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Wakana Onoe

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Wafer processing method
    • Patent number 10,991,622
    • Issue date Apr 27, 2021
    • DISCO CORPORTION
    • Meiyu Piao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wafer processing method
    • Patent number 10,991,623
    • Issue date Apr 27, 2021
    • Disco Corporation
    • Masatoshi Wakahara
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer processing method
    • Patent number 10,784,166
    • Issue date Sep 22, 2020
    • Disco Corporation
    • Meiyu Piao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Laser processing apparatus
    • Patent number 10,722,980
    • Issue date Jul 28, 2020
    • Disco Corporation
    • Kohei Tanaka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Laser processing apparatus
    • Patent number 10,695,870
    • Issue date Jun 30, 2020
    • Disco Corporation
    • Yutaka Kobayashi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Laser machining apparatus
    • Patent number 9,434,023
    • Issue date Sep 6, 2016
    • Disco Corporation
    • Taiki Sawabe
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20200185227
    • Publication date Jun 11, 2020
    • Disco Corporation
    • Masatoshi WAKAHARA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20200051861
    • Publication date Feb 13, 2020
    • Disco Corporation
    • Meiyu PIAO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20200051862
    • Publication date Feb 13, 2020
    • Disco Corporation
    • Meiyu PIAO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LASER PROCESSING APPARATUS
    • Publication number 20180264599
    • Publication date Sep 20, 2018
    • Disco Corporation
    • Yutaka Kobayashi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING APPARATUS
    • Publication number 20170087671
    • Publication date Mar 30, 2017
    • Disco Corporation
    • Kohei Tanaka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING APPARATUS
    • Publication number 20170087663
    • Publication date Mar 30, 2017
    • Disco Corporation
    • Wakana Onoe
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER MACHINING APPARATUS
    • Publication number 20140299586
    • Publication date Oct 9, 2014
    • Disco Corporation
    • Taiki Sawabe
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING METHOD FOR WAFER
    • Publication number 20140106543
    • Publication date Apr 17, 2014
    • Disco Corporation
    • Tomohiro Endo
    • H01 - BASIC ELECTRIC ELEMENTS