Wan-I Shih

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Fan-out package and methods of forming thereof
- Patent number 11,532,577
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wan-Ting Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Communication system and codec method based on deep learning and kn...
- Patent number 10,911,113
- Issue date Feb 2, 2021
- Industrial Technology Research Institute
- Chao-Kai Wen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
PoP device
- Patent number 10,867,897
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching method for multiple antenna arrays and electronic device...
- Patent number 10,771,143
- Issue date Sep 8, 2020
- Industrial Technology Research Institute
- Chao-Kai Wen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Fan-out package and methods of forming thereof
- Patent number 10,741,511
- Issue date Aug 11, 2020
- Taiwan Semiconductor Manufacturing Company
- Wan-Ting Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package and methods of forming thereof
- Patent number 10,366,960
- Issue date Jul 30, 2019
- Taiwan Semiconductor Manufacturing Company
- Wan-Ting Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PoP device
- Patent number 9,953,907
- Issue date Apr 24, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package and methods of forming thereof
- Patent number 9,824,989
- Issue date Nov 21, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wan-Ting Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging a semiconductor device
- Patent number 9,312,148
- Issue date Apr 12, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device with a molding compound and a method...
- Patent number 9,000,584
- Issue date Apr 7, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Drive method to reduce power dissipation for flat panel display
- Patent number 7,616,222
- Issue date Nov 10, 2009
- Silicon Touch Technology Inc.
- Yu-Chun Chuang
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Submount-holder for flip chip package
- Patent number 6,720,664
- Issue date Apr 13, 2004
- Tyntek Corporation
- Chi-Jen Teng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Fan-Out Package and Methods of Forming Thereof
- Publication number 20200373264
- Publication date Nov 26, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wan-Ting Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMMUNICATION SYSTEM AND CODEC METHOD BASED ON DEEP LEARNING AND KN...
- Publication number 20200220593
- Publication date Jul 9, 2020
- Industrial Technology Research Institute
- Chao-Kai Wen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Fan-Out Package and Methods of Forming Thereof
- Publication number 20190355684
- Publication date Nov 21, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wan-Ting Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PoP Device
- Publication number 20180233441
- Publication date Aug 16, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out Package and Methods of Forming Thereof
- Publication number 20180033747
- Publication date Feb 1, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wan-Ting Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out Package and Methods of Forming Thereof
- Publication number 20160005702
- Publication date Jan 7, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wan-Ting Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PACKAGING A SEMICONDUCTOR DEVICE
- Publication number 20150187605
- Publication date Jul 2, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PoP Device
- Publication number 20140210080
- Publication date Jul 31, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF PACKAGING THE SEMICONDU...
- Publication number 20130168848
- Publication date Jul 4, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Drive method to reduce power dissipation for flat panel display and...
- Publication number 20060238552
- Publication date Oct 26, 2006
- Yu-Chun Chuang
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS

Person

Patents Grantslast 30 patents

Fan-out package and methods of forming thereof

Communication system and codec method based on deep learning and kn...

PoP device

Switching method for multiple antenna arrays and electronic device...

Fan-out package and methods of forming thereof

Fan-out package and methods of forming thereof

PoP device

Fan-out package and methods of forming thereof

Method of packaging a semiconductor device

Packaged semiconductor device with a molding compound and a method...

Drive method to reduce power dissipation for flat panel display

Submount-holder for flip chip package

Patents Applicationslast 30 patents

Fan-Out Package and Methods of Forming Thereof

COMMUNICATION SYSTEM AND CODEC METHOD BASED ON DEEP LEARNING AND KN...

Fan-Out Package and Methods of Forming Thereof

PoP Device

Fan-Out Package and Methods of Forming Thereof

Fan-Out Package and Methods of Forming Thereof

METHOD OF PACKAGING A SEMICONDUCTOR DEVICE

PoP Device

PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF PACKAGING THE SEMICONDU...

Drive method to reduce power dissipation for flat panel display and...