONNECT DEVICE

Heat exchanger system for circuit card assemblies