Walter M. Marcinkiewicz

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Niskayuna, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit chip placement in a high density interconnect st...
- Patent number 5,422,513
- Issue date Jun 6, 1995
- Martin Marietta Corporation
- Walter M. Marcinkiewicz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact high density interconnect structure
- Patent number 5,241,456
- Issue date Aug 31, 1993
- General Electric Company
- Walter M. Marcinkiewicz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact, thermally efficient focal plane array and testing and repa...
- Patent number 5,157,255
- Issue date Oct 20, 1992
- General Electric Company
- William P. Kornrumpf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact, thermally efficient focal plane array and testing and repa...
- Patent number 5,146,303
- Issue date Sep 8, 1992
- General Electric Company
- William P. Kornrumpf
- H01 - BASIC ELECTRIC ELEMENTS