Wai Lok Ben TO

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Hong Kong, HK

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Patents Grantslast 30 patents

Information Patent Grant
Wire bonding system utilizing multiple positioning tables
- Patent number 7,654,436
- Issue date Feb 2, 2010
- ASM Assembly Automation Ltd.
- Wing Cheung James Ho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRE BONDING SYSTEM UTILIZING MULTIPLE POSITIONING TABLES
- Publication number 20090078743
- Publication date Mar 26, 2009
- Wing Cheung James HO
- H01 - BASIC ELECTRIC ELEMENTS