Wah-Yih Lien

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Hsinchu, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method for simultaneous formation of contacts between metal layers...
- Patent number 6,008,075
- Issue date Dec 28, 1999
- Vanguard International Semiconductor Corporation
- Wah-Yih Lien
- H01 - BASIC ELECTRIC ELEMENTS