Wai Lik CHAN

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Kwai Chung, HK

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Patents Grantslast 30 patents

Information Patent Grant
Rotary clip bonder
- Patent number 8,166,638
- Issue date May 1, 2012
- ASM Assembly Automation LTD
- Wai Lik Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ROTARY CLIP BONDER
- Publication number 20100313415
- Publication date Dec 16, 2010
- Wai Lik CHAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR