Walter J. Dauksher

Person

Fort Collins, CO, US

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate warpage control using external frame stiffener
- Patent number 9,355,966
- Issue date May 31, 2016
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Adam Gallegos
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Trace design to minimize electromigration damage to solder bumps
- Patent number 7,659,622
- Issue date Feb 9, 2010
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Walter J. Dauksher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transducers with annular contacts
- Patent number 7,579,753
- Issue date Aug 25, 2009
- Avago Technologies Wireless IP (Singapore) Pte. Ltd.
- R. Shane Fazzio
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Multi-layer transducers with annular contacts
- Patent number 7,538,477
- Issue date May 26, 2009
- Avago Technologies Wireless IP (Singapore) Pte. Ltd.
- R. Shane Fazzio
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Trace design to minimize electromigration damage to solder bumps
- Patent number 7,253,528
- Issue date Aug 7, 2007
- Avago Technologies General IP Pte. Ltd.
- Walter John Dauksher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Routing design to minimize electromigration damage to solder bumps
- Patent number 7,208,843
- Issue date Apr 24, 2007
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Wayne Patrick Richling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for enhancing the local cooling of electronic packages subje...
- Patent number 6,661,666
- Issue date Dec 9, 2003
- Agilent Technologies, Inc.
- Walter J. Dauksher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for the reduction of interfacial stress caused by differe...
- Patent number 6,320,754
- Issue date Nov 20, 2001
- Agilent Technologies, Inc.
- Walter J Dauksher
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Concentric Stiffener Providing Warpage Control To An Electronic Pac...
- Publication number 20150371884
- Publication date Dec 24, 2015
- Avago Technologies General IP (Singapore) PTE. LTD.
- Walter Dauksher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE WARPAGE CONTROL USING EXTERNAL FRAME STIFFENER
- Publication number 20150008571
- Publication date Jan 8, 2015
- Avago Technologies General IP (Singapore) PTE. LTD.
- Adam Gallegos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR FABRICATING A LAMINATE STRUCTURE
- Publication number 20130105063
- Publication date May 2, 2013
- Walter J. Dauksher
- B32 - LAYERED PRODUCTS
Information Patent Application
Transducers with annular contacts
- Publication number 20080122320
- Publication date May 29, 2008
- R. Shane Fazzio
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MULTI-LAYER TRANSDUCERS WITH ANNULAR CONTACTS
- Publication number 20080122317
- Publication date May 29, 2008
- R. Shane Fazzio
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
Trace Design to Minimize Electromigration Damage to Solder Bumps
- Publication number 20080042271
- Publication date Feb 21, 2008
- Walter J. Dauksher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Trace design to minimize electromigration damage to solder bumps
- Publication number 20060186539
- Publication date Aug 24, 2006
- Walter John Dauksher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Routing design to minimize electromigration damage to solder bumps
- Publication number 20060170100
- Publication date Aug 3, 2006
- Wayne Patrick Richling
- H01 - BASIC ELECTRIC ELEMENTS

Walter J. Dauksher

Person

Patents Grantslast 30 patents

Substrate warpage control using external frame stiffener

Trace design to minimize electromigration damage to solder bumps

Transducers with annular contacts

Multi-layer transducers with annular contacts

Trace design to minimize electromigration damage to solder bumps

Routing design to minimize electromigration damage to solder bumps

Device for enhancing the local cooling of electronic packages subje...

Apparatus for the reduction of interfacial stress caused by differe...

Patents Applicationslast 30 patents

Concentric Stiffener Providing Warpage Control To An Electronic Pac...

SUBSTRATE WARPAGE CONTROL USING EXTERNAL FRAME STIFFENER

SYSTEM AND METHOD FOR FABRICATING A LAMINATE STRUCTURE

Transducers with annular contacts

MULTI-LAYER TRANSDUCERS WITH ANNULAR CONTACTS

Trace Design to Minimize Electromigration Damage to Solder Bumps

Trace design to minimize electromigration damage to solder bumps

Routing design to minimize electromigration damage to solder bumps