Walter V. Werner

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Pittsford, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Multiple stem design for high density interconnects
- Patent number 8,152,549
- Issue date Apr 10, 2012
- Lockheed Martin Corporation
- Walter V. Werner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connecting elements having a stub surrounded by a hollow stalk with...
- Patent number 7,997,921
- Issue date Aug 16, 2011
- Lockheed Martin Corporation
- Walter V. Werner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hollow stem design for high density interconnects
- Patent number 7,942,687
- Issue date May 17, 2011
- Lockheed Martin Corporation
- Walter V. Werner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for mitigation of modal dispersion effects in...
- Patent number 7,215,847
- Issue date May 8, 2007
- Lockheed Martin Corporation
- Walter V. Werner
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
MULTIPLE STEM DESIGN FOR HIGH DENSITY INTERCONNECTS
- Publication number 20120108082
- Publication date May 3, 2012
- Walter V. Werner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Free-Space Communications System and Method
- Publication number 20080240718
- Publication date Oct 2, 2008
- Walter V. Werner
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Method and apparatus for mitigation of modal dispersion effects in...
- Publication number 20060093260
- Publication date May 4, 2006
- Lockheed Martin Corporation
- Walter V. Werner
- H04 - ELECTRIC COMMUNICATION TECHNIQUE