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Tainan City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming backside illuminated image sensor device with shi...
- Patent number 11,810,939
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Volume Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing integrated circuit device
- Patent number 11,778,320
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Zen-Fong Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor image sensor device having back side illuminated imag...
- Patent number 11,355,545
- Issue date Jun 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chiu-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside illuminated image sensor device with shielding layer
- Patent number 11,335,721
- Issue date May 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Volume Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device
- Patent number 11,336,814
- Issue date May 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Zen-Fong Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming image sensor device
- Patent number 11,227,886
- Issue date Jan 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Volume Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support structure for integrated circuitry
- Patent number 11,177,306
- Issue date Nov 16, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Volume Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor including dual isolation and method of making the same
- Patent number 11,152,414
- Issue date Oct 19, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jeng-Shyan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device
- Patent number 11,121,166
- Issue date Sep 14, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Volume Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor image sensor structure for enhancing light reception...
- Patent number 11,063,077
- Issue date Jul 13, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Zen-Fong Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad on a back side illuminated image sensor
- Patent number 11,011,566
- Issue date May 18, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Volume Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming image sensor device
- Patent number 10,797,094
- Issue date Oct 6, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Volume Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor image sensor device having back side illuminated imag...
- Patent number 10,770,502
- Issue date Sep 8, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chiu-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method of the same
- Patent number 10,658,269
- Issue date May 19, 2020
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Tsung-Han Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support structure for integrated circuitry
- Patent number 10,535,694
- Issue date Jan 14, 2020
- Taiwan Semiconductor Manufacturing Company Limited
- Volume Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,515,991
- Issue date Dec 24, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Zen-Fong Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor image sensor device having back side illuminated imag...
- Patent number 10,490,590
- Issue date Nov 26, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chiu-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device
- Patent number 10,484,590
- Issue date Nov 19, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Zen-Fong Huang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image sensor with trenched filler grid
- Patent number 10,340,300
- Issue date Jul 2, 2019
- Taiwan Semiconductor Manufacturing Company Limited
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support structure for integrated circuitry
- Patent number 10,340,301
- Issue date Jul 2, 2019
- Taiwan Semiconductor Manufacturing Company Limited
- Volume Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device and method for forming the same
- Patent number 10,276,620
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Volume Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacuting method of the same
- Patent number 10,269,684
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tsung-Han Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming image sensor device
- Patent number 10,269,845
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Volume Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor including dual isolation and method of making the same
- Patent number 10,192,918
- Issue date Jan 29, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jeng-Shyan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor image sensor device having back side illuminated imag...
- Patent number 10,181,491
- Issue date Jan 15, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chiu-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensing device and manufacturing method thereof
- Patent number 10,163,966
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yun-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixel with spacer layer covering photodiode
- Patent number 10,157,950
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Hung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for fabricating a light guiding grid
- Patent number 10,056,426
- Issue date Aug 21, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yun-Wei Cheng
- G02 - OPTICS
Information Patent Grant
Manufacuting method of semiconductor structure
- Patent number 10,056,316
- Issue date Aug 21, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tsung-Han Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixel with spacer layer covering photodiode
- Patent number 9,887,225
- Issue date Feb 6, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Hung Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BACKSIDE ILLUMINATED IMAGE SENSOR DEVICE WITH SHIELDING LAYER AND F...
- Publication number 20240021651
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Volume CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING BACKSIDE ILLUMINATED IMAGE SENSOR DEVICE WITH SHI...
- Publication number 20220271071
- Publication date Aug 25, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Volume CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE
- Publication number 20220247936
- Publication date Aug 4, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zen-Fong Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Pad on a Back Side Illuminated Image Sensor
- Publication number 20210273009
- Publication date Sep 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Volume Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Image Sensor Device Having Back Side Illuminated Imag...
- Publication number 20210057468
- Publication date Feb 25, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chiu-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANISMS FOR FORMING IMAGE SENSOR DEVICE
- Publication number 20210013255
- Publication date Jan 14, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Volume CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Support Structure for Integrated Circuitry
- Publication number 20200152684
- Publication date May 14, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Volume Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200135784
- Publication date Apr 30, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- ZEN-FONG HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Image Sensor Device Having Back Side Illuminated Imag...
- Publication number 20200091211
- Publication date Mar 19, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chiu-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20200059591
- Publication date Feb 20, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Zen-Fong Huang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Support Structure for Integrated Circuitry
- Publication number 20190326343
- Publication date Oct 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Volume Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20190252295
- Publication date Aug 15, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- TSUNG-HAN TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR DEVICE
- Publication number 20190252429
- Publication date Aug 15, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Volume CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANISMS FOR FORMING IMAGE SENSOR DEVICE
- Publication number 20190252440
- Publication date Aug 15, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Volume CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR INCLUDING DUAL ISOLATION AND METHOD OF MAKING THE SAME
- Publication number 20190172857
- Publication date Jun 6, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Shyan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Image Sensor Device Having Back Side Illuminated Imag...
- Publication number 20190140001
- Publication date May 9, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chiu-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIXEL WITH SPACER LAYER COVERING PHOTODIODE
- Publication number 20180158851
- Publication date Jun 7, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Hung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACUTING METHOD OF THE SAME
- Publication number 20180082927
- Publication date Mar 22, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- TSUNG-HAN TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACUTING METHOD OF SEMICONDUCTOR STRUCTURE
- Publication number 20180082928
- Publication date Mar 22, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- TSUNG-HAN TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Image Sensor Device Having Back Side Illuminated Imag...
- Publication number 20180033820
- Publication date Feb 1, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chiu-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIXEL WITH SPACER LAYER COVERING PHOTODIODE
- Publication number 20170345852
- Publication date Nov 30, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Hung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20170257554
- Publication date Sep 7, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Zen-Fong Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORT STRUCTURE FOR INTEGRATED CIRCUITRY
- Publication number 20170243908
- Publication date Aug 24, 2017
- Taiwan Semiconductor Manufacturing Company Limited
- Volume CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF BURIED COLOR FILTERS IN A BACK SIDE ILLUMINATED IMAGE...
- Publication number 20170133429
- Publication date May 11, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Yun-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANISMS FOR FORMING IMAGE SENSOR DEVICE
- Publication number 20170098675
- Publication date Apr 6, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Volume CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR DEVICE WITH SUB-ISOLATION IN PIXELS
- Publication number 20170092684
- Publication date Mar 30, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Su-Hua CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMOS IMAGE SENSOR STRUCTURE WITH CROSSTALK IMPROVEMENT
- Publication number 20170069678
- Publication date Mar 9, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yun-Wei CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Image Sensor Device Having Back Side Illuminated Imag...
- Publication number 20170025460
- Publication date Jan 26, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chiu-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20160307950
- Publication date Oct 20, 2016
- Taiwan Semiconductor Manufacturing company Ltd.
- ZEN-FONG HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF BURIED COLOR FILTERS IN A BACK SIDE ILLUMINATED IMAGE...
- Publication number 20160276400
- Publication date Sep 22, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yun-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS

Volume Chien

Person

Patents Grantslast 30 patents

Method of forming backside illuminated image sensor device with shi...

Method of manufacturing integrated circuit device

Semiconductor image sensor device having back side illuminated imag...

Backside illuminated image sensor device with shielding layer

Integrated circuit device

Mechanisms for forming image sensor device

Support structure for integrated circuitry

Image sensor including dual isolation and method of making the same

Image sensor device

Semiconductor image sensor structure for enhancing light reception...

Bonding pad on a back side illuminated image sensor

Mechanisms for forming image sensor device

Semiconductor image sensor device having back side illuminated imag...

Semiconductor structure and manufacturing method of the same

Support structure for integrated circuitry

Semiconductor structure and manufacturing method thereof

Semiconductor image sensor device having back side illuminated imag...

Integrated circuit device

Image sensor with trenched filler grid

Support structure for integrated circuitry

Image sensor device and method for forming the same

Semiconductor structure and manufacuting method of the same

Mechanisms for forming image sensor device

Image sensor including dual isolation and method of making the same

Semiconductor image sensor device having back side illuminated imag...

Image sensing device and manufacturing method thereof

Pixel with spacer layer covering photodiode

Apparatus and method for fabricating a light guiding grid

Manufacuting method of semiconductor structure

Pixel with spacer layer covering photodiode

Patents Applicationslast 30 patents

BACKSIDE ILLUMINATED IMAGE SENSOR DEVICE WITH SHIELDING LAYER AND F...

METHOD OF FORMING BACKSIDE ILLUMINATED IMAGE SENSOR DEVICE WITH SHI...

METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE

Bonding Pad on a Back Side Illuminated Image Sensor

Semiconductor Image Sensor Device Having Back Side Illuminated Imag...

MECHANISMS FOR FORMING IMAGE SENSOR DEVICE

Support Structure for Integrated Circuitry

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Semiconductor Image Sensor Device Having Back Side Illuminated Imag...

INTEGRATED CIRCUIT DEVICE

Support Structure for Integrated Circuitry

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF THE SAME

IMAGE SENSOR DEVICE

MECHANISMS FOR FORMING IMAGE SENSOR DEVICE

IMAGE SENSOR INCLUDING DUAL ISOLATION AND METHOD OF MAKING THE SAME

Semiconductor Image Sensor Device Having Back Side Illuminated Imag...

PIXEL WITH SPACER LAYER COVERING PHOTODIODE

SEMICONDUCTOR STRUCTURE AND MANUFACUTING METHOD OF THE SAME

MANUFACUTING METHOD OF SEMICONDUCTOR STRUCTURE

Semiconductor Image Sensor Device Having Back Side Illuminated Imag...

PIXEL WITH SPACER LAYER COVERING PHOTODIODE

INTEGRATED CIRCUIT DEVICE

SUPPORT STRUCTURE FOR INTEGRATED CIRCUITRY

FORMATION OF BURIED COLOR FILTERS IN A BACK SIDE ILLUMINATED IMAGE...

MECHANISMS FOR FORMING IMAGE SENSOR DEVICE

IMAGE SENSOR DEVICE WITH SUB-ISOLATION IN PIXELS

CMOS IMAGE SENSOR STRUCTURE WITH CROSSTALK IMPROVEMENT

Semiconductor Image Sensor Device Having Back Side Illuminated Imag...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

FORMATION OF BURIED COLOR FILTERS IN A BACK SIDE ILLUMINATED IMAGE...