Walter Kronenberg

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Koln, DE

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Patents Grantslast 30 patents

Information Patent Grant
Direct metallization of electrically non-conductive polyimide subst...
- Patent number 7,815,785
- Issue date Oct 19, 2010
- Enthone Inc.
- Walter Kronenberg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for the copper plating of substrates
- Patent number 6,576,111
- Issue date Jun 10, 2003
- Balsberg Oberflächentechnik GmbH
- Jürgen Hupe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through-hole plate printed circuit board with resist and process fo...
- Patent number 5,373,629
- Issue date Dec 20, 1994
- Blasberg Oberflachentechnik GmbH
- Jurgen Hupe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Through-hole plated printed circuit board and process for manufactu...
- Patent number 5,194,313
- Issue date Mar 16, 1993
- Blas-Berg-Oberflachentechnik GmbH
- Jurgen Hupe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
DIRECT METALLIZATION OF ELECTRICALLY NON-CONDUCTIVE POLYIMIDE SUBST...
- Publication number 20070298170
- Publication date Dec 27, 2007
- Enthone Inc.
- Walter Kronenberg
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for selectively metalizing dieletric materials
- Publication number 20040026254
- Publication date Feb 12, 2004
- Jurgen Hupe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Process for electroplating a work piece coated with an electrically...
- Publication number 20020157959
- Publication date Oct 31, 2002
- Walter Kronenberg
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR