W. Eric Boyd

Person

Long Beach, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Wire bond through-via structure and method
- Patent number 9,741,680
- Issue date Aug 22, 2017
- PFG IP LLC
- Randy Bindrup
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond through-via structure and method
- Patent number 9,431,275
- Issue date Aug 30, 2016
- PFG IP LLC
- Randy Bindrup
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable layer containing ball grid array package
- Patent number 8,835,218
- Issue date Sep 16, 2014
- Aprolase Development Co., LLC
- Keith Gann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anti-tamper wrapper interconnect method and a device
- Patent number 8,637,985
- Issue date Jan 28, 2014
- ISC8 Inc.
- Randy Bindrup
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for defining an electrically conductive metal structure on a...
- Patent number 8,637,140
- Issue date Jan 28, 2014
- ISCS Inc.
- James Yamaguchi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for fabricating a neo-layer using stud bumped bare die
- Patent number 8,609,473
- Issue date Dec 17, 2013
- ISC8 Inc.
- Peter Lieu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for depackaging prepackaged integrated circuit die and a pro...
- Patent number 8,586,407
- Issue date Nov 19, 2013
- ISC8 Inc.
- Peter Lieu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for precision integrated circuit die singulation using diffe...
- Patent number RE43877
- Issue date Dec 25, 2012
- Aprolase Development Co., LLC
- David Ludwig
- 438 - Semiconductor device manufacturing: process
Information Patent Grant
Portable lip reading sensor system
- Patent number 8,271,262
- Issue date Sep 18, 2012
- ISC8 Inc.
- Ying Hsu
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Stackable layer containing ball grid array package
- Patent number 7,982,300
- Issue date Jul 19, 2011
- Aprolase Development Co., LLC
- Keith Gann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field programmable gate array utilizing dedicated memory stacks in...
- Patent number 7,902,879
- Issue date Mar 8, 2011
- Aprolase Development Co., LLC
- Volkan H. Ozguz
- G01 - MEASURING TESTING
Information Patent Grant
Stackable semiconductor chip layer comprising prefabricated trench...
- Patent number 7,786,562
- Issue date Aug 31, 2010
- Volkan Ozguz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microelectronic layer and module with three-axis channel T-...
- Patent number 7,777,321
- Issue date Aug 17, 2010
- Keith D. Gann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array package format layers and structure
- Patent number 7,714,426
- Issue date May 11, 2010
- Keith Gann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field programmable gate array utilizing dedicated memory stacks in...
- Patent number 7,649,386
- Issue date Jan 19, 2010
- Volkan H. Ozguz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for precision integrated circuit die singulation using diffe...
- Patent number 7,335,576
- Issue date Feb 26, 2008
- Irvine Sensors Corp.
- Ludwig David
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging device with multiple fields of view incorporating memory-ba...
- Patent number 7,235,785
- Issue date Jun 26, 2007
- Irvine Sensors Corp.
- Bert Hornback
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
Stacked Physically Uncloneable Function Sense and Respond Module
- Publication number 20130141137
- Publication date Jun 6, 2013
- ISC8 Inc.
- Christian Krutzik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cap Chip and Reroute Layer for Stacked Microelectronic Module
- Publication number 20130020572
- Publication date Jan 24, 2013
- ISC8 Inc.
- Sambo He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating a Small Footprint Chip-Scale Package and a D...
- Publication number 20120211886
- Publication date Aug 23, 2012
- ISC8 Inc.
- Peter Lieu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Anti-Tamper Wrapper Interconnect Method and a Device
- Publication number 20120205801
- Publication date Aug 16, 2012
- Randy Bindrup
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Tamper-Resistant Memory Device With Variable Data Transmission Rate
- Publication number 20120185636
- Publication date Jul 19, 2012
- ISC8, Inc.
- John Leon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Defining an Electronically Conductive Metal Structure on...
- Publication number 20120094092
- Publication date Apr 19, 2012
- Irvine Sensors Corporation
- James Yamaguchi
- B32 - LAYERED PRODUCTS
Information Patent Application
Wire Bond Through-Via Structure and Method
- Publication number 20120068333
- Publication date Mar 22, 2012
- Irvine Sensors Corporation
- Randy Bindrup
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Depackaging Prepackaged Integrated Circuit Die and a Pro...
- Publication number 20120068341
- Publication date Mar 22, 2012
- Irvine Sensors Corporation
- Peter Lieu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating a Neo-Layer Using Stud Bumped Bare Die
- Publication number 20120068336
- Publication date Mar 22, 2012
- Irvine Sensors Corporation
- Peter Lieu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Control of Solder Collapse in Stacked Microelectronic St...
- Publication number 20120069528
- Publication date Mar 22, 2012
- Irvine Sensors Corporation
- Randy Bindrup
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKABLE LAYER CONTAINING BALL GRID ARRAY PACKAGE
- Publication number 20110269270
- Publication date Nov 3, 2011
- Keith Gann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Secure Anti-Tamper Integrated Layer Security Device Comprising Nano...
- Publication number 20110227603
- Publication date Sep 22, 2011
- Irvine Sensors Corporation
- John Leon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High density array module and connector
- Publication number 20110147568
- Publication date Jun 23, 2011
- Irvine Sensors Corporation
- Michael Miyake
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Tamper-resistant electronic circuit and module incorporating electr...
- Publication number 20110031982
- Publication date Feb 10, 2011
- Irvine Sensors Corporation
- John Leon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE SEMICONDUCTOR CHIP LAYER COMPRISING PREFABRICATED TRENCH...
- Publication number 20100291735
- Publication date Nov 18, 2010
- Volkan Ozguz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE LAYER CONTAINING BALL GRID ARRAY PACKAGE
- Publication number 20100181662
- Publication date Jul 22, 2010
- Keith Gann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD PROGRAMMABLE GATE ARRAY UTILIZING DEDICATED MEMORY STACKS IN...
- Publication number 20100148822
- Publication date Jun 17, 2010
- Volkan H. Ozguz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Field programmable gate array utilizing dedicated memory stacks in...
- Publication number 20080074144
- Publication date Mar 27, 2008
- Volkan Ozguz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method for precision integrated circuit die singulation using diffe...
- Publication number 20060079072
- Publication date Apr 13, 2006
- Ludwig David
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked microelectronic layer and module with three-axis channel T-...
- Publication number 20060043563
- Publication date Mar 2, 2006
- Keith D. Gann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stackable semiconductor chip layer comprising prefabricated trench...
- Publication number 20050277288
- Publication date Dec 15, 2005
- Volkan Ozguz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Imaging device with multiple fields of view incorporating memory-ba...
- Publication number 20050205785
- Publication date Sep 22, 2005
- Bert Hornback
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

W. Eric Boyd

Person

Patents Grantslast 30 patents

Wire bond through-via structure and method

Wire bond through-via structure and method

Stackable layer containing ball grid array package

Anti-tamper wrapper interconnect method and a device

Method for defining an electrically conductive metal structure on a...

Method for fabricating a neo-layer using stud bumped bare die

Method for depackaging prepackaged integrated circuit die and a pro...

Method for precision integrated circuit die singulation using diffe...

Portable lip reading sensor system

Stackable layer containing ball grid array package

Field programmable gate array utilizing dedicated memory stacks in...

Stackable semiconductor chip layer comprising prefabricated trench...

Stacked microelectronic layer and module with three-axis channel T-...

Ball grid array package format layers and structure

Field programmable gate array utilizing dedicated memory stacks in...

Method for precision integrated circuit die singulation using diffe...

Imaging device with multiple fields of view incorporating memory-ba...

Patents Applicationslast 30 patents

Stacked Physically Uncloneable Function Sense and Respond Module

Cap Chip and Reroute Layer for Stacked Microelectronic Module

Method for Fabricating a Small Footprint Chip-Scale Package and a D...

Anti-Tamper Wrapper Interconnect Method and a Device

Tamper-Resistant Memory Device With Variable Data Transmission Rate

Method for Defining an Electronically Conductive Metal Structure on...

Wire Bond Through-Via Structure and Method

Method for Depackaging Prepackaged Integrated Circuit Die and a Pro...

Method for Fabricating a Neo-Layer Using Stud Bumped Bare Die

Method for Control of Solder Collapse in Stacked Microelectronic St...

STACKABLE LAYER CONTAINING BALL GRID ARRAY PACKAGE

Secure Anti-Tamper Integrated Layer Security Device Comprising Nano...

High density array module and connector

Tamper-resistant electronic circuit and module incorporating electr...

STACKABLE SEMICONDUCTOR CHIP LAYER COMPRISING PREFABRICATED TRENCH...

STACKABLE LAYER CONTAINING BALL GRID ARRAY PACKAGE

FIELD PROGRAMMABLE GATE ARRAY UTILIZING DEDICATED MEMORY STACKS IN...

Field programmable gate array utilizing dedicated memory stacks in...

Method for precision integrated circuit die singulation using diffe...

Stacked microelectronic layer and module with three-axis channel T-...

Stackable semiconductor chip layer comprising prefabricated trench...

Imaging device with multiple fields of view incorporating memory-ba...