Membership
Tour
Register
Log in
Wai M. Ma
Follow
Person
Poughkeepsie, NY, US
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Test probe coated with conductive elastomer for testing of backdril...
Patent number
9,459,285
Issue date
Oct 4, 2016
GLOBALFOUNDRIES Inc.
Wai M. Ma
G01 - MEASURING TESTING
Information
Patent Grant
Primary circuit board non-conductive void having different planar d...
Patent number
8,939,791
Issue date
Jan 27, 2015
International Business Machines Corporation
Wai M. Ma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Adapter for plated through hole mounting of surface mount component
Patent number
8,902,605
Issue date
Dec 2, 2014
International Business Machines Corporation
Daniel J. Buschel
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Dye-based circuit mount testing
Patent number
8,638,564
Issue date
Jan 28, 2014
International Business Machines Corporation
Daniel J Buschel
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of optimizing land grid array geometry
Patent number
7,841,078
Issue date
Nov 30, 2010
International Business Machines Corporation
Roger Lam
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Structure for repairing or modifying surface connections on circuit...
Patent number
7,199,309
Issue date
Apr 3, 2007
International Business Machines Corporation
Bruce John Chamberlin
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Inclined solder wave methodology for wave soldering double sided pi...
Patent number
6,974,071
Issue date
Dec 13, 2005
International Business Machines Corporation
Todd H. Buley
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method and structure for repairing or modifying surface connections...
Patent number
6,912,780
Issue date
Jul 5, 2005
International Business Machines Corporation
Bruce John Chamberlin
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method and structure for repairing or modifying surface connections...
Patent number
6,784,377
Issue date
Aug 31, 2004
International Business Machines Corporation
Bruce John Chamberlin
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Terminating floating signals on a BGA module to a ground plane on a...
Patent number
6,511,347
Issue date
Jan 28, 2003
International Business Machines Corporation
Brian D. Chapman
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method and structure for reducing power noise
Patent number
6,437,252
Issue date
Aug 20, 2002
International Business Machines Corporation
Simone Rehm
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method and apparatus for reworking ceramic ball grid array or ceram...
Patent number
6,182,884
Issue date
Feb 6, 2001
International Business Machines Corporation
Wai Mon Ma
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for establishing electrical communication between a first ob...
Patent number
6,059,172
Issue date
May 9, 2000
International Business Machines Corporation
Brian D. Chapman
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of making a high melting point solder ball coated with a low...
Patent number
6,050,481
Issue date
Apr 18, 2000
International Business Machines Corporation
Brian D. Chapman
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Non-destructive low melt test for off-composition solder
Patent number
6,016,947
Issue date
Jan 25, 2000
International Business Machines Corporation
Timothy W. Donahue
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and apparatus for modifying circuit having ball grid array i...
Patent number
5,909,011
Issue date
Jun 1, 1999
International Business Machines Corporation
Richard L. Chartrand
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for modifying circuit having ball grid array interconnections
Patent number
5,890,284
Issue date
Apr 6, 1999
International Business Machines Corporation
Richard L. Chartrand
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
High melting point solder ball coated with a low melting point solder
Patent number
5,872,400
Issue date
Feb 16, 1999
International Business Machines Corporation
Brian D. Chapman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fiber optic connector assembly and adapter for use therewith
Patent number
4,953,929
Issue date
Sep 4, 1990
International Business Machines
Joseph F. Basista
G02 - OPTICS
Information
Patent Grant
Electrical connector utilizing flexible electrical circuitry
Patent number
4,907,975
Issue date
Mar 13, 1990
International Business Machine Corporation
David W. Dranchak
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SUPPLY CHAIN RISK ASSESSMENT
Publication number
20150178651
Publication date
Jun 25, 2015
International Business Machines Corporation
Hans-Juergen Eickelmann
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
Test Probe Coated with Conductive Elastomer for Testing of Backdril...
Publication number
20150015288
Publication date
Jan 15, 2015
International Business Machines Corporation
Wai M. Ma
G01 - MEASURING TESTING
Information
Patent Application
Primary circuit board non-conductive void having different planar d...
Publication number
20140213077
Publication date
Jul 31, 2014
International Business Machines Corporation
Wai M. Ma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Adapter For Plated Through Hole Mounting Of Surface Mount Component
Publication number
20130337697
Publication date
Dec 19, 2013
International Business Machines Corporation
Daniel J. Buschel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DYE-BASED CIRCUIT MOUNT TESTING
Publication number
20130070434
Publication date
Mar 21, 2013
International Business Machines Corporation
Daniel J. Buschel
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
REDUCED STRESS GULL WING SOLDER JOINTS FOR PRINTED WIRING BOARD CON...
Publication number
20120298406
Publication date
Nov 29, 2012
International Business Machines Corporation
Wai Mon Ma
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
LAND GRID ARRAY SITE GEOMETRY FOR ELECTRONIC ASSEMBLIES
Publication number
20090172941
Publication date
Jul 9, 2009
International Business Machines Corporation
Roger Lam
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Surface Mount Array Connector Leads Planarization Using Solder Refl...
Publication number
20090111299
Publication date
Apr 30, 2009
International Business Machines Corporation
Michael J. Domitrovits
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ENHANCED HEAT SYSTEM FOR BGA/CGA REWORK
Publication number
20060202001
Publication date
Sep 14, 2006
International Business Machines Corporation
Raymond D. Birchall
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Structure for repairing or modifying surface connections on circuit...
Publication number
20050239347
Publication date
Oct 27, 2005
International Business Machines Corporation
Bruce John Chamberlin
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD AND STRUCTURE FOR HEAT SINK ATTACHMENT IN SEMICONDUCTOR DEVI...
Publication number
20050174738
Publication date
Aug 11, 2005
International Business Machines Corporation
Roger Lam
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INCLINED SOLDER WAVE METHODOLOGY FOR WAVE SOLDERING DOUBLE SIDED PI...
Publication number
20050061850
Publication date
Mar 24, 2005
International Business Machines Corporation
Todd H. Buley
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method and structure for repairing or modifying surface connections...
Publication number
20040216919
Publication date
Nov 4, 2004
International Business Machines Corporation
Bruce John Chamberlin
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
TERMINATING FLOATING SIGNALS ON A BGA MODULE TO A GROUND PLANE ON A...
Publication number
20030003800
Publication date
Jan 2, 2003
International Business Machines Corporation
Brian D. Chapman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method and structure for repairing or modifying surface connections...
Publication number
20020179324
Publication date
Dec 5, 2002
International Business Machines Corporation
Bruce John Chamberlin
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Application
Land grid array (LGA) pad repair structure and method
Publication number
20020166696
Publication date
Nov 14, 2002
International Business Machines Corporation
Bruce J. Chamberlin
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Application
Method and structure for reducing power noise
Publication number
20010004942
Publication date
Jun 28, 2001
Simone Rehm
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...