Wai Hung William Hor

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Tsuen Wan, HK

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Patents Grantslast 30 patents

Information Patent Grant
Leadless semiconductor package and method
- Patent number 9,443,791
- Issue date Sep 13, 2016
- NXP B.V.
- Chi Ho Leung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with multiple I/O side-solderable terminals
- Patent number 9,425,130
- Issue date Aug 23, 2016
- NXP B.V.
- Chi Ho Leung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE WITH MULTIPLE I/O SIDE-SOLDERABLE TERMINALS
- Publication number 20160126162
- Publication date May 5, 2016
- NXP B.V.
- Chi Ho Leung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADLESS SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20160035651
- Publication date Feb 4, 2016
- NXP B.V.
- Chi Ho Leung
- H01 - BASIC ELECTRIC ELEMENTS