TREA

Wai Wong Chow

Follow

Person

  • Hong Kong, HK
People

Patents Grantslast 30 patents

  • Information Patent Grant

    Flipchip QFN package
    • Patent number 7,112,871
    • Issue date Sep 26, 2006
    • FREESCALE SEMICONDUCTOR, INC.
    • Hei Ming Shiu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method of forming land grid array packaged device
    • Patent number 7,056,766
    • Issue date Jun 6, 2006
    • FREESCALE SEMICONDUCTOR, INC.
    • Hei Ming Shiu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method for making dual gauge leadframe
    • Patent number 7,033,866
    • Issue date Apr 25, 2006
    • FREESCALE SEMICONDUCTOR, INC.
    • Wai Wong Chow
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Optical sensor package
    • Patent number 6,958,261
    • Issue date Oct 25, 2005
    • FREESCALE SEMICONDUCTOR, INC.
    • Wai Wong Chow
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Grant

    Method of packaging an optical sensor
    • Patent number 6,905,910
    • Issue date Jun 14, 2005
    • FREESCALE SEMICONDUCTOR, INC.
    • Hei Ming Shiu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method of attaching a die to a substrate
    • Patent number 6,875,635
    • Issue date Apr 5, 2005
    • FREESCALE SEMICONDUCTOR, INC.
    • Man Hon Cheng
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Flipchip QFN package and method therefor
    • Patent number 6,867,072
    • Issue date Mar 15, 2005
    • FREESCALE SEMICONDUCTOR, INC.
    • Hei Ming Shiu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Multi-row leadframe
    • Patent number 6,838,751
    • Issue date Jan 4, 2005
    • Freescale Semiconductor Inc.
    • Man Hon Cheng
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents