Wai Hoong Moy

Follow

Person

Penang, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Surface mountable semiconductor package with solder bonding features
- Patent number 7,737,546
- Issue date Jun 15, 2010
- Avago Technologies ECBU IP (Singapore) Pte Ltd
- Wai Hoong Moy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Surface Mountable Semiconductor Package with Solder Bonding Features
- Publication number 20090057850
- Publication date Mar 5, 2009
- Wai Hoong Moy
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...