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Wai Kit Tam
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Kowloon, CN
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last 30 patents
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Patent Grant
Ball grid array package with improved thermal characteristics
Patent number
9,449,903
Issue date
Sep 20, 2016
UTAC Hong Kong Limited
Neil McLellan
H01 - BASIC ELECTRIC ELEMENTS
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last 30 patents
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Patent Application
BALL GRID ARRAY PACKAGE WITH IMPROVED THERMAL CHARACTERISTICS
Publication number
20140183712
Publication date
Jul 3, 2014
UTAC Hong Kong Limited
Neil McLellan
H01 - BASIC ELECTRIC ELEMENTS