Walter R. Merry

Person

Sunnyvale, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Feedforward temperature control for plasma processing apparatus
- Patent number 10,854,425
- Issue date Dec 1, 2020
- Applied Materials, Inc.
- Chetan Mahadeswaraswamy
- G05 - CONTROLLING REGULATING
Information Patent Grant
Feedforward temperature control for plasma processing apparatus
- Patent number 9,338,871
- Issue date May 10, 2016
- Applied Materials, Inc.
- Chetan Mahadeswaraswamy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Temperature control in plasma processing apparatus using pulsed hea...
- Patent number 9,214,315
- Issue date Dec 15, 2015
- Applied Materials, Inc.
- Fernando M. Silveira
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Temperature control in plasma processing apparatus using pulsed hea...
- Patent number 8,916,793
- Issue date Dec 23, 2014
- Applied Materials, Inc.
- Fernando M. Silveira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature control with stacked proportioning valve
- Patent number 8,632,689
- Issue date Jan 21, 2014
- Applied Materials, Inc.
- Walter R. Merry
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method and apparatus for removing polymer from the wafer backside a...
- Patent number 8,329,593
- Issue date Dec 11, 2012
- Applied Materials, Inc.
- Imad Yousif
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Efficient and accurate method for real-time prediction of the self-...
- Patent number 8,313,664
- Issue date Nov 20, 2012
- Applied Materials, Inc.
- Zhigang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma process uniformity across a wafer by controlling a variable...
- Patent number 8,080,479
- Issue date Dec 20, 2011
- Applied Materials, Inc.
- Kenneth S. Collins
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma process uniformity across a wafer by controlling RF phase be...
- Patent number 8,076,247
- Issue date Dec 13, 2011
- Applied Materials, Inc.
- Kenneth S. Collins
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of processing a workpiece in a plasma reactor with variable...
- Patent number 7,968,469
- Issue date Jun 28, 2011
- Applied Materials, Inc.
- Kenneth S. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for wafer backside polymer removal and wafer front side pho...
- Patent number 7,967,996
- Issue date Jun 28, 2011
- Applied Materials, Inc.
- Kenneth S. Collins
- B08 - CLEANING
Information Patent Grant
Plasma process uniformity across a wafer by apportioning ground ret...
- Patent number 7,884,025
- Issue date Feb 8, 2011
- Applied Materials, Inc.
- Kenneth S. Collins
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Improving plasma process uniformity across a wafer by apportioning...
- Patent number 7,879,731
- Issue date Feb 1, 2011
- Applied Materials, Inc.
- Kenneth S. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for front side protection during backside clea...
- Patent number 7,879,183
- Issue date Feb 1, 2011
- Applied Materials, Inc.
- Imad Yousif
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Matching network characterization using variable impedance analysis
- Patent number 7,554,334
- Issue date Jun 30, 2009
- Applied Marterials, Inc.
- Steven C. Shannon
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method and apparatus for in-situ film stack processing
- Patent number 7,358,192
- Issue date Apr 15, 2008
- Applied Materials, Inc.
- Walter R. Merry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for plasma etching a dielectric layer
- Patent number 7,056,830
- Issue date Jun 6, 2006
- Applied Materials, Inc.
- Walter R. Merry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor fabrication process
- Patent number 6,432,830
- Issue date Aug 13, 2002
- Applied Materials, Inc.
- Walter Richardson Merry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oxide plasma etching process with a controlled wineglass shape
- Patent number 6,355,557
- Issue date Mar 12, 2002
- Applied Materials, Inc.
- James A. Stinnett
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for sidewall profile control during an etch process
- Patent number 6,248,206
- Issue date Jun 19, 2001
- Applied Materials Inc.
- Harald Herchen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer removal from top surfaces and sidewalls of a semiconductor...
- Patent number 6,062,237
- Issue date May 16, 2000
- Applied Materials, Inc.
- William Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microwave-activated etching of dielectric layers
- Patent number 6,015,761
- Issue date Jan 18, 2000
- Applied Materials, Inc.
- Walter Richardson Merry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch enhancement using an improved gas distribution plate
- Patent number 5,819,434
- Issue date Oct 13, 1998
- Applied Materials, Inc.
- Harald Herchen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low volume gas distribution assembly for a chemical downstream etch...
- Patent number 5,789,322
- Issue date Aug 4, 1998
- Applied Materials, Inc.
- William Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective plasma etching of silicon nitride in presence of silicon...
- Patent number 5,786,276
- Issue date Jul 28, 1998
- Applied Materials, Inc.
- Cynthia B. Brooks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer removal from top surfaces and sidewalls of a semiconductor...
- Patent number 5,780,359
- Issue date Jul 14, 1998
- Applied Materials, Inc.
- William Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low volume gas distribution assembly and method for a chemical down...
- Patent number 5,728,260
- Issue date Mar 17, 1998
- Applied Materials, Inc.
- William Brown
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FEEDFORWARD TEMPERATURE CONTROL FOR PLASMA PROCESSING APPARATUS
- Publication number 20160155612
- Publication date Jun 2, 2016
- Chetan MAHADESWARASWAMY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE CONTROL IN PLASMA PROCESSING APPARATUS USING PULSED HEA...
- Publication number 20150316941
- Publication date Nov 5, 2015
- Applied Materials, Inc.
- Fernando M. SILVEIRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOMATED ALGORITHM FOR TUNING OF FEEDFORWARD CONTROL PARAMETERS IN...
- Publication number 20140224767
- Publication date Aug 14, 2014
- Walter R. MERRY
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TEMPERATURE CONTROL WITH STACKED PROPORTIONING VALVE
- Publication number 20130105442
- Publication date May 2, 2013
- Walter R. MERRY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE CONTROL IN PLASMA PROCESSING APPARATUS USING PULSED HEA...
- Publication number 20120132397
- Publication date May 31, 2012
- Applied Materials, Inc.
- Fernando M. Silveira
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FEEDFORWARD TEMPERATURE CONTROL FOR PLASMA PROCESSING APPARATUS
- Publication number 20110186545
- Publication date Aug 4, 2011
- Applied Materials, Inc.
- Chetan MAHADESWARASWAMY
- G05 - CONTROLLING REGULATING
Information Patent Application
APPARATUS AND METHOD FOR FRONT SIDE PROTECTION DURING BACKSIDE CLEA...
- Publication number 20110120505
- Publication date May 26, 2011
- Applied Materials, Inc.
- IMAD YOUSIF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EFFICIENT AND ACCURATE METHOD FOR REAL-TIME PREDICTION OF THE SELF-...
- Publication number 20100136793
- Publication date Jun 3, 2010
- Applied Materials, Inc.
- Zhigang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR REMOVING POLYMER FROM A SUBSTRATE
- Publication number 20090302002
- Publication date Dec 10, 2009
- Applied Materials, Inc.
- Kenneth Collins
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD OF SUBSTRATE POLYMER REMOVAL
- Publication number 20090293907
- Publication date Dec 3, 2009
- Nancy Fung
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
APPARATUS AND METHOD FOR FRONT SIDE PROTECTION DURING BACKSIDE CLEA...
- Publication number 20090214798
- Publication date Aug 27, 2009
- IMAD YOUSIF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for removing polymer from the wafer backside a...
- Publication number 20090156013
- Publication date Jun 18, 2009
- Imad Yousif
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESS UNIFORMITY ACROSS A WAFER BY APPORTIONING GROUND RET...
- Publication number 20080182417
- Publication date Jul 31, 2008
- KENNETH S. COLLINS
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA PROCESS UNIFORMITY ACROSS A WAFER BY CONTROLLING A VARIABLE...
- Publication number 20080182418
- Publication date Jul 31, 2008
- KENNETH S. COLLINS
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA PROCESS UNIFORMITY ACROSS A WAFER BY CONTROLLING RF PHASE BE...
- Publication number 20080180028
- Publication date Jul 31, 2008
- KENNETH S. COLLINS
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF PROCESSING A WORKPIECE IN A PLASMA REACTOR WITH VARIABLE...
- Publication number 20080179181
- Publication date Jul 31, 2008
- KENNETH S. COLLINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESS UNIFORMITY ACROSS A WAFER BY APPORTIONING POWER AMON...
- Publication number 20080182416
- Publication date Jul 31, 2008
- KENNETH S. COLLINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for wafer backside polymer removal and wafer front side pho...
- Publication number 20080179291
- Publication date Jul 31, 2008
- Kenneth S. Collins
- B08 - CLEANING
Information Patent Application
PLASMA REACTOR WITH ION DISTRIBUTION UNIFORMITY CONTROLLER EMPLOYIN...
- Publication number 20080178803
- Publication date Jul 31, 2008
- KENNETH S. COLLINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA REACTOR WITH WIDE PROCESS WINDOW EMPLOYING PLURAL VHF SOURCES
- Publication number 20080179011
- Publication date Jul 31, 2008
- KENNETH S. COLLINS
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MATCHING NETWORK CHARACTERIZATION USING VARIABLE IMPEDANCE ANALYSIS
- Publication number 20080087381
- Publication date Apr 17, 2008
- Applied Materials, Inc.
- STEVEN C. SHANNON
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Method and apparatus for in-situ film stack processing
- Publication number 20050224181
- Publication date Oct 13, 2005
- APPLIED MATERIALS, INC.
- Walter R. Merry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for plasma etching a dielectric layer
- Publication number 20050048789
- Publication date Mar 3, 2005
- Walter R. Merry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OXIDE PLASMA ETCHING PROCESS WITH A CONTROLLED WINEGLASS SHAPE
- Publication number 20010003678
- Publication date Jun 14, 2001
- JAMES A. STINNETT
- H01 - BASIC ELECTRIC ELEMENTS

Walter R. Merry

Person

Patents Grantslast 30 patents

Feedforward temperature control for plasma processing apparatus

Feedforward temperature control for plasma processing apparatus

Temperature control in plasma processing apparatus using pulsed hea...

Temperature control in plasma processing apparatus using pulsed hea...

Temperature control with stacked proportioning valve

Method and apparatus for removing polymer from the wafer backside a...

Efficient and accurate method for real-time prediction of the self-...

Plasma process uniformity across a wafer by controlling a variable...

Plasma process uniformity across a wafer by controlling RF phase be...

Method of processing a workpiece in a plasma reactor with variable...

Process for wafer backside polymer removal and wafer front side pho...

Plasma process uniformity across a wafer by apportioning ground ret...

Improving plasma process uniformity across a wafer by apportioning...

Apparatus and method for front side protection during backside clea...

Matching network characterization using variable impedance analysis

Method and apparatus for in-situ film stack processing

Method for plasma etching a dielectric layer

Semiconductor fabrication process

Oxide plasma etching process with a controlled wineglass shape

Apparatus for sidewall profile control during an etch process

Polymer removal from top surfaces and sidewalls of a semiconductor...

Microwave-activated etching of dielectric layers

Etch enhancement using an improved gas distribution plate

Low volume gas distribution assembly for a chemical downstream etch...

Selective plasma etching of silicon nitride in presence of silicon...

Polymer removal from top surfaces and sidewalls of a semiconductor...

Low volume gas distribution assembly and method for a chemical down...

Patents Applicationslast 30 patents

FEEDFORWARD TEMPERATURE CONTROL FOR PLASMA PROCESSING APPARATUS

TEMPERATURE CONTROL IN PLASMA PROCESSING APPARATUS USING PULSED HEA...

AUTOMATED ALGORITHM FOR TUNING OF FEEDFORWARD CONTROL PARAMETERS IN...

TEMPERATURE CONTROL WITH STACKED PROPORTIONING VALVE

TEMPERATURE CONTROL IN PLASMA PROCESSING APPARATUS USING PULSED HEA...

FEEDFORWARD TEMPERATURE CONTROL FOR PLASMA PROCESSING APPARATUS

APPARATUS AND METHOD FOR FRONT SIDE PROTECTION DURING BACKSIDE CLEA...

EFFICIENT AND ACCURATE METHOD FOR REAL-TIME PREDICTION OF THE SELF-...

METHOD AND APPARATUS FOR REMOVING POLYMER FROM A SUBSTRATE

METHOD OF SUBSTRATE POLYMER REMOVAL

APPARATUS AND METHOD FOR FRONT SIDE PROTECTION DURING BACKSIDE CLEA...

Method and apparatus for removing polymer from the wafer backside a...

PLASMA PROCESS UNIFORMITY ACROSS A WAFER BY APPORTIONING GROUND RET...

PLASMA PROCESS UNIFORMITY ACROSS A WAFER BY CONTROLLING A VARIABLE...

PLASMA PROCESS UNIFORMITY ACROSS A WAFER BY CONTROLLING RF PHASE BE...

METHOD OF PROCESSING A WORKPIECE IN A PLASMA REACTOR WITH VARIABLE...

PLASMA PROCESS UNIFORMITY ACROSS A WAFER BY APPORTIONING POWER AMON...

Process for wafer backside polymer removal and wafer front side pho...

PLASMA REACTOR WITH ION DISTRIBUTION UNIFORMITY CONTROLLER EMPLOYIN...

PLASMA REACTOR WITH WIDE PROCESS WINDOW EMPLOYING PLURAL VHF SOURCES

MATCHING NETWORK CHARACTERIZATION USING VARIABLE IMPEDANCE ANALYSIS

Method and apparatus for in-situ film stack processing

Method for plasma etching a dielectric layer

OXIDE PLASMA ETCHING PROCESS WITH A CONTROLLED WINEGLASS SHAPE