Wai Kwan WONG

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Kokomo, IN, US

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Patents Grantslast 30 patents

Information Patent Grant
Electronic power package and heat sink/cold rail arrangement
- Patent number 12,087,659
- Issue date Sep 10, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Binghua Pan
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Printed circuit board and fabrication thereof
- Patent number 12,063,739
- Issue date Aug 13, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Kok Wee Yeo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD AND FABRICATION THEREOF
- Publication number 20220377889
- Publication date Nov 24, 2022
- DELPHI TECHNOLOGIES IP LIMITED
- Kok Wee YEO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC POWER PACKAGE AND HEAT SINK/COLD RAIL ARRANGEMENT
- Publication number 20220068753
- Publication date Mar 3, 2022
- DELPHI TECHNOLOGIES IP LIMITED
- Binghua PAN
- B22 - CASTING POWDER METALLURGY