Walter M. Whybrew

Person

Palm Bay, FL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of making printed wiring board with enhanced structural inte...
- Patent number 7,948,766
- Issue date May 24, 2011
- Harris Corporation
- Gregory M. Jandzio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board (PCB)with enhanced structural integrity
- Patent number 7,907,417
- Issue date Mar 15, 2011
- Harris Corporation
- Gregory M. Jandzio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board with enhanced structural integrity
- Patent number 7,499,287
- Issue date Mar 3, 2009
- Harris Corporation
- Gregory M. Jandzio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible appliance and related method for orthogonal, non-planar in...
- Patent number 7,479,604
- Issue date Jan 20, 2009
- Harris Corporation
- Brian Smith
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board with enhanced structural integrity
- Patent number 7,342,801
- Issue date Mar 11, 2008
- Harris Corporation
- Gregory M. Jandzio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductor-within-a-via microwave launch
- Patent number 6,937,120
- Issue date Aug 30, 2005
- Harris Corporation
- Charles Robert Fisher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microwave device having a slotted coaxial cable-to-microstrip conne...
- Patent number 6,894,582
- Issue date May 17, 2005
- Harris Corporation
- Walter M. Whybrew
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sloppy coax interconnect for low cost RF and phased array applications
- Patent number 6,473,039
- Issue date Oct 29, 2002
- Walter M. Whybrew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spatially orthogonal signal distribution and support architecture f...
- Patent number 6,429,816
- Issue date Aug 6, 2002
- Harris Corporation
- Walter M. Whybrew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Phased array antenna with interconnect member for electrically conn...
- Patent number 6,320,546
- Issue date Nov 20, 2001
- Harris Corporation
- Charles M. Newton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Phased array antenna having stacked patch antenna element with sing...
- Patent number 6,266,015
- Issue date Jul 24, 2001
- Harris Corporation
- Douglas E. Heckaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi title-configured phased array antenna architecture
- Patent number 6,166,705
- Issue date Dec 26, 2000
- Harris Corporation
- Alan W. Mast
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cross-over distribution scheme for canceling mutually coupled signa...
- Patent number 6,130,585
- Issue date Oct 10, 2000
- Harris Corporation
- Walter M. Whybrew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Distributed ground pads for shielding cross-overs of mutually overl...
- Patent number 6,097,260
- Issue date Aug 1, 2000
- Harris Corporation
- Walter M. Whybrew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High isolation cross-over for canceling mutually coupled signals be...
- Patent number 6,028,494
- Issue date Feb 22, 2000
- Harris Corporation
- Jeffery C. May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lightweight antenna subpanel having RF amplifier modules embedded i...
- Patent number 5,907,304
- Issue date May 25, 1999
- Harris Corporation
- Steven E. Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency, low temperature thermosonic ribbon bonding process...
- Patent number 5,894,983
- Issue date Apr 20, 1999
- Harris Corporation
- Donald J. Beck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combined RF and digital/DC signalling interconnect laminate
- Patent number 5,384,555
- Issue date Jan 24, 1995
- Harris Corporation
- Steven E. Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-state, two-output variable RF power divider
- Patent number 4,956,621
- Issue date Sep 11, 1990
- Harris Corporation
- Douglas E. Heckaman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRINTED WIRING BOARD WITH ENHANCED STRUCTURAL INTEGRITY
- Publication number 20090265930
- Publication date Oct 29, 2009
- Harris Corporation
- Gregory M. JANDZIO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD WITH ENHANCED STRUCTURAL INTEGRITY
- Publication number 20080245552
- Publication date Oct 9, 2008
- Harris Corporation
- Gregory M. JANDZIO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD WITH ENHANCED STRUCTURAL INTEGRITY
- Publication number 20080106475
- Publication date May 8, 2008
- Harris Corporation
- Gregory M. Jandzio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board with enhanced structural integrity
- Publication number 20050243527
- Publication date Nov 3, 2005
- Harris Corporation
- Gregory M. Jandzio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductor-within-a-via microwave launch
- Publication number 20040196122
- Publication date Oct 7, 2004
- Harris Corporation
- Charles Robert Fisher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Microwave device having a slotted coaxial cable-to-microstrip conne...
- Publication number 20040155724
- Publication date Aug 12, 2004
- Harris Corporation
- Walter M. Whybrew
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Walter M. Whybrew

Person

Patents Grantslast 30 patents

Method of making printed wiring board with enhanced structural inte...

Printed circuit board (PCB)with enhanced structural integrity

Printed wiring board with enhanced structural integrity

Flexible appliance and related method for orthogonal, non-planar in...

Printed wiring board with enhanced structural integrity

Conductor-within-a-via microwave launch

Microwave device having a slotted coaxial cable-to-microstrip conne...

Sloppy coax interconnect for low cost RF and phased array applications

Spatially orthogonal signal distribution and support architecture f...

Phased array antenna with interconnect member for electrically conn...

Phased array antenna having stacked patch antenna element with sing...

Multi title-configured phased array antenna architecture

Cross-over distribution scheme for canceling mutually coupled signa...

Distributed ground pads for shielding cross-overs of mutually overl...

High isolation cross-over for canceling mutually coupled signals be...

Lightweight antenna subpanel having RF amplifier modules embedded i...

High frequency, low temperature thermosonic ribbon bonding process...

Combined RF and digital/DC signalling interconnect laminate

Three-state, two-output variable RF power divider

Patents Applicationslast 30 patents

PRINTED WIRING BOARD WITH ENHANCED STRUCTURAL INTEGRITY

PRINTED WIRING BOARD WITH ENHANCED STRUCTURAL INTEGRITY

PRINTED WIRING BOARD WITH ENHANCED STRUCTURAL INTEGRITY

Printed wiring board with enhanced structural integrity

Conductor-within-a-via microwave launch

Microwave device having a slotted coaxial cable-to-microstrip conne...