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Tsuen Wan, HK
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Patents Grants
last 30 patents
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Patent Grant
Leadless semiconductor package and method
Patent number
9,443,791
Issue date
Sep 13, 2016
NXP B.V.
Chi Ho Leung
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Package with multiple I/O side-solderable terminals
Patent number
9,425,130
Issue date
Aug 23, 2016
NXP B.V.
Chi Ho Leung
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
PACKAGE WITH MULTIPLE I/O SIDE-SOLDERABLE TERMINALS
Publication number
20160126162
Publication date
May 5, 2016
NXP B.V.
Chi Ho Leung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEADLESS SEMICONDUCTOR PACKAGE AND METHOD
Publication number
20160035651
Publication date
Feb 4, 2016
NXP B.V.
Chi Ho Leung
H01 - BASIC ELECTRIC ELEMENTS