Walter H Schroen

Person

Dallas, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Photo-sensitive silicon package embedding self-powered electronic s...
- Patent number 11,177,246
- Issue date Nov 16, 2021
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photo-sensitive silicon package embedding self-powered electronic s...
- Patent number 10,438,936
- Issue date Oct 8, 2019
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photo-sensitive silicon package embedding self-powered electronic s...
- Patent number 9,859,261
- Issue date Jan 2, 2018
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photo-sensitive silicon package embedding self-powered electronic s...
- Patent number 9,640,519
- Issue date May 2, 2017
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packaging
- Patent number 6,998,297
- Issue date Feb 14, 2006
- Texas Instruments Incorporated
- Walter H. Schroen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packaging
- Patent number 6,407,333
- Issue date Jun 18, 2002
- Texas Instruments Incorporated
- Walter H. Schroen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully hermetic semiconductor chip, including sealed edge sides
- Patent number 6,303,977
- Issue date Oct 16, 2001
- Texas Instruments Incorporated
- Walter H. Schroen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-semiconductor ohmic contacts and methods of fabrication
- Patent number 3,983,264
- Issue date Sep 28, 1976
- Texas Instruments Incorporated
- Walter H. Schroen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PHOTO-SENSITIVE SILICON PACKAGE EMBEDDING SELF-POWERED ELECTRONIC S...
- Publication number 20190385992
- Publication date Dec 19, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photo-Sensitive Silicon Package Embedding Self-Powered Electronic S...
- Publication number 20180096978
- Publication date Apr 5, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photo-Sensitive Silicon Package Embedding Self-Powered Electronic S...
- Publication number 20170194306
- Publication date Jul 6, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTO-SENSITIVE SILICON PACKAGE EMBEDDING SELF-POWERED ELECTRONIC S...
- Publication number 20160133616
- Publication date May 12, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor System Integrated With Through Silicon Vias for Nerve...
- Publication number 20110112606
- Publication date May 12, 2011
- TEXAS INSTRUMENTS INCORPORATED
- Alan Gatherer
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
Wafer level packaging
- Publication number 20040222504
- Publication date Nov 11, 2004
- Walter H Schroen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer level packaging
- Publication number 20010039078
- Publication date Nov 8, 2001
- Walter H Schroen
- H01 - BASIC ELECTRIC ELEMENTS

Walter H Schroen

Person

Patents Grantslast 30 patents

Photo-sensitive silicon package embedding self-powered electronic s...

Photo-sensitive silicon package embedding self-powered electronic s...

Photo-sensitive silicon package embedding self-powered electronic s...

Photo-sensitive silicon package embedding self-powered electronic s...

Wafer level packaging

Wafer level packaging

Fully hermetic semiconductor chip, including sealed edge sides

Metal-semiconductor ohmic contacts and methods of fabrication

Patents Applicationslast 30 patents

PHOTO-SENSITIVE SILICON PACKAGE EMBEDDING SELF-POWERED ELECTRONIC S...

Photo-Sensitive Silicon Package Embedding Self-Powered Electronic S...

Photo-Sensitive Silicon Package Embedding Self-Powered Electronic S...

PHOTO-SENSITIVE SILICON PACKAGE EMBEDDING SELF-POWERED ELECTRONIC S...

Semiconductor System Integrated With Through Silicon Vias for Nerve...

Wafer level packaging

Wafer level packaging