Wai Wong Chow

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Sheung Shui, HK

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method with clip arrangement in IC package
- Patent number 10,825,757
- Issue date Nov 3, 2020
- Nexperia B.V.
- Haibo Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 10,658,274
- Issue date May 19, 2020
- Nexperia B.V.
- Tim Boettcher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless package with non-collapsible bump
- Patent number 10,269,751
- Issue date Apr 23, 2019
- Nexperia B.V.
- Wai Wong Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component having first surface area for electrically...
- Patent number 6,949,816
- Issue date Sep 27, 2005
- Motorola, Inc.
- Clem H. Brown
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of attaching a die to a substrate
- Patent number 6,798,074
- Issue date Sep 28, 2004
- Motorola, Inc.
- Man Hon Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical sensor package
- Patent number 6,667,543
- Issue date Dec 23, 2003
- Motorola, Inc.
- Wai Wong Chow
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE
- Publication number 20190189545
- Publication date Jun 20, 2019
- NEXPERIA B.V.
- Tim BOETTCHER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD WITH CLIP ARRANGEMENT IN IC PACKAGE
- Publication number 20180174951
- Publication date Jun 21, 2018
- Nexperia B.V.
- Haibo Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADLESS PACKAGE WITH NON-COLLAPSIBLE BUMP
- Publication number 20180122763
- Publication date May 3, 2018
- Nexperia B.V.
- Wai Wong Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of attaching a die to a substrate
- Publication number 20040178511
- Publication date Sep 16, 2004
- Man Hon Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical sensor package
- Publication number 20040080029
- Publication date Apr 29, 2004
- Wai Wong Chow
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Multi-row leadframe
- Publication number 20030168719
- Publication date Sep 11, 2003
- Man Hon Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and method for making the same
- Publication number 20020177254
- Publication date Nov 28, 2002
- Wai Wong Chow
- H01 - BASIC ELECTRIC ELEMENTS