Wai Keong Wong

Person

Shah Alam, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Thermally-enhanced three dimensional system-in-packages and methods...
- Patent number 9,595,505
- Issue date Mar 14, 2017
- NXP USA, INC.
- Shouhui Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame with mold lock structure
- Patent number 9,293,395
- Issue date Mar 22, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Wai Keong Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of limiting capillary action of gel material during assembly...
- Patent number 9,190,339
- Issue date Nov 17, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Soon Kang Chan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device with twisted leads
- Patent number 9,165,869
- Issue date Oct 20, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Soo Choong Chee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with corner cut-outs and semiconductor device assembled t...
- Patent number 9,099,363
- Issue date Aug 4, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Wai Keong Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame with grooved lead finger
- Patent number 9,006,874
- Issue date Apr 14, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Wai Keong Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame with grooved lead finger
- Patent number 8,643,159
- Issue date Feb 4, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Wai Keong Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having die pads isolated from interconnect por...
- Patent number 8,519,519
- Issue date Aug 27, 2013
- Freescale Semiconductor Inc.
- Beng Siong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold and substrate for use with mold
- Patent number 8,198,143
- Issue date Jun 12, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Poh Leng Eu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Adjustable clamp system and method for wire bonding die assembly
- Patent number 8,016,183
- Issue date Sep 13, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Wai Keong Wong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mold and substrate for use with mold
- Patent number 7,956,471
- Issue date Jun 7, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Poh Leng Eu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
THERMALLY-ENHANCED THREE DIMENSIONAL SYSTEM-IN-PACKAGES AND METHODS...
- Publication number 20160148902
- Publication date May 26, 2016
- SHOUHUI CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME WITH MOLD LOCK STRUCTURE
- Publication number 20150270195
- Publication date Sep 24, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Wai Keong Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE WITH CORNER CUT-OUTS AND SEMICONDUCTOR DEVICE ASSEMBLED T...
- Publication number 20150228601
- Publication date Aug 13, 2015
- Wai Keong Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF LIMITING CAPILLARY ACTION OF GEL MATERIAL DURING ASSEMBLY...
- Publication number 20150221572
- Publication date Aug 6, 2015
- Soon Kang Chan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LEAD FRAME WITH GROOVED LEAD FINGER
- Publication number 20140120664
- Publication date May 1, 2014
- Wai Keong Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME WITH GROOVED LEAD FINGER
- Publication number 20130264693
- Publication date Oct 10, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Wai Keong WONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATER BLOCK FOR WIRE BONDING SYSTEM
- Publication number 20120318853
- Publication date Dec 20, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Wai Keong Wong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF PACKAGING SAME
- Publication number 20120104583
- Publication date May 3, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Beng Siong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLD AND SUBSTRATE FOR USE WITH MOLD
- Publication number 20110244637
- Publication date Oct 6, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Poh Leng Eu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
MOLD AND SUBSTRATE FOR USE WITH MOLD
- Publication number 20100117202
- Publication date May 13, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Poh Leng Eu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Wai Keong Wong

Person

Patents Grantslast 30 patents

Thermally-enhanced three dimensional system-in-packages and methods...

Lead frame with mold lock structure

Method of limiting capillary action of gel material during assembly...

Semiconductor device with twisted leads

Substrate with corner cut-outs and semiconductor device assembled t...

Lead frame with grooved lead finger

Lead frame with grooved lead finger

Semiconductor device having die pads isolated from interconnect por...

Mold and substrate for use with mold

Adjustable clamp system and method for wire bonding die assembly

Mold and substrate for use with mold

Patents Applicationslast 30 patents

THERMALLY-ENHANCED THREE DIMENSIONAL SYSTEM-IN-PACKAGES AND METHODS...

LEAD FRAME WITH MOLD LOCK STRUCTURE

SUBSTRATE WITH CORNER CUT-OUTS AND SEMICONDUCTOR DEVICE ASSEMBLED T...

METHOD OF LIMITING CAPILLARY ACTION OF GEL MATERIAL DURING ASSEMBLY...

LEAD FRAME WITH GROOVED LEAD FINGER

LEAD FRAME WITH GROOVED LEAD FINGER

HEATER BLOCK FOR WIRE BONDING SYSTEM

SEMICONDUCTOR DEVICE AND METHOD OF PACKAGING SAME

MOLD AND SUBSTRATE FOR USE WITH MOLD

MOLD AND SUBSTRATE FOR USE WITH MOLD