Wai Ling Lee

Person

Bayan Lepas, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Micro through-silicon via for transistor density scaling
- Patent number 12,112,997
- Issue date Oct 8, 2024
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro through-silicon via for transistor density scaling
- Patent number 12,080,628
- Issue date Sep 3, 2024
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro through-silicon via for transistor density scaling
- Patent number 11,652,026
- Issue date May 16, 2023
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked through-silicon vias for multi-device packages
- Patent number 11,398,415
- Issue date Jul 26, 2022
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro through-silicon via for transistor density scaling
- Patent number 11,393,741
- Issue date Jul 19, 2022
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power delivery for embedded interconnect bridge devices and methods
- Patent number 11,393,758
- Issue date Jul 19, 2022
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro through-silicon via for transistor density scaling
- Patent number 10,903,142
- Issue date Jan 26, 2021
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection of an embedded die
- Patent number 9,978,735
- Issue date May 22, 2018
- Altera Corporation
- Loke Yip Foo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to optimize general-purpose input/output interface pad assig...
- Patent number 9,842,181
- Issue date Dec 12, 2017
- Altera Corporation
- Kyung Suk Oh
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
MICRO THROUGH-SILICON VIA FOR TRANSISTOR DENSITY SCALING
- Publication number 20240429131
- Publication date Dec 26, 2024
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO THROUGH-SILICON VIA FOR TRANSISTOR DENSITY SCALING
- Publication number 20230361003
- Publication date Nov 9, 2023
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO THROUGH-SILICON VIA FOR TRANSISTOR DENSITY SCALING
- Publication number 20230253295
- Publication date Aug 10, 2023
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO THROUGH-SILICON VIA FOR TRANSISTOR DENSITY SCALING
- Publication number 20220157694
- Publication date May 19, 2022
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO THROUGH-SILICON VIA FOR TRANSISTOR DENSITY SCALING
- Publication number 20210320051
- Publication date Oct 14, 2021
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED THROUGH-SILICON VIAS FOR MULTI-DEVICE PACKAGES
- Publication number 20200091040
- Publication date Mar 19, 2020
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DELIVERY FOR EMBEDDED INTERCONNECT BRIDGE DEVICES AND METHODS
- Publication number 20200083170
- Publication date Mar 12, 2020
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO THROUGH-SILICON VIA FOR TRANSISTOR DENSITY SCALING
- Publication number 20200043831
- Publication date Feb 6, 2020
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION OF AN EMBEDDED DIE
- Publication number 20180090474
- Publication date Mar 29, 2018
- Altera Corporation
- Loke Yip Foo
- H01 - BASIC ELECTRIC ELEMENTS

Wai Ling Lee

Person

Patents Grantslast 30 patents

Micro through-silicon via for transistor density scaling

Micro through-silicon via for transistor density scaling

Micro through-silicon via for transistor density scaling

Stacked through-silicon vias for multi-device packages

Micro through-silicon via for transistor density scaling

Power delivery for embedded interconnect bridge devices and methods

Micro through-silicon via for transistor density scaling

Interconnection of an embedded die

Method to optimize general-purpose input/output interface pad assig...

Patents Applicationslast 30 patents

MICRO THROUGH-SILICON VIA FOR TRANSISTOR DENSITY SCALING

MICRO THROUGH-SILICON VIA FOR TRANSISTOR DENSITY SCALING

MICRO THROUGH-SILICON VIA FOR TRANSISTOR DENSITY SCALING

MICRO THROUGH-SILICON VIA FOR TRANSISTOR DENSITY SCALING

MICRO THROUGH-SILICON VIA FOR TRANSISTOR DENSITY SCALING

STACKED THROUGH-SILICON VIAS FOR MULTI-DEVICE PACKAGES

POWER DELIVERY FOR EMBEDDED INTERCONNECT BRIDGE DEVICES AND METHODS

MICRO THROUGH-SILICON VIA FOR TRANSISTOR DENSITY SCALING

INTERCONNECTION OF AN EMBEDDED DIE